ATE520971T1 - Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen - Google Patents
Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilenInfo
- Publication number
- ATE520971T1 ATE520971T1 AT08161255T AT08161255T ATE520971T1 AT E520971 T1 ATE520971 T1 AT E520971T1 AT 08161255 T AT08161255 T AT 08161255T AT 08161255 T AT08161255 T AT 08161255T AT E520971 T1 ATE520971 T1 AT E520971T1
- Authority
- AT
- Austria
- Prior art keywords
- electrical component
- solderability
- contact portion
- contact
- solder
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
- G01N13/02—Investigating surface tension of liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06112413A EP1845360B1 (de) | 2006-04-10 | 2006-04-10 | Vorrichtung und Verfahren zur Lötbarkeitsmessung von elektrischen Bauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE520971T1 true ATE520971T1 (de) | 2011-09-15 |
Family
ID=37075534
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06112413T ATE410671T1 (de) | 2006-04-10 | 2006-04-10 | Vorrichtung und verfahren zur lötbarkeitsmessung von elektrischen bauelementen |
| AT08161255T ATE520971T1 (de) | 2006-04-10 | 2006-04-10 | Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT06112413T ATE410671T1 (de) | 2006-04-10 | 2006-04-10 | Vorrichtung und verfahren zur lötbarkeitsmessung von elektrischen bauelementen |
Country Status (4)
| Country | Link |
|---|---|
| EP (2) | EP1978347B1 (de) |
| AT (2) | ATE410671T1 (de) |
| CA (1) | CA2583853C (de) |
| DE (1) | DE602006003067D1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8910775B2 (en) * | 2012-08-10 | 2014-12-16 | Asm Technology Singapore Pte Ltd | Transfer apparatus for transferring electronic devices |
| CN113776992B (zh) * | 2021-08-27 | 2024-02-23 | 河北光兴半导体技术有限公司 | 测试熔体表面张力的方法 |
| CN114682948B (zh) * | 2022-03-04 | 2023-10-31 | 广东风华高新科技股份有限公司 | 片式元器件的可焊性测试方法、装置及系统 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6247292A (ja) | 1985-08-26 | 1987-02-28 | Victor Co Of Japan Ltd | 磁気記録再生方法 |
| JPH0772064B2 (ja) | 1989-11-17 | 1995-08-02 | オーチス エレベータ カンパニー | エレベーター用鉄塔昇降路 |
| JP3153884B2 (ja) * | 1991-09-11 | 2001-04-09 | ソニー株式会社 | クリームはんだのはんだ付け性測定装置 |
| JPH0772064A (ja) * | 1993-06-24 | 1995-03-17 | Sony Corp | 電子部品のハンダ付け性試験方法及び装置 |
| US6286368B1 (en) * | 2000-09-18 | 2001-09-11 | General Electric Company | Self-immersing wetting balance |
| JP4284873B2 (ja) * | 2001-02-27 | 2009-06-24 | ソニー株式会社 | はんだ付け性試験装置及びはんだ付け性試験方法 |
| US6612161B1 (en) * | 2002-07-23 | 2003-09-02 | Fidelica Microsystems, Inc. | Atomic force microscopy measurements of contact resistance and current-dependent stiction |
-
2006
- 2006-04-10 DE DE602006003067T patent/DE602006003067D1/de active Active
- 2006-04-10 AT AT06112413T patent/ATE410671T1/de not_active IP Right Cessation
- 2006-04-10 EP EP08161255A patent/EP1978347B1/de active Active
- 2006-04-10 AT AT08161255T patent/ATE520971T1/de not_active IP Right Cessation
- 2006-04-10 EP EP06112413A patent/EP1845360B1/de active Active
-
2007
- 2007-04-04 CA CA2583853A patent/CA2583853C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CA2583853C (en) | 2011-03-08 |
| CA2583853A1 (en) | 2007-10-10 |
| EP1978347B1 (de) | 2011-08-17 |
| DE602006003067D1 (de) | 2008-11-20 |
| EP1978347A3 (de) | 2008-12-17 |
| EP1845360B1 (de) | 2008-10-08 |
| EP1845360A1 (de) | 2007-10-17 |
| ATE410671T1 (de) | 2008-10-15 |
| EP1978347A2 (de) | 2008-10-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |