ATE518244T1 - Wafer mit optischen steuermodulen in ic-feldern - Google Patents

Wafer mit optischen steuermodulen in ic-feldern

Info

Publication number
ATE518244T1
ATE518244T1 AT04801512T AT04801512T ATE518244T1 AT E518244 T1 ATE518244 T1 AT E518244T1 AT 04801512 T AT04801512 T AT 04801512T AT 04801512 T AT04801512 T AT 04801512T AT E518244 T1 ATE518244 T1 AT E518244T1
Authority
AT
Austria
Prior art keywords
ocm
fields
control module
field
wafer
Prior art date
Application number
AT04801512T
Other languages
English (en)
Inventor
Heimo Scheucher
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=34717252&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE518244(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE518244T1 publication Critical patent/ATE518244T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
AT04801512T 2003-12-23 2004-12-09 Wafer mit optischen steuermodulen in ic-feldern ATE518244T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP03104956 2003-12-23
PCT/IB2004/052724 WO2005064679A1 (en) 2003-12-23 2004-12-09 Wafer with optical control modules in ic fields

Publications (1)

Publication Number Publication Date
ATE518244T1 true ATE518244T1 (de) 2011-08-15

Family

ID=34717252

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04801512T ATE518244T1 (de) 2003-12-23 2004-12-09 Wafer mit optischen steuermodulen in ic-feldern

Country Status (7)

Country Link
US (1) US7456489B2 (de)
EP (1) EP1700341B1 (de)
JP (1) JP2007516619A (de)
KR (1) KR20060111611A (de)
CN (1) CN100477204C (de)
AT (1) ATE518244T1 (de)
WO (1) WO2005064679A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8415769B2 (en) * 2007-07-12 2013-04-09 Nxp B.V. Integrated circuits on a wafer and method for separating integrated circuits on a wafer
DE602008003128D1 (de) * 2007-07-12 2010-12-02 Nxp Bv Integrierte schaltungen auf einem wafer und verfahren zur herstellung integrierter schaltungen
US8349708B2 (en) * 2007-07-12 2013-01-08 Nxp B.V. Integrated circuits on a wafer and methods for manufacturing integrated circuits
US8600800B2 (en) 2008-06-19 2013-12-03 Societe Stationnement Urbain Developpements et Etudes (SUD SAS) Parking locator system including promotion distribution system
EP2510740B1 (de) 2009-12-11 2019-09-11 Stationnement Urbain Developpements et Etudes Bereitstellung von stadtdiensten mit mobilgeräten und einem sensornetz
US9749823B2 (en) 2009-12-11 2017-08-29 Mentis Services France Providing city services using mobile devices and a sensor network
US10942444B2 (en) 2019-05-01 2021-03-09 Nxp Usa, Inc. Optical control modules for integrated circuit device patterning and reticles and methods including the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5948924A (ja) * 1982-09-14 1984-03-21 Nec Corp 電子線露光用位置合せマ−ク
JPS5994418A (ja) 1982-11-19 1984-05-31 Nec Kyushu Ltd 半導体装置
JP4301584B2 (ja) * 1998-01-14 2009-07-22 株式会社ルネサステクノロジ レチクル、それを用いた露光装置、露光方法および半導体装置の製造方法
CN100347841C (zh) * 2001-02-27 2007-11-07 Nxp股份有限公司 具有过程控制组件的半导体晶片
US20030034489A1 (en) * 2001-08-16 2003-02-20 Broadcom Corporation Apparatus and method for a production testline to monitor CMOS SRAMs
US6974653B2 (en) * 2002-04-19 2005-12-13 Nikon Precision Inc. Methods for critical dimension and focus mapping using critical dimension test marks

Also Published As

Publication number Publication date
KR20060111611A (ko) 2006-10-27
US7456489B2 (en) 2008-11-25
EP1700341B1 (de) 2011-07-27
EP1700341A1 (de) 2006-09-13
US20070158798A1 (en) 2007-07-12
CN1898797A (zh) 2007-01-17
CN100477204C (zh) 2009-04-08
JP2007516619A (ja) 2007-06-21
WO2005064679A1 (en) 2005-07-14

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