ATE520971T1 - Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen - Google Patents

Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen

Info

Publication number
ATE520971T1
ATE520971T1 AT08161255T AT08161255T ATE520971T1 AT E520971 T1 ATE520971 T1 AT E520971T1 AT 08161255 T AT08161255 T AT 08161255T AT 08161255 T AT08161255 T AT 08161255T AT E520971 T1 ATE520971 T1 AT E520971T1
Authority
AT
Austria
Prior art keywords
electrical component
solderability
contact portion
contact
solder
Prior art date
Application number
AT08161255T
Other languages
English (en)
Inventor
Denis Lahaie
Beverley H Christian
Original Assignee
Research In Motion Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research In Motion Ltd filed Critical Research In Motion Ltd
Application granted granted Critical
Publication of ATE520971T1 publication Critical patent/ATE520971T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02—Investigating surface tension of liquids
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
AT08161255T 2006-04-10 2006-04-10 Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen ATE520971T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP06112413A EP1845360B1 (de) 2006-04-10 2006-04-10 Vorrichtung und Verfahren zur Lötbarkeitsmessung von elektrischen Bauelementen

Publications (1)

Publication Number Publication Date
ATE520971T1 true ATE520971T1 (de) 2011-09-15

Family

ID=37075534

Family Applications (2)

Application Number Title Priority Date Filing Date
AT06112413T ATE410671T1 (de) 2006-04-10 2006-04-10 Vorrichtung und verfahren zur lötbarkeitsmessung von elektrischen bauelementen
AT08161255T ATE520971T1 (de) 2006-04-10 2006-04-10 Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AT06112413T ATE410671T1 (de) 2006-04-10 2006-04-10 Vorrichtung und verfahren zur lötbarkeitsmessung von elektrischen bauelementen

Country Status (4)

Country Link
EP (2) EP1978347B1 (de)
AT (2) ATE410671T1 (de)
CA (1) CA2583853C (de)
DE (1) DE602006003067D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8910775B2 (en) * 2012-08-10 2014-12-16 Asm Technology Singapore Pte Ltd Transfer apparatus for transferring electronic devices
CN113776992B (zh) * 2021-08-27 2024-02-23 河北光兴半导体技术有限公司 测试熔体表面张力的方法
CN114682948B (zh) * 2022-03-04 2023-10-31 广东风华高新科技股份有限公司 片式元器件的可焊性测试方法、装置及系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247292A (ja) 1985-08-26 1987-02-28 Victor Co Of Japan Ltd 磁気記録再生方法
JPH0772064B2 (ja) 1989-11-17 1995-08-02 オーチス エレベータ カンパニー エレベーター用鉄塔昇降路
JP3153884B2 (ja) * 1991-09-11 2001-04-09 ソニー株式会社 クリームはんだのはんだ付け性測定装置
JPH0772064A (ja) * 1993-06-24 1995-03-17 Sony Corp 電子部品のハンダ付け性試験方法及び装置
US6286368B1 (en) 2000-09-18 2001-09-11 General Electric Company Self-immersing wetting balance
JP4284873B2 (ja) 2001-02-27 2009-06-24 ソニー株式会社 はんだ付け性試験装置及びはんだ付け性試験方法
US6612161B1 (en) * 2002-07-23 2003-09-02 Fidelica Microsystems, Inc. Atomic force microscopy measurements of contact resistance and current-dependent stiction

Also Published As

Publication number Publication date
EP1978347A3 (de) 2008-12-17
EP1978347B1 (de) 2011-08-17
EP1978347A2 (de) 2008-10-08
CA2583853A1 (en) 2007-10-10
EP1845360A1 (de) 2007-10-17
ATE410671T1 (de) 2008-10-15
DE602006003067D1 (de) 2008-11-20
EP1845360B1 (de) 2008-10-08
CA2583853C (en) 2011-03-08

Similar Documents

Publication Publication Date Title
DE69931348D1 (de) Vorrichtung und verfahren zum schutz von optischen geräten unter rauhen betriebszuständen
MY147294A (en) A method and device for aligning components
TW200508630A (en) Method and equipment for inspecting electric characteristics of specimen
TW200951442A (en) Probe card inclination adjusting method and inclination detecting method
WO2010044005A3 (en) Method and device for determining the amount of magnetically labeled target components
MX2009009771A (es) Metodo de monitoreo y/o determinacion de la condicion de dispositivo de medicion de fuerza, y dispositivo de medicion de fuerza.
TW200801531A (en) Prober for electronic device testing on large area substrates
JP2003168707A5 (de)
SG129257A1 (en) A method for detecting missing components at electrical board test using optoelectronic fixture-mounted sensors
TW363131B (en) Test device, test assembly, method for testing and method for calibrating a test device
ATE520971T1 (de) Verfahren und vorrichtung zum testen der lötbarkeit von elektrischen bauteilen
KR950033507A (ko) Ic 측정시험장치 및 이것을 사용한 ic 측정시험방법
MY184538A (en) Resin sealing apparatus and method of detecting abnormality of resin sealing apparatus
WO2004077019A3 (en) Capillary rise technique for the assessment of the wettability of particulate surfaces
DE60024186D1 (de) Verfahren und Einrichtung zum Wiegen
WO2004072585A3 (en) Wafer bond strength evaluation apparatus
TW200500149A (en) Apparatus and method for substrate coating
TW200723415A (en) TCP handling apparatus
KR20150054295A (ko) 스크래치 테스트 장치 및 이를 이용한 박막의 접착력 측정 방법
DE69922205D1 (de) Verfahren und vorrichtung zur oberflächenprüfung
CN104458438A (zh) 金属管扭力测量装置
CN110836650A (zh) 一种红木家具的厚度测量装置
WO2009081357A3 (en) Pick and place tool grinding
TW200632344A (en) Electronic component testing device
JP7070475B2 (ja) 動摩擦係数計測装置

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties