ATE528368T1 - Verbesserte strukturelle haftmaterialien - Google Patents

Verbesserte strukturelle haftmaterialien

Info

Publication number
ATE528368T1
ATE528368T1 AT08762216T AT08762216T ATE528368T1 AT E528368 T1 ATE528368 T1 AT E528368T1 AT 08762216 T AT08762216 T AT 08762216T AT 08762216 T AT08762216 T AT 08762216T AT E528368 T1 ATE528368 T1 AT E528368T1
Authority
AT
Austria
Prior art keywords
aspect ratio
adhesive materials
structural adhesive
improved structural
adhesive material
Prior art date
Application number
AT08762216T
Other languages
English (en)
Inventor
Ian Aspin
Marine Godot
Original Assignee
Hexcel Composites Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hexcel Composites Ltd filed Critical Hexcel Composites Ltd
Application granted granted Critical
Publication of ATE528368T1 publication Critical patent/ATE528368T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/249933—Fiber embedded in or on the surface of a natural or synthetic rubber matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/249933—Fiber embedded in or on the surface of a natural or synthetic rubber matrix
    • Y10T428/249937—Fiber is precoated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249924—Noninterengaged fiber-containing paper-free web or sheet which is not of specified porosity
    • Y10T428/24994—Fiber embedded in or on the surface of a polymeric matrix
    • Y10T428/249948—Fiber is precoated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AT08762216T 2007-06-01 2008-06-02 Verbesserte strukturelle haftmaterialien ATE528368T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0710425A GB0710425D0 (en) 2007-06-01 2007-06-01 Improved structural adhesive materials
PCT/GB2008/001858 WO2008146014A2 (en) 2007-06-01 2008-06-02 Improved structural adhesive materials

Publications (1)

Publication Number Publication Date
ATE528368T1 true ATE528368T1 (de) 2011-10-15

Family

ID=38289635

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08762216T ATE528368T1 (de) 2007-06-01 2008-06-02 Verbesserte strukturelle haftmaterialien

Country Status (6)

