ATE524956T1 - Verfahren zum verarbeiten eines dünnfilmsubstrats - Google Patents
Verfahren zum verarbeiten eines dünnfilmsubstratsInfo
- Publication number
- ATE524956T1 ATE524956T1 AT04728728T AT04728728T ATE524956T1 AT E524956 T1 ATE524956 T1 AT E524956T1 AT 04728728 T AT04728728 T AT 04728728T AT 04728728 T AT04728728 T AT 04728728T AT E524956 T1 ATE524956 T1 AT E524956T1
- Authority
- AT
- Austria
- Prior art keywords
- thin film
- vias
- film substrate
- order
- allocated
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0041—Etching of the substrate by chemical or physical means by plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K2211/00—Thermometers based on nanotechnology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/002—Etching of the substrate by chemical or physical means by liquid chemical etching
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Spectrometry And Color Measurement (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SE0301238A SE526006C2 (sv) | 2003-04-29 | 2003-04-29 | Behandlat tunnfilmssubstrat |
PCT/SE2004/000606 WO2004098256A1 (en) | 2003-04-29 | 2004-04-21 | A method for processing a thin film substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE524956T1 true ATE524956T1 (de) | 2011-09-15 |
Family
ID=20291147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04728728T ATE524956T1 (de) | 2003-04-29 | 2004-04-21 | Verfahren zum verarbeiten eines dünnfilmsubstrats |
Country Status (10)
Country | Link |
---|---|
US (1) | US7176578B2 (de) |
EP (1) | EP1621054B1 (de) |
JP (1) | JP4359657B2 (de) |
KR (1) | KR101055600B1 (de) |
CN (1) | CN100521876C (de) |
AT (1) | ATE524956T1 (de) |
AU (1) | AU2004234763B2 (de) |
CA (1) | CA2523971A1 (de) |
SE (1) | SE526006C2 (de) |
WO (1) | WO2004098256A1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006069843A1 (de) * | 2004-12-28 | 2006-07-06 | Siemens Home And Office Communication Devices Gmbh & Co. Kg | Halbzeug sowie trägerkomponente auf der basis dieses halbzeugs |
JP4344954B2 (ja) | 2006-10-03 | 2009-10-14 | セイコーエプソン株式会社 | 素子基板の製造方法 |
WO2008063125A1 (en) * | 2006-11-20 | 2008-05-29 | Senseair Ab | A process for treating a flexible thin film substrate, in the form of a dielectric plastic foil, and a thin film substrate thus formed |
US20090162666A1 (en) * | 2007-12-20 | 2009-06-25 | Palo Alto Research Center Incorporated | Curable flexible material |
US20090223700A1 (en) * | 2008-03-05 | 2009-09-10 | Honeywell International Inc. | Thin flexible circuits |
US7884488B2 (en) * | 2008-05-01 | 2011-02-08 | Qimonda Ag | Semiconductor component with improved contact pad and method for forming the same |
US8026567B2 (en) * | 2008-12-22 | 2011-09-27 | Taiwan Semiconductor Manufactuirng Co., Ltd. | Thermoelectric cooler for semiconductor devices with TSV |
JP2011233714A (ja) * | 2010-04-27 | 2011-11-17 | Canon Inc | 半導体素子 |
US20150035162A1 (en) * | 2013-08-02 | 2015-02-05 | Qualcomm Incorporated | Inductive device that includes conductive via and metal layer |
SE541450C2 (en) | 2018-02-19 | 2019-10-08 | Jondetech Sensors Ab Publ | Overheating alarm device for cell phone charger or similar device |
SE543173C2 (en) | 2018-07-02 | 2020-10-20 | Jondetech Sensors Ab Publ | Adapter device with infrared sensor and heat protection switch |
US20200361782A1 (en) * | 2019-05-16 | 2020-11-19 | Sciosense B.V. | Photo-annealing in Metal Oxide Sensors |
US11662109B2 (en) | 2019-06-05 | 2023-05-30 | Carrier Corporation | Enclosure for gas detector |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SE521415C2 (sv) * | 1998-02-17 | 2003-10-28 | Hans Goeran Evald Martin | Metod för att framställa en gassensortillhörig detektor, samt en detektor framställd enligt metoden |
JP3655242B2 (ja) * | 2002-01-04 | 2005-06-02 | 株式会社東芝 | 半導体パッケージ及び半導体実装装置 |
US6891266B2 (en) * | 2002-02-14 | 2005-05-10 | Mia-Com | RF transition for an area array package |
TWI256719B (en) * | 2002-03-06 | 2006-06-11 | Via Tech Inc | Semiconductor device package module and manufacturing method thereof |
-
2003
- 2003-04-29 SE SE0301238A patent/SE526006C2/sv not_active IP Right Cessation
-
2004
- 2004-04-21 CN CNB2004800116430A patent/CN100521876C/zh not_active Expired - Lifetime
- 2004-04-21 CA CA002523971A patent/CA2523971A1/en not_active Abandoned
- 2004-04-21 AT AT04728728T patent/ATE524956T1/de not_active IP Right Cessation
- 2004-04-21 KR KR1020057020583A patent/KR101055600B1/ko active IP Right Grant
- 2004-04-21 JP JP2006508027A patent/JP4359657B2/ja not_active Expired - Fee Related
- 2004-04-21 AU AU2004234763A patent/AU2004234763B2/en not_active Expired
- 2004-04-21 WO PCT/SE2004/000606 patent/WO2004098256A1/en active Application Filing
- 2004-04-21 EP EP04728728A patent/EP1621054B1/de not_active Expired - Lifetime
-
2005
- 2005-10-26 US US11/258,763 patent/US7176578B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20060071323A1 (en) | 2006-04-06 |
KR101055600B1 (ko) | 2011-08-09 |
SE0301238D0 (sv) | 2003-04-29 |
CN1781350A (zh) | 2006-05-31 |
EP1621054B1 (de) | 2011-09-14 |
US7176578B2 (en) | 2007-02-13 |
CN100521876C (zh) | 2009-07-29 |
AU2004234763A1 (en) | 2004-11-11 |
KR20060016761A (ko) | 2006-02-22 |
JP2007529101A (ja) | 2007-10-18 |
WO2004098256A1 (en) | 2004-11-11 |
EP1621054A1 (de) | 2006-02-01 |
JP4359657B2 (ja) | 2009-11-04 |
CA2523971A1 (en) | 2004-11-11 |
SE0301238L (sv) | 2004-10-30 |
SE526006C2 (sv) | 2005-06-14 |
AU2004234763B2 (en) | 2008-07-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |