ATE499699T1 - Kühlvorrichtung für vakuumbehandlungsvorrichtung - Google Patents

Kühlvorrichtung für vakuumbehandlungsvorrichtung

Info

Publication number
ATE499699T1
ATE499699T1 AT04703514T AT04703514T ATE499699T1 AT E499699 T1 ATE499699 T1 AT E499699T1 AT 04703514 T AT04703514 T AT 04703514T AT 04703514 T AT04703514 T AT 04703514T AT E499699 T1 ATE499699 T1 AT E499699T1
Authority
AT
Austria
Prior art keywords
heat
vacuum treatment
conduction path
path
heat conduction
Prior art date
Application number
AT04703514T
Other languages
English (en)
Inventor
Masashi Ueda
Yoshimi Watabe
Shusaku Yamasaki
Kazuo Miyoshi
Hiroyuki Otsuka
Original Assignee
Ihi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ihi Corp filed Critical Ihi Corp
Application granted granted Critical
Publication of ATE499699T1 publication Critical patent/ATE499699T1/de

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2001—Maintaining constant desired temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Sustainable Development (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Furnace Details (AREA)
  • Muffle Furnaces And Rotary Kilns (AREA)
AT04703514T 2003-02-17 2004-01-20 Kühlvorrichtung für vakuumbehandlungsvorrichtung ATE499699T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003038052A JP4186644B2 (ja) 2003-02-17 2003-02-17 真空処理装置の冷却装置
PCT/JP2004/000424 WO2004073054A1 (ja) 2003-02-17 2004-01-20 真空処理装置の冷却装置

Publications (1)

Publication Number Publication Date
ATE499699T1 true ATE499699T1 (de) 2011-03-15

Family

ID=32866380

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04703514T ATE499699T1 (de) 2003-02-17 2004-01-20 Kühlvorrichtung für vakuumbehandlungsvorrichtung

Country Status (9)

Country Link
US (1) US7913752B2 (de)
EP (1) EP1612853B1 (de)
JP (1) JP4186644B2 (de)
KR (1) KR101051677B1 (de)
AT (1) ATE499699T1 (de)
CA (1) CA2516210A1 (de)
DE (1) DE602004031514D1 (de)
TW (1) TWI261292B (de)
WO (1) WO2004073054A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007324369A (ja) * 2006-06-01 2007-12-13 Sekisui Chem Co Ltd 基材外周処理装置
JP2008244224A (ja) * 2007-03-28 2008-10-09 Sumitomo Precision Prod Co Ltd プラズマ処理装置
JP5104151B2 (ja) 2007-09-18 2012-12-19 東京エレクトロン株式会社 気化装置、成膜装置、成膜方法及び記憶媒体
JP5224855B2 (ja) * 2008-03-05 2013-07-03 東京エレクトロン株式会社 電極ユニット、基板処理装置及び電極ユニットの温度制御方法
JP5950789B2 (ja) * 2011-11-22 2016-07-13 株式会社神戸製鋼所 プラズマ発生源の冷却機構及び冷却方法
JP2013253286A (ja) * 2012-06-06 2013-12-19 Kaneka Corp 薄膜の製造方法
CN103928379B (zh) * 2014-04-28 2017-10-27 北京七星华创电子股份有限公司 基板装卸载单元及基板处理系统
DE102017223592B4 (de) 2017-12-21 2023-11-09 Meyer Burger (Germany) Gmbh System zur elektrisch entkoppelten, homogenen Temperierung einer Elektrode mittels Wärmeleitrohren sowie Bearbeitungsanlage mit einem solchen System
KR102058244B1 (ko) 2018-05-29 2019-12-20 주식회사 바큠텍 진공 코팅용 냉각장치

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6059104B2 (ja) * 1982-02-03 1985-12-23 株式会社東芝 静電チヤツク板
JPS5914633A (ja) 1982-07-16 1984-01-25 Anelva Corp プラズマｃｖｄ装置
JPS5919328A (ja) 1982-07-23 1984-01-31 Hitachi Ltd ドライエツチング装置
JPS6372877A (ja) 1986-09-12 1988-04-02 Tokuda Seisakusho Ltd 真空処理装置
JPS63157449A (ja) * 1986-12-22 1988-06-30 Nec Corp 集積回路の冷却構造
EP0363098B1 (de) * 1988-10-03 1995-04-05 Canon Kabushiki Kaisha Vorrichtung zum Regeln der Temperatur
US5078851A (en) 1989-07-26 1992-01-07 Kouji Nishihata Low-temperature plasma processor
JPH03206613A (ja) 1990-01-09 1991-09-10 Fujitsu Ltd 低温ドライエッチング装置
DE69118315T2 (de) * 1990-11-01 1996-08-14 Canon Kk Waferhaltebefestigung für Belichtungsgerät
JPH05315293A (ja) 1992-05-02 1993-11-26 Tokyo Electron Ltd 被処理体の載置装置
JP3206613B2 (ja) 1993-03-24 2001-09-10 関西日本電気株式会社 Ｉｃソケット
US6544379B2 (en) * 1993-09-16 2003-04-08 Hitachi, Ltd. Method of holding substrate and substrate holding system
US5676205A (en) * 1993-10-29 1997-10-14 Applied Materials, Inc. Quasi-infinite heat source/sink
JPH08165572A (ja) * 1994-12-14 1996-06-25 Nissin Electric Co Ltd 真空処理室における通水装置
JPH09267036A (ja) * 1996-03-31 1997-10-14 Furontetsuku:Kk 真空装置
TW406346B (en) 1996-08-26 2000-09-21 Applied Materials Inc Method and apparatus for cooling a workpiece using an electrostatic chuck
JPH113893A (ja) * 1997-06-13 1999-01-06 Orion Mach Co Ltd 半導体基板の温度調節装置
JPH11233598A (ja) * 1998-02-18 1999-08-27 Toyota Autom Loom Works Ltd ウェハ冷却装置
JP2000193376A (ja) * 1998-12-24 2000-07-14 Dainippon Screen Mfg Co Ltd 熱処理装置
US6215642B1 (en) * 1999-03-11 2001-04-10 Nikon Corporation Of Japan Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
US6406545B2 (en) 1999-07-27 2002-06-18 Kabushiki Kaisha Toshiba Semiconductor workpiece processing apparatus and method
JP2001168037A (ja) * 1999-12-10 2001-06-22 Hitachi Kokusai Electric Inc プラズマ処理装置
JP2001189373A (ja) * 1999-12-28 2001-07-10 Ibiden Co Ltd 半導体製造・検査装置用セラミック基板

Also Published As

Publication number Publication date
TWI261292B (en) 2006-09-01
EP1612853A1 (de) 2006-01-04
EP1612853A4 (de) 2009-10-28
JP2004265937A (ja) 2004-09-24
EP1612853B1 (de) 2011-02-23
US20060144584A1 (en) 2006-07-06
DE602004031514D1 (de) 2011-04-07
JP4186644B2 (ja) 2008-11-26
CA2516210A1 (en) 2004-08-26
KR101051677B1 (ko) 2011-07-26
TW200421426A (en) 2004-10-16
US7913752B2 (en) 2011-03-29
KR20060002766A (ko) 2006-01-09
WO2004073054A1 (ja) 2004-08-26

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Legal Events

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