ATE497250T1 - Verfahren für durch einen fokussierten elektronenstrahl induziertes ätzen - Google Patents
Verfahren für durch einen fokussierten elektronenstrahl induziertes ätzenInfo
- Publication number
- ATE497250T1 ATE497250T1 AT02023217T AT02023217T ATE497250T1 AT E497250 T1 ATE497250 T1 AT E497250T1 AT 02023217 T AT02023217 T AT 02023217T AT 02023217 T AT02023217 T AT 02023217T AT E497250 T1 ATE497250 T1 AT E497250T1
- Authority
- AT
- Austria
- Prior art keywords
- electron beam
- focused electron
- reaction product
- electrons
- etching induced
- Prior art date
Links
- 238000005530 etching Methods 0.000 title abstract 2
- 238000010894 electron beam technology Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000007795 chemical reaction product Substances 0.000 abstract 3
- 239000000463 material Substances 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/3174—Etching microareas
- H01J2237/31742—Etching microareas for repairing masks
- H01J2237/31744—Etching microareas for repairing masks introducing gas in vicinity of workpiece
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Drying Of Semiconductors (AREA)
- Recrystallisation Techniques (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP02023217A EP1411538B1 (de) | 2002-10-16 | 2002-10-16 | Verfahren für durch einen fokussierten Elektronenstrahl induziertes Ätzen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE497250T1 true ATE497250T1 (de) | 2011-02-15 |
Family
ID=32039139
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02023217T ATE497250T1 (de) | 2002-10-16 | 2002-10-16 | Verfahren für durch einen fokussierten elektronenstrahl induziertes ätzen |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7452477B2 (de) |
| EP (1) | EP1411538B1 (de) |
| JP (1) | JP2004140346A (de) |
| AT (1) | ATE497250T1 (de) |
| DE (1) | DE60239062D1 (de) |
| IL (1) | IL157999A (de) |
| TW (1) | TWI334155B (de) |
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1363164B1 (de) | 2002-05-16 | 2015-04-29 | NaWoTec GmbH | Verfahren zum Ätzen einer Oberfläche mittels durch fokussierten Elektronenstrahl hervorgerufenen chemischen Reaktionen auf dieser Oberfläche |
| DE10302794A1 (de) * | 2003-01-24 | 2004-07-29 | Nawotec Gmbh | Verfahren und Vorrichtung zur Herstellung von Korpuskularstrahlsystemen |
| DE10353591A1 (de) * | 2003-11-17 | 2005-06-02 | Infineon Technologies Ag | Verfahren zum lokal begrenzten Ätzen einer Chromschicht |
| DE10354112B4 (de) * | 2003-11-19 | 2008-07-31 | Qimonda Ag | Verfahren und Anordnung zur Reparatur von Speicherchips mittels Mikro-Lithographie-Verfahren |
| US7674389B2 (en) * | 2004-10-26 | 2010-03-09 | The Regents Of The University Of California | Precision shape modification of nanodevices with a low-energy electron beam |
| US7893397B2 (en) * | 2005-11-07 | 2011-02-22 | Fibics Incorporated | Apparatus and method for surface modification using charged particle beams |
| US20070278180A1 (en) * | 2006-06-01 | 2007-12-06 | Williamson Mark J | Electron induced chemical etching for materials characterization |
| US7807062B2 (en) | 2006-07-10 | 2010-10-05 | Micron Technology, Inc. | Electron induced chemical etching and deposition for local circuit repair |
| US7791055B2 (en) | 2006-07-10 | 2010-09-07 | Micron Technology, Inc. | Electron induced chemical etching/deposition for enhanced detection of surface defects |
| US7892978B2 (en) | 2006-07-10 | 2011-02-22 | Micron Technology, Inc. | Electron induced chemical etching for device level diagnosis |
| US7833427B2 (en) * | 2006-08-14 | 2010-11-16 | Micron Technology, Inc. | Electron beam etching device and method |
| US7718080B2 (en) | 2006-08-14 | 2010-05-18 | Micron Technology, Inc. | Electronic beam processing device and method using carbon nanotube emitter |
| US7569484B2 (en) * | 2006-08-14 | 2009-08-04 | Micron Technology, Inc. | Plasma and electron beam etching device and method |
| US7791071B2 (en) | 2006-08-14 | 2010-09-07 | Micron Technology, Inc. | Profiling solid state samples |
| DE102007054073A1 (de) | 2007-11-13 | 2009-05-14 | Carl Zeiss Nts Gmbh | System und Verfahren zum Bearbeiten eines Objekts |
| US8541066B2 (en) * | 2007-11-26 | 2013-09-24 | University Of North Carolina At Charlotte | Light-induced directed self-assembly of periodic sub-wavelength nanostructures |
| TWI479570B (zh) | 2007-12-26 | 2015-04-01 | 奈華科技有限公司 | 從樣本移除材料之方法及系統 |
| DE102008009640A1 (de) | 2008-02-18 | 2009-08-27 | Carl Zeiss Nts Gmbh | Prozessierungssystem |
| WO2009114230A2 (en) * | 2008-03-07 | 2009-09-17 | Carl Zeiss Smt, Inc. | Reducing particle implantation |
| US20100068408A1 (en) * | 2008-09-16 | 2010-03-18 | Omniprobe, Inc. | Methods for electron-beam induced deposition of material inside energetic-beam microscopes |
| KR101610260B1 (ko) * | 2008-12-15 | 2016-04-08 | 삼성전자주식회사 | 전자빔 어닐링 장치 및 이를 이용한 어닐링 방법 |
| US9991092B2 (en) * | 2009-08-07 | 2018-06-05 | Hitachi High-Technologies Corporation