ATE499462T1 - Verringerung des stickstoffgehalts in siliciumcarbidkristallen durch sublimationswachstum in wasserstoffhaltiger umgebung - Google Patents
Verringerung des stickstoffgehalts in siliciumcarbidkristallen durch sublimationswachstum in wasserstoffhaltiger umgebungInfo
- Publication number
- ATE499462T1 ATE499462T1 AT04779093T AT04779093T ATE499462T1 AT E499462 T1 ATE499462 T1 AT E499462T1 AT 04779093 T AT04779093 T AT 04779093T AT 04779093 T AT04779093 T AT 04779093T AT E499462 T1 ATE499462 T1 AT E499462T1
- Authority
- AT
- Austria
- Prior art keywords
- silicon carbide
- hydrogen
- reducing
- nitrogen content
- carbide crystals
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
- C30B23/005—Controlling or regulating flux or flow of depositing species or vapour
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/36—Carbides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/906—Special atmosphere other than vacuum or inert
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Carbon And Carbon Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/628,188 US7220313B2 (en) | 2003-07-28 | 2003-07-28 | Reducing nitrogen content in silicon carbide crystals by sublimation growth in a hydrogen-containing ambient |
PCT/US2004/023859 WO2005012601A2 (en) | 2003-07-28 | 2004-07-26 | Reducing nitrogen content in silicon carbide crystals by sublimation growth in a hydrogen-containing ambient |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE499462T1 true ATE499462T1 (de) | 2011-03-15 |
Family
ID=34103326
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT04779093T ATE499462T1 (de) | 2003-07-28 | 2004-07-26 | Verringerung des stickstoffgehalts in siliciumcarbidkristallen durch sublimationswachstum in wasserstoffhaltiger umgebung |
Country Status (10)
Country | Link |
---|---|
US (1) | US7220313B2 (de) |
EP (1) | EP1664395B1 (de) |
JP (1) | JP4891076B2 (de) |
KR (1) | KR20060052942A (de) |
CN (1) | CN100419134C (de) |
AT (1) | ATE499462T1 (de) |
CA (1) | CA2533630A1 (de) |
DE (1) | DE602004031537D1 (de) |
TW (1) | TW200510583A (de) |
WO (1) | WO2005012601A2 (de) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6814801B2 (en) * | 2002-06-24 | 2004-11-09 | Cree, Inc. | Method for producing semi-insulating resistivity in high purity silicon carbide crystals |
US7316747B2 (en) * | 2002-06-24 | 2008-01-08 | Cree, Inc. | Seeded single crystal silicon carbide growth and resulting crystals |
US7601441B2 (en) * | 2002-06-24 | 2009-10-13 | Cree, Inc. | One hundred millimeter high purity semi-insulating single crystal silicon carbide wafer |
US7147715B2 (en) * | 2003-07-28 | 2006-12-12 | Cree, Inc. | Growth of ultra-high purity silicon carbide crystals in an ambient containing hydrogen |
US20080190355A1 (en) * | 2004-07-07 | 2008-08-14 | Ii-Vi Incorporated | Low-Doped Semi-Insulating Sic Crystals and Method |
US7192482B2 (en) * | 2004-08-10 | 2007-03-20 | Cree, Inc. | Seed and seedholder combinations for high quality growth of large silicon carbide single crystals |
US7294324B2 (en) * | 2004-09-21 | 2007-11-13 | Cree, Inc. | Low basal plane dislocation bulk grown SiC wafers |
US7314520B2 (en) * | 2004-10-04 | 2008-01-01 | Cree, Inc. | Low 1c screw dislocation 3 inch silicon carbide wafer |
US7314521B2 (en) * | 2004-10-04 | 2008-01-01 | Cree, Inc. | Low micropipe 100 mm silicon carbide wafer |
US7422634B2 (en) * | 2005-04-07 | 2008-09-09 | Cree, Inc. | Three inch silicon carbide wafer with low warp, bow, and TTV |
JP5117902B2 (ja) * | 2008-03-25 | 2013-01-16 | 株式会社ブリヂストン | 炭化珪素単結晶の製造方法 |
DE102008063124B4 (de) | 2008-12-24 | 2013-05-16 | Sicrystal Ag | Herstellungsverfahren für einen gleichmäßig dotierten SiC-Volumeneinkristall und gleichmäßig dotiertes SiC-Substrat |
DE102008063129B4 (de) | 2008-12-24 | 2013-05-16 | Sicrystal Ag | Herstellungsverfahren für einen codotierten SiC-Volumeneinkristall und hochohmiges SiC-Substrat |
JP2012051760A (ja) * | 2010-09-01 | 2012-03-15 | Bridgestone Corp | 炭化ケイ素単結晶の製造方法 |
JP5219230B1 (ja) * | 2012-09-04 | 2013-06-26 | エルシード株式会社 | SiC蛍光材料及びその製造方法並びに発光素子 |
CN102965733B (zh) * | 2012-11-02 | 2015-11-18 | 中国科学院物理研究所 | 一种无石墨包裹物的导电碳化硅晶体生长工艺 |
US9919972B2 (en) | 2013-05-02 | 2018-03-20 | Melior Innovations, Inc. | Pressed and self sintered polymer derived SiC materials, applications and devices |
US10322936B2 (en) | 2013-05-02 | 2019-06-18 | Pallidus, Inc. | High purity polysilocarb materials, applications and processes |
US9657409B2 (en) | 2013-05-02 | 2017-05-23 | Melior Innovations, Inc. | High purity SiOC and SiC, methods compositions and applications |
US11091370B2 (en) | 2013-05-02 | 2021-08-17 | Pallidus, Inc. | Polysilocarb based silicon carbide materials, applications and devices |
CN103320851A (zh) * | 2013-06-05 | 2013-09-25 | 中国科学院上海硅酸盐研究所 | 大尺寸15r 碳化硅晶体的制备方法 |
DE112015001072B4 (de) * | 2014-04-03 | 2021-12-02 | Hitachi High-Tech Corporation | Fluoreszenzspektrometer |
CN104947182A (zh) * | 2015-07-16 | 2015-09-30 | 中国电子科技集团公司第四十六研究所 | 一种快速生长大尺寸高纯半绝缘碳化硅单晶的方法 |
CN105463573A (zh) * | 2015-12-22 | 2016-04-06 | 中国电子科技集团公司第二研究所 | 降低碳化硅晶体杂质并获得高纯半绝缘碳化硅晶体的方法 |
CN105821471B (zh) * | 2016-05-10 | 2018-10-30 | 山东大学 | 一种低应力高纯半绝缘SiC单晶的制备方法 |
CN108118394B (zh) * | 2017-12-28 | 2020-07-17 | 河北同光晶体有限公司 | 一种降低碳化硅单晶中氮杂质含量的方法 |
CN117585678A (zh) * | 2023-11-30 | 2024-02-23 | 宁波合盛新材料有限公司 | 一种用于pvt炉合成碳化硅粉新热场的吸氮处理方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL87348C (de) | 1954-03-19 | 1900-01-01 | ||
US4866005A (en) | 1987-10-26 | 1989-09-12 | North Carolina State University | Sublimation of silicon carbide to produce large, device quality single crystals of silicon carbide |
GB8816632D0 (en) | 1988-07-13 | 1988-08-17 | Raychem Ltd | Electrical device |
JPH0350118A (ja) * | 1989-07-14 | 1991-03-04 | Sumitomo Electric Ind Ltd | 超電導線材およびその製造方法 |
US5119540A (en) | 1990-07-24 | 1992-06-09 | Cree Research, Inc. | Apparatus for eliminating residual nitrogen contamination in epitaxial layers of silicon carbide and resulting product |
GB9206086D0 (en) | 1992-03-20 | 1992-05-06 | Philips Electronics Uk Ltd | Manufacturing electronic devices comprising,e.g.tfts and mims |
JPH06128094A (ja) * | 1992-10-19 | 1994-05-10 | Nisshin Steel Co Ltd | 炭化ケイ素単結晶の製造方法 |
US5709745A (en) | 1993-01-25 | 1998-01-20 | Ohio Aerospace Institute | Compound semi-conductors and controlled doping thereof |
KR100267617B1 (ko) * | 1993-04-23 | 2000-10-16 | 히가시 데쓰로 | 진공처리장치 및 진공처리방법 |
US5611955A (en) * | 1993-10-18 | 1997-03-18 | Northrop Grumman Corp. | High resistivity silicon carbide substrates for high power microwave devices |
JPH08208380A (ja) * | 1995-01-25 | 1996-08-13 | Nippon Steel Corp | 単結晶炭化珪素の製造方法 |
US5718760A (en) | 1996-02-05 | 1998-02-17 | Cree Research, Inc. | Growth of colorless silicon carbide crystals |
US6201342B1 (en) | 1997-06-30 | 2001-03-13 | The United States Of America As Represented By The Secretary Of The Navy | Automatically sharp field emission cathodes |
EP0933450B1 (de) * | 1998-01-19 | 2002-04-17 | Sumitomo Electric Industries, Ltd. | Verfahren und Vorrichtung zur Herstellung eines SiC-Einkristalles |
DE59901313D1 (de) | 1998-07-13 | 2002-05-29 | Siemens Ag | VERFAHREN ZUR ZÜCHTUNG VON SiC-EINKRISTALLEN |
US6218680B1 (en) | 1999-05-18 | 2001-04-17 | Cree, Inc. | Semi-insulating silicon carbide without vanadium domination |
EP1194618B1 (de) * | 1999-07-07 | 2003-10-08 | Siemens Aktiengesellschaft | Verfahren zur sublimationszüchtung eines sic-einkristalls mit aufheizen unter züchtungsdruck |
US7147715B2 (en) * | 2003-07-28 | 2006-12-12 | Cree, Inc. | Growth of ultra-high purity silicon carbide crystals in an ambient containing hydrogen |
-
2003
- 2003-07-28 US US10/628,188 patent/US7220313B2/en active Active
