ATE505851T1 - Rf-modul für ein mobilkommunikationsendgerät - Google Patents

Rf-modul für ein mobilkommunikationsendgerät

Info

Publication number
ATE505851T1
ATE505851T1 AT04030897T AT04030897T ATE505851T1 AT E505851 T1 ATE505851 T1 AT E505851T1 AT 04030897 T AT04030897 T AT 04030897T AT 04030897 T AT04030897 T AT 04030897T AT E505851 T1 ATE505851 T1 AT E505851T1
Authority
AT
Austria
Prior art keywords
module
mobile communications
communications terminal
laminated board
mcm
Prior art date
Application number
AT04030897T
Other languages
English (en)
Inventor
Cheal-Hoon Choi
Original Assignee
Lg Electronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Electronics Inc filed Critical Lg Electronics Inc
Application granted granted Critical
Publication of ATE505851T1 publication Critical patent/ATE505851T1/de

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40—Circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Telephone Set Structure (AREA)
AT04030897T 2003-12-30 2004-12-28 Rf-modul für ein mobilkommunikationsendgerät ATE505851T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030100748A KR100631673B1 (ko) 2003-12-30 2003-12-30 이동통신용 고주파 모듈 구조

Publications (1)

Publication Number Publication Date
ATE505851T1 true ATE505851T1 (de) 2011-04-15

Family

ID=34567862

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04030897T ATE505851T1 (de) 2003-12-30 2004-12-28 Rf-modul für ein mobilkommunikationsendgerät

Country Status (6)

Country Link
US (1) US7715203B2 (de)
EP (1) EP1551106B1 (de)
KR (1) KR100631673B1 (de)
CN (1) CN1665378A (de)
AT (1) ATE505851T1 (de)
DE (1) DE602004032207D1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10674611B2 (en) * 2015-06-29 2020-06-02 NagraID Security Method of reducing the thickness of an electronic circuit
CN215420239U (zh) * 2018-06-11 2022-01-04 株式会社村田制作所 高频模块和通信装置
CN111221390A (zh) * 2019-12-31 2020-06-02 苏州浪潮智能科技有限公司 一种兼容分时连接CPU和Tri mode卡的背板及实现方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3118266B2 (ja) * 1990-03-06 2000-12-18 ゼロックス コーポレイション 同期セグメントバスとバス通信方法
US5414214A (en) * 1992-10-16 1995-05-09 Motorola, Inc. Resistance heated, sealed microfabricated device package method and apparatus
US5587885A (en) * 1994-05-18 1996-12-24 Dell Usa, L.P. Mechanical printed circuit board/laminated multi chip module interconnect apparatus
AU4926396A (en) * 1995-02-16 1996-09-04 Micromodule Systems, Inc. Multiple chip module mounting assembly and computer using same
US5841193A (en) * 1996-05-20 1998-11-24 Epic Technologies, Inc. Single chip modules, repairable multichip modules, and methods of fabrication thereof
US5949654A (en) * 1996-07-03 1999-09-07 Kabushiki Kaisha Toshiba Multi-chip module, an electronic device, and production method thereof
US5920464A (en) * 1997-09-22 1999-07-06 Trw Inc. Reworkable microelectronic multi-chip module
US6897855B1 (en) * 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
JP3538045B2 (ja) 1998-12-09 2004-06-14 三菱電機株式会社 Ｒｆ回路モジュール
US6377464B1 (en) 1999-01-29 2002-04-23 Conexant Systems, Inc. Multiple chip module with integrated RF capabilities
DE19927747C1 (de) * 1999-06-17 2000-07-06 Siemens Ag Multichipmodul aus einem zusammenhängenden Waferscheibenteil für die LOC-Montage sowie Verfahren zu dessen Herstellung
JP2001177433A (ja) * 1999-12-21 2001-06-29 Murata Mfg Co Ltd 高周波複合部品及び移動体通信装置
CN1324168A (zh) 2000-05-16 2001-11-28 仁宝电脑工业股份有限公司 无线通信接口的共用模块装置
US7132841B1 (en) * 2000-06-06 2006-11-07 International Business Machines Corporation Carrier for test, burn-in, and first level packaging
JP3582460B2 (ja) 2000-06-20 2004-10-27 株式会社村田製作所 高周波モジュール
KR20020006055A (ko) * 2000-07-11 2002-01-19 이형도 위상 동기 루프형 발진기 모듈
US6891276B1 (en) * 2002-01-09 2005-05-10 Bridge Semiconductor Corporation Semiconductor package device
US7121639B2 (en) * 2002-12-02 2006-10-17 Silverbrook Research Pty Ltd Data rate equalisation to account for relatively different printhead widths
TWI221333B (en) * 2003-01-14 2004-09-21 Advanced Semiconductor Eng Bridge connection type of MCM package
CN2629355Y (zh) 2003-01-30 2004-07-28 友旺科技股份有限公司 无线传输装置的印刷电路板结构
US7186119B2 (en) * 2003-10-17 2007-03-06 Integrated System Technologies, Llc Interconnection device

Also Published As

Publication number Publication date
DE602004032207D1 (de) 2011-05-26
EP1551106A3 (de) 2009-02-25
US7715203B2 (en) 2010-05-11
KR20050068930A (ko) 2005-07-05
US20050143122A1 (en) 2005-06-30
CN1665378A (zh) 2005-09-07
KR100631673B1 (ko) 2006-10-09
EP1551106B1 (de) 2011-04-13
EP1551106A2 (de) 2005-07-06

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Legal Events

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