Country Link
US (1) US8840813B2 (de)
EP (3) EP2152831B1 (de)
AT (1) ATE528368T1 (de)
ES (1) ES2375318T3 (de)
GB (1) GB0710425D0 (de)
WO (1) WO2008146014A2 (de)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008020441A1 (de) * 2008-04-23 2009-10-29 Merck Patent Gmbh Klebstoff
KR100964561B1 (ko) 2009-06-01 2010-06-21 박기호 도전성 점착제 조성물
BR112012000203B1 (pt) * 2009-06-12 2020-01-28 Lord Corp método para proteção de um substrato contra relâmpagos
NO333507B1 (no) * 2009-06-22 2013-06-24 Condalign As Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand
KR101770007B1 (ko) 2009-11-06 2017-08-30 쓰리엠 이노베이티브 프로퍼티즈 컴파니 비할로겐화된 경화제를 갖는 유전체 재료
KR101305072B1 (ko) * 2009-12-30 2013-09-11 제일모직주식회사 탄소 섬유상 금속 복합체 및 그 제조방법
KR101307378B1 (ko) * 2009-12-31 2013-09-11 제일모직주식회사 전자파 차폐 특성이 우수한 열가소성 수지 조성물
FI2633746T3 (fi) * 2010-10-26 2023-07-24 Henkel Ag & Co Kgaa Piirilevytasoiseen EMI-suojaukseen tarkoitettu komposiittikalvo
US8796361B2 (en) 2010-11-19 2014-08-05 Ppg Industries Ohio, Inc. Adhesive compositions containing graphenic carbon particles
US20140150970A1 (en) 2010-11-19 2014-06-05 Ppg Industries Ohio, Inc. Structural adhesive compositions
JP2013058471A (ja) * 2011-07-29 2013-03-28 Giga Solar Materials Corp 導電性組成物および製造法
CN102903414A (zh) * 2011-07-29 2013-01-30 硕禾电子材料股份有限公司 导电组合物和用于太阳能电池片的导电组合物
US9546100B2 (en) * 2011-08-29 2017-01-17 Purdue Research Foundation Continuous-flow solar ultraviolet disinfection system for drinking water
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
CN102433098B (zh) * 2011-09-19 2013-10-30 常州合润新材料科技有限公司 一种填充石墨烯各向同性高性能导热胶粘剂及制备方法
JP5872440B2 (ja) * 2012-02-13 2016-03-01 Ｄｏｗａエレクトロニクス株式会社 球状銀粉およびその製造方法
KR101658301B1 (ko) * 2012-05-03 2016-09-20 피피지 인더스트리즈 오하이오 인코포레이티드 그래핀계 탄소 입자를 포함하는 접착제 조성물
DE102012207462A1 (de) * 2012-05-04 2013-11-07 Tesa Se Dreidimensional elektrisch leitfähige Klebstofffolie
GB2510133B (en) * 2013-01-24 2017-08-30 Bae Systems Plc Conductive bonded composites
AU2013200685B2 (en) * 2013-02-08 2015-08-06 Bower Aero Pty Ltd Adhesive and method of manufacturing same
CA2914429A1 (en) * 2013-06-05 2014-12-11 Hybrid Components And Coatings Llc Shield assembly for protecting spacecraft
US9334386B2 (en) * 2013-09-04 2016-05-10 Alfaisal University Antimicrobial polymer-graphene-silver nanocomposite
TWI480357B (zh) 2013-12-17 2015-04-11 財團法人工業技術研究院 導電膠組成物與電極的形成方法
JP6327550B2 (ja) * 2014-01-07 2018-05-23 パナソニックＩｐマネジメント株式会社 金属部材用接着剤組成物とこれを用いた熱可塑性樹脂被覆金属部材
JP6383183B2 (ja) * 2014-06-03 2018-08-29 太陽インキ製造株式会社 導電性接着剤およびそれを用いた電子部品
CN104130735B (zh) * 2014-07-22 2016-01-06 深圳市华星光电技术有限公司 石墨烯球导电胶的制备方法及该石墨烯球导电胶
CN106575536B (zh) * 2014-08-14 2019-03-15 克雷托兹股份有限公司 传导性复合物及其制备方法
CN104262953B (zh) * 2014-08-21 2016-06-29 巨石集团有限公司 一种石墨烯涂覆玻璃纤维增强树脂基复合材料及制备方法
US10213984B2 (en) 2014-09-22 2019-02-26 Cytec Industries Inc. Composite materials with high Z-direction electrical conductivity
CN106793985B (zh) * 2014-10-07 2020-11-10 史莱福灵有限公司 具有由填充的smc和/或bmc材料构成的屏蔽器件的旋转式传输器
EP3064560B1 (de) 2015-03-05 2022-05-04 Henkel AG & Co. KGaA Thermisch leitfähiger Klebstoff
CN104774573B (zh) * 2015-03-30 2019-04-23 中国电子科技集团公司第三十八研究所 一种含石墨烯的高性能导电银胶及其制备方法
US9963619B2 (en) 2015-11-24 2018-05-08 Orbital Atk, Inc. Electrically conductive adhesives, assemblies including the electrically conductive adhesives, and related methods
CN108291076A (zh) * 2015-12-24 2018-07-17 株式会社钟化 树脂组合物、使用了其的半固化性热传导膜、电路基板和粘接片
US20180065327A1 (en) * 2016-04-18 2018-03-08 Littelfuse, Inc. Electromagnetic interference suppression device and method for manufacturing same
WO2018042701A1 (ja) * 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
CN108913057B (zh) * 2017-03-27 2023-11-10 昆山雅森电子材料科技有限公司 一种多层异向型导电布胶及其制作方法
US11168235B2 (en) 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
US20190070847A1 (en) * 2017-06-07 2019-03-07 Sustainable Solutions International Llc Anilox cleaning blanket
CN107722932B (zh) * 2017-10-24 2020-11-27 浙江理工大学 一种碳/聚苯胺吸波微球的制备方法
CN109843029B (zh) * 2017-11-29 2021-05-25 深圳光启岗达创新科技有限公司 吸波复合材料及其制备方法
CN108284647B (zh) * 2018-01-24 2020-12-22 河南蓝翎环科防水材料有限公司 具有自愈性、自粘性的防水卷材及防水结构
KR20240069825A (ko) * 2018-05-16 2024-05-20 헨켈 아게 운트 코. 카게아아 다이 부착을 위한 경화성 접착제 조성물
WO2020076806A1 (en) * 2018-10-10 2020-04-16 Global Graphene Group, Inc. Highly conductive graphitic thick films and method of production
US12187870B2 (en) * 2020-01-27 2025-01-07 The University Of Akron Electrically conductive polymer adhesives with complex dimensional filters
CN114296287A (zh) * 2020-09-22 2022-04-08 广州奥翼电子科技股份有限公司 一种固态电泳显示薄膜材料和显示装置
CN114296286A (zh) * 2020-09-22 2022-04-08 广州奥翼电子科技股份有限公司 一种固态电泳显示薄膜材料和显示装置
US20230117613A1 (en) * 2021-10-18 2023-04-20 Ving Dee Pu Carbon Graphene Compound Additive to Eliminate ESD and EMI, and Also Manipulate Dielectric Constant
JP7750267B2 (ja) * 2022-11-30 2025-10-07 Ｊｆｅスチール株式会社 パネル部品用接合構造、及びパネル部品の取付け方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4740657A (en) * 1986-02-14 1988-04-26 Hitachi, Chemical Company, Ltd Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained
US5240761A (en) 1988-08-29 1993-08-31 Minnesota Mining And Manufacturing Company Electrically conductive adhesive tape
US5620795A (en) 1993-11-10 1997-04-15 Minnesota Mining And Manufacturing Company Adhesives containing electrically conductive agents
WO1996024938A1 (en) * 1995-02-08 1996-08-15 Hitachi Chemical Co., Ltd. Composite conductive powder, conductive paste, method of producing conductive paste, electric circuit and method of fabricating electric circuit
US5840215A (en) * 1996-12-16 1998-11-24 Shell Oil Company Anisotropic conductive adhesive compositions
US6592986B1 (en) 1998-05-26 2003-07-15 Mitsui Takeda Chemicals Inc. Material for molding thermosetting resin sheet, production process, and molded product
US6533963B1 (en) * 1999-02-12 2003-03-18 Robert A. Schleifstein Electrically conductive flexible compositions, and materials and methods for making same
US20070241303A1 (en) * 1999-08-31 2007-10-18 General Electric Company Thermally conductive composition and method for preparing the same
US6909100B2 (en) * 2002-07-25 2005-06-21 Ii-Vi Incorporated Radiation detector assembly

Also Published As

Publication number Publication date
WO2008146014A2 (en) 2008-12-04
EP2295513A2 (de) 2011-03-16
EP2152831B1 (de) 2011-10-12
EP2295514A3 (de) 2018-01-17
EP2152831A2 (de) 2010-02-17
EP2295513A3 (de) 2018-01-17
ES2375318T3 (es) 2012-02-28
WO2008146014A3 (en) 2009-06-04
GB0710425D0 (en) 2007-07-11
EP2295514A2 (de) 2011-03-16
US20100276645A1 (en) 2010-11-04
US8840813B2 (en) 2014-09-23

Similar Documents

Publication Publication Date Title
ATE528368T1 (de) Verbesserte strukturelle haftmaterialien
NZ590864A (en) Compositions comprising very low density polyethylene, ethylene acrylic acid copolymer and thermoplastic starch
ATE528519T1 (de) Schraube
ATE514744T1 (de) Artikel mit barriereeigenschaft
ATE521661T1 (de) Elektretartikel mit hohem fluorsättigungsverhältnis
SG155191A1 (en) Particulate water-absorbing agent with water-absorbing resin as main component, method for production of the same, and absorbing article
ATE324410T1 (de) Laserbeschriftbare formmassen
NZ595557A (en) Novel composite materials comprising a thermoplastic matrix polymer and wood particles
ATE494127T1 (de) Zusammensetzung
DE502008002825D1 (de) POLYESTERMISCHUNG MIT VERBESSERTER FLIEßFÄHIGKEIT UND GUTEN MECHANISCHEN EIGENSCHAFTEN
ATE480589T1 (de) Polyolefinverbindungen mit verbesserten eigenschaften
TW200641084A (en) Pressure-sensitive adhesive tape and pressure-sensitive adhesive composition
ATE547129T1 (de) Multimodale formgedächtnis-polymere
TW200706904A (en) Non-birefringent poptical resin material and optical member
TR201906664T4 (tr) Doymuş polimer içerikli izosorbid içeren reçine kompozisyonu.
PT1560879E (pt) Processo para a preparacao de aditivos de nanocomposito com delaminacao melhorada em polimeros
TW200609279A (en) Self-adhesive prepreg
AR058826A1 (es) Composiciones de polietileno
TW200641028A (en) Resin composition for optical materials
DE602004019083D1 (de) Sauerstoffbarriereformulierungen
ATE533814T1 (de) Modifizierte olefinpolymere
DE602006015466D1 (de) Thermoplastische zusammensetzung mit schwachem glanz
TW200617045A (en) Optical sheet form thermoplastic resin molded product
TW200710165A (en) Reactive monomer and resin composition including them
ATE478125T1 (de) Reversible thermochromische zusammensetzungen

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 2152831

Country of ref document: EP