-
2004
- 2004-07-26 CN CNB2004800217319A patent/CN100419134C/zh active Active
- 2004-07-26 WO PCT/US2004/023859 patent/WO2005012601A2/en active Search and Examination
- 2004-07-26 KR KR1020067002076A patent/KR20060052942A/ko not_active Application Discontinuation
- 2004-07-26 JP JP2006521948A patent/JP4891076B2/ja active Active
- 2004-07-26 AT AT04779093T patent/ATE499462T1/de not_active IP Right Cessation
- 2004-07-26 CA CA002533630A patent/CA2533630A1/en not_active Abandoned
- 2004-07-26 DE DE602004031537T patent/DE602004031537D1/de active Active
- 2004-07-26 EP EP04779093A patent/EP1664395B1/de active Active
- 2004-07-28 TW TW093122584A patent/TW200510583A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2005012601A2 (en) | 2005-02-10 |
JP2007500667A (ja) | 2007-01-18 |
CA2533630A1 (en) | 2005-02-10 |
DE602004031537D1 (de) | 2011-04-07 |
JP4891076B2 (ja) | 2012-03-07 |
EP1664395A2 (de) | 2006-06-07 |
US20050022727A1 (en) | 2005-02-03 |
CN100419134C (zh) | 2008-09-17 |
US7220313B2 (en) | 2007-05-22 |
TW200510583A (en) | 2005-03-16 |
CN1829829A (zh) | 2006-09-06 |
WO2005012601A3 (en) | 2005-03-24 |
KR20060052942A (ko) | 2006-05-19 |
EP1664395B1 (de) | 2011-02-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE499462T1 (de) | Verringerung des stickstoffgehalts in siliciumcarbidkristallen durch sublimationswachstum in wasserstoffhaltiger umgebung | |
TW200509220A (en) | A substrate for stressed systems and a method of crystal growth on said substrate | |
EP1249522A3 (de) | Sauerstoffdotierungsverfahren für ein einkristallines Galliumnitrid Substrat und ein mit Sauerstoff-dotiertem N-Typ freistehendes Substrat aus Galliumnitrid | |
UA84460C2 (ru) | Применение сульфонилкарбамидов для борьбы с нежелательным ростом растений в культурах бобовых | |
TW200725742A (en) | Annealed wafer and manufacturing method of annealed wafer | |
TW200628643A (en) | Low micropipe 100 mm silicon carbide wafer | |
SE0202585D0 (sv) | Lightly doped silicon carbide substrate and use thereof in high power devices | |
DE69904965T2 (de) | Herstellung von einkristallen aus aluminiumnitrid, siliziumkarbid und aluminiumnitrid-siliziumkarbid legierung | |
HK1088715A1 (en) | Single crystal gallium nitride substrate, method of growing the same and method of producing the same | |
TW200704834A (en) | Silicon wafer and manufacturing method for same | |
TW200801262A (en) | Method for purifying silicon | |
TW200632153A (en) | Silicon carbide single crystal, silicon carbide substrate and manufacturing method for silicon carbide single crystal | |
TW200518197A (en) | Substrate for nitride semiconductor growth | |
TW200614379A (en) | Silicon epitaxial wafer and manufacturing method for same | |
WO2008063444A3 (en) | Gallium nitride crystals and wafers | |
WO2007062064A3 (en) | Methods and compositions for controlling parasitic infections with bt crystal proteins | |
PL360373A1 (en) | Non-imidazole aryloxypiperidines as h3 receptor ligands | |
TW200741821A (en) | Method for manufacturing compound material wafers and method for recycling a used donor substrate | |
EP1734158A4 (de) | Verfahren zum ziehen von galliumnitrid-einkristallen und galliumnitrid-einkristall | |
TW200502445A (en) | The single crystal of zing oxide | |
EP1928013A3 (de) | Herstellung und Behandlung einer epitaktischen Schicht mit Silicium und Kohlenstoff | |
GB0130005D0 (en) | Boron doped diamond | |
PT1796660T (pt) | Utilização de tricloro(dioxietileno-o,o¿)telurato de amónio (as101) para a inibição da enzima de conversão da interleucina-1 beta | |
ATE453000T1 (de) | Züchten von ultrahochreinen siliciumcarbidkristallen in wasserstoffhaltiger umgebung | |
GB0519380D0 (en) | Substrate of gallium nitride single crystal and process for producing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |