ATE522310T1 - Flüssigkeitsmikroventil und verfahren zum ultrasonen verbinden - Google Patents

Flüssigkeitsmikroventil und verfahren zum ultrasonen verbinden

Info

Publication number
ATE522310T1
ATE522310T1 AT01905273T AT01905273T ATE522310T1 AT E522310 T1 ATE522310 T1 AT E522310T1 AT 01905273 T AT01905273 T AT 01905273T AT 01905273 T AT01905273 T AT 01905273T AT E522310 T1 ATE522310 T1 AT E522310T1
Authority
AT
Austria
Prior art keywords
bonding process
improved
ultrasonic bonding
ultrasonic
print head
Prior art date
Application number
AT01905273T
Other languages
English (en)
Inventor
Hue P Le
Hoi P Le
Thanh P Le
Linh B Tran
Original Assignee
Nextjet Llc
Hue P Le
Hoi P Le
Thanh P Le
Linh B Tran
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nextjet Llc, Hue P Le, Hoi P Le, Thanh P Le, Linh B Tran filed Critical Nextjet Llc
Application granted granted Critical
Publication of ATE522310T1 publication Critical patent/ATE522310T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/161—Production of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2002/14306—Flow passage between manifold and chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14419—Manifold
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/494—Fluidic or fluid actuated device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
AT01905273T 2000-01-31 2001-01-31 Flüssigkeitsmikroventil und verfahren zum ultrasonen verbinden ATE522310T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/495,071 US6464324B1 (en) 2000-01-31 2000-01-31 Microfluid device and ultrasonic bonding process
PCT/US2001/003145 WO2001054851A2 (en) 2000-01-31 2001-01-31 Microfluid device and ultrasonic bonding process

Publications (1)

Publication Number Publication Date
ATE522310T1 true ATE522310T1 (de) 2011-09-15

Family

ID=23967150

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01905273T ATE522310T1 (de) 2000-01-31 2001-01-31 Flüssigkeitsmikroventil und verfahren zum ultrasonen verbinden

Country Status (8)

Country Link
US (4) US6464324B1 (de)
EP (1) EP1212164B1 (de)
JP (1) JP4795601B2 (de)
KR (1) KR100773257B1 (de)
CN (3) CN100556697C (de)
AT (1) ATE522310T1 (de)
AU (1) AU2001233172A1 (de)
WO (1) WO2001054851A2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6926382B2 (en) 2002-04-25 2005-08-09 Brother Kogyo Kabushiki Kaisha Ink-jet head and ink-jet printer
GB2388741B (en) * 2002-05-17 2004-06-30 Morgan Crucible Co Transducer assembly
US7052117B2 (en) * 2002-07-03 2006-05-30 Dimatix, Inc. Printhead having a thin pre-fired piezoelectric layer
JP2004114558A (ja) * 2002-09-27 2004-04-15 Brother Ind Ltd インクジェットプリンタヘッド及びその製造方法
US7562428B2 (en) * 2002-09-24 2009-07-21 Brother Kogyo Kabushiki Kaisha Manufacturing an ink jet head
US20040115830A1 (en) * 2002-09-25 2004-06-17 Igor Touzov Components for nano-scale Reactor
US8491076B2 (en) 2004-03-15 2013-07-23 Fujifilm Dimatix, Inc. Fluid droplet ejection devices and methods
US7281778B2 (en) 2004-03-15 2007-10-16 Fujifilm Dimatix, Inc. High frequency droplet ejection device and method
US7293359B2 (en) * 2004-04-29 2007-11-13 Hewlett-Packard Development Company, L.P. Method for manufacturing a fluid ejection device
US7387370B2 (en) * 2004-04-29 2008-06-17 Hewlett-Packard Development Company, L.P. Microfluidic architecture
US7420317B2 (en) * 2004-10-15 2008-09-02 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
US7388319B2 (en) * 2004-10-15 2008-06-17 Fujifilm Dimatix, Inc. Forming piezoelectric actuators
JP5004806B2 (ja) 2004-12-30 2012-08-22 フジフィルム ディマティックス， インコーポレイテッド インクジェットプリント法
US7694376B2 (en) * 2005-09-09 2010-04-13 Chunghwa Picture Tubes, Ltd. Cleansing module for fluid-supply apparatus
US7988247B2 (en) 2007-01-11 2011-08-02 Fujifilm Dimatix, Inc. Ejection of drops having variable drop size from an ink jet printer
GB0702092D0 (en) * 2007-02-02 2007-03-14 Fracture Code Corp Aps Graphic Code Application Apparatus and Method
US7681991B2 (en) * 2007-06-04 2010-03-23 Lexmark International, Inc. Composite ceramic substrate for micro-fluid ejection head
JP2008307710A (ja) * 2007-06-12 2008-12-25 Canon Inc インクジェット記録ヘッド、インクジェット記録ヘッドの製造方法およびインクジェット記録ヘッドの実装ツール
JP4424520B2 (ja) * 2007-08-27 2010-03-03 セイコーエプソン株式会社 圧電素子およびその製造方法、アクチュエータ、並びに、液体噴射ヘッド
US8563352B2 (en) * 2008-02-05 2013-10-22 Gtat Corporation Creation and translation of low-relief texture for a photovoltaic cell
US8129613B2 (en) * 2008-02-05 2012-03-06 Twin Creeks Technologies, Inc. Photovoltaic cell comprising a thin lamina having low base resistivity and method of making
US8481845B2 (en) * 2008-02-05 2013-07-09 Gtat Corporation Method to form a photovoltaic cell comprising a thin lamina
DE102008044370A1 (de) * 2008-12-05 2010-06-10 Robert Bosch Gmbh Vorrichtung und Verfahren zum Verbinden von Bauteilen mittels Ultraschall
US20100187667A1 (en) * 2009-01-28 2010-07-29 Fujifilm Dimatix, Inc. Bonded Microelectromechanical Assemblies
US20100208017A1 (en) * 2009-02-19 2010-08-19 Black Dot Technology, Inc. Imaging module for hot melt wax ink jet printer
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8349626B2 (en) * 2010-03-23 2013-01-08 Gtat Corporation Creation of low-relief texture for a photovoltaic cell
CN102407668A (zh) * 2010-09-20 2012-04-11 研能科技股份有限公司 喷墨单元的制造方法
US8465659B2 (en) * 2011-01-21 2013-06-18 Xerox Corporation Polymer layer removal on pzt arrays using a plasma etch
CN102180034B (zh) * 2011-03-14 2012-09-19 易程(苏州)新技术股份有限公司 一种磁读写制票机的热敏打印头在线清洁方法
US8585183B2 (en) * 2011-03-22 2013-11-19 Xerox Corporation High density multilayer interconnect for print head
US8584331B2 (en) * 2011-09-14 2013-11-19 Xerox Corporation In situ flexible circuit embossing to form an electrical interconnect
US8585185B2 (en) * 2011-09-22 2013-11-19 Xerox Corporation High density electrical interconnect using limited density flex circuits
US8919915B2 (en) * 2012-02-21 2014-12-30 Xerox Corporation Ultrasonic laminating of materials for ink jet printheads
US8857021B2 (en) * 2012-06-15 2014-10-14 Xerox Corporation Laser welded bonding pads for piezoelectric print heads
EP2849950B1 (de) 2012-07-03 2019-01-23 Hewlett-Packard Development Company, L.P. Druckkopfmodul
US10022968B2 (en) 2013-10-28 2018-07-17 Illinois Tool Works Inc. Printing plate assembly and method for an ink jet print head assembly
US9525119B2 (en) * 2013-12-11 2016-12-20 Fujifilm Dimatix, Inc. Flexible micromachined transducer device and method for fabricating same
CN105314591B (zh) * 2014-05-26 2017-05-24 上海量子绘景电子股份有限公司 一种微纳结构封闭管道及其制备方法
US10052713B2 (en) * 2015-08-20 2018-08-21 Ultex Corporation Bonding method and bonded structure
JP6696665B2 (ja) * 2015-10-25 2020-05-20 農工大ティー・エル・オー株式会社 超音波半田付け方法および超音波半田付け装置
US20170334016A1 (en) * 2016-05-20 2017-11-23 GM Global Technology Operations LLC Method and apparatus to form a workpiece employing vibration welding
CN109317813A (zh) * 2018-12-07 2019-02-12 上海骄成机电设备有限公司 一种超声波焊头
CN114728367B (zh) * 2019-11-05 2023-09-19 崇德超声波有限公司 利用接合偶定位检测的超声波焊接装置
CN114178639B (zh) * 2022-02-17 2022-05-17 太原理工大学 一种用于铍窗和不锈钢基座的脉冲激光钎焊封接方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55128396A (en) 1979-03-26 1980-10-04 Packer Eng Ass Zn alloy wax and its use
JPS5818274A (ja) 1981-07-24 1983-02-02 Sharp Corp インクジエツトヘツド装置
JPS6167584A (ja) * 1984-09-10 1986-04-07 Konishiroku Photo Ind Co Ltd 超音波溶接方法及びその装置
DE3804165A1 (de) 1988-02-11 1989-08-24 Olympia Aeg Verfahren zum bestuecken eines tintenstrahldruckkopfes mit piezokristallen
US4883219A (en) 1988-09-01 1989-11-28 Anderson Jeffrey J Manufacture of ink jet print heads by diffusion bonding and brazing
JPH0817189B2 (ja) * 1989-01-13 1996-02-21 三菱電機株式会社 半導体装置の製造方法
US5087930A (en) * 1989-11-01 1992-02-11 Tektronix, Inc. Drop-on-demand ink jet print head
US5186378A (en) * 1991-09-30 1993-02-16 Texas Instruments Incorporated Method and apparatus for transducer heating in low temperature bonding
US5455615A (en) 1992-06-04 1995-10-03 Tektronix, Inc. Multiple-orifice drop-on-demand ink jet print head having improved purging and jetting performance
US5650810A (en) * 1992-12-03 1997-07-22 Brother Kogyo Kabushiki Kaisha Ink jet print head having a manifold wall portion and method of producing the same by injection molding
JP3106026B2 (ja) 1993-02-23 2000-11-06 日本碍子株式会社 圧電／電歪アクチュエータ
EP0613765B1 (de) 1993-03-02 1999-12-15 CeramTec AG Innovative Ceramic Engineering Verfahren zum Herstellen von unterteilbaren Platten aus sprödem Material mit hoher Genauigkeit
US5541469A (en) * 1993-04-14 1996-07-30 Murata Manufacturing Co., Ltd. Resonator utilizing width expansion mode
JPH06320738A (ja) 1993-05-14 1994-11-22 Hitachi Koki Co Ltd インクジェットプリンタ用プリントヘッドの接合方法
US6111338A (en) * 1993-05-28 2000-08-29 Matsushita Electric Industrial Co., Ltd. Acceleration sensor and method for producing the same
US5689291A (en) * 1993-07-30 1997-11-18 Tektronix, Inc. Method and apparatus for producing dot size modulated ink jet printing
EP0692383B1 (de) * 1994-07-11 2005-06-15 Kabushiki Kaisha Toshiba Tintenstrahlaufzeichnungsgerät
JPH0825625A (ja) * 1994-07-12 1996-01-30 Nec Corp インクジェット記録ヘッドおよびその製造方法
EP0694978B1 (de) * 1994-07-26 1998-08-05 Nec Corporation Piezoelektrischer Transformator
US5748214A (en) * 1994-08-04 1998-05-05 Seiko Epson Corporation Ink jet recording head
JP3578286B2 (ja) 1994-12-16 2004-10-20 日立プリンティングソリューションズ株式会社 金属部材の接合方法、Ａｕ−Ｓｎろう付け用インサート材、インクジェットプリンタ
JP3366146B2 (ja) * 1995-03-06 2003-01-14 セイコーエプソン株式会社 インク噴射ヘッド
JPH08267744A (ja) * 1995-03-31 1996-10-15 Minolta Co Ltd インクジェット記録装置
JP3613302B2 (ja) 1995-07-26 2005-01-26 セイコーエプソン株式会社 インクジェット式記録ヘッド
JP3465427B2 (ja) 1995-07-28 2003-11-10 ソニー株式会社 圧電アクチュエーター及びその製造方法
JP3123435B2 (ja) * 1996-07-29 2001-01-09 株式会社村田製作所 圧電型電気音響変換器
WO1998041354A1 (en) * 1997-03-17 1998-09-24 Hitachi, Ltd. Method of solid-phase welding members
JPH10291082A (ja) * 1997-04-16 1998-11-04 Showa Alum Corp 積層複合材の接合方法
JP4026885B2 (ja) * 1997-05-16 2007-12-26 キヤノン株式会社 圧電素子および振動型駆動装置
US5921460A (en) * 1997-06-05 1999-07-13 Ford Motor Company Method of soldering materials supported on low-melting substrates
JP3697861B2 (ja) * 1997-10-23 2005-09-21 セイコーエプソン株式会社 インクジェットヘッド及びその製造方法
US6362844B1 (en) * 1997-10-23 2002-03-26 Acer Peripherals, Inc. Structure of a piezoelectric ink-jet printer head

Also Published As

Publication number Publication date
CN100563974C (zh) 2009-12-02
US6530653B2 (en) 2003-03-11
EP1212164B1 (de) 2011-08-31
WO2001054851A2 (en) 2001-08-02
KR20010113864A (ko) 2001-12-28
US6783213B2 (en) 2004-08-31
JP2003520685A (ja) 2003-07-08
US20030088981A1 (en) 2003-05-15
US6928731B2 (en) 2005-08-16
US6464324B1 (en) 2002-10-15
CN100556697C (zh) 2009-11-04
CN1234494C (zh) 2006-01-04
US20020060724A1 (en) 2002-05-23
AU2001233172A1 (en) 2001-08-07
CN1927565A (zh) 2007-03-14
EP1212164A2 (de) 2002-06-12
CN1364106A (zh) 2002-08-14
JP4795601B2 (ja) 2011-10-19
WO2001054851A3 (en) 2002-03-14
CN1923518A (zh) 2007-03-07
US20040237304A1 (en) 2004-12-02
KR100773257B1 (ko) 2007-11-05

Similar Documents

Publication Publication Date Title
ATE522310T1 (de) Flüssigkeitsmikroventil und verfahren zum ultrasonen verbinden
ATE242695T1 (de) Tröpfchenaufzeichnungsgerät
US7681971B2 (en) Ink jet apparatus
EP0976560A3 (de) Tintenstrahlaufzeichnungskopf und diesen Kopf tragende Tintenstrahlaufzeichnungsvorrichtung
ATE311292T1 (de) Tintenstrahlaufzeichnungskopf
DE69928549D1 (de) Auf Abruf arbeitende Tintenstrahldruckvorrichtung, Druckverfahren und Herstellungsverfahren
DE60005111D1 (de) Tintenstrahldruckkopf und Tintenstrahlaufzeichnungsvorrichtung
TW200621513A (en) Droplet ejection head and droplet ejection apparatus
SG133440A1 (en) Ink jet recording head and manufacturing method therefor
EP1172217A3 (de) Tintenstrahlaufzeichnungskopf und Verfahren zu seiner Herstellung
DE60107917D1 (de) Tintenstrahlaufzeichnungskopf und Tintenstrahlaufzeichnungsapparat
DE60328271D1 (de) Flüssigkeitseinspritzkopf
JP2007152947A (ja) 液滴発生器
HK1037790A1 (en) Method of connecting electrode, narrow pitch connector, pitch changing device, micromachine, piezoelectric actuator, electrostatic actuator, inkjet head, ink-jet printer, liquid crystal device, and electronic device
ATE395188T1 (de) Tintenstrahlkopf und tintenstrahldrucker
DE60207622D1 (de) Tintenstrahlkopf, Herstellungsmethode dafür und Tintenstrahlaufzeichnungsgerät
DE3579070D1 (de) Geraet und methode zum antreiben von tintenstrahldruckern.
DE60031316D1 (de) Tintenstrahlaufzeichnungsvorrichtung
DE60016478D1 (de) Herstellungsverfahren für einen Tintenstrahlaufzeichnungskopf
DE60323422D1 (de) Flüssigkeitsausstosskopf
JP2007275884A (ja) ドロップジェネレータ
KR100637427B1 (ko) 노즐 막힘 방지용 잉크젯 헤드
US7143488B2 (en) Drop emitting apparatus
WO2001074590A1 (fr) Tete a jet d'encre multi-injecteur
JP3697861B2 (ja) インクジェットヘッド及びその製造方法

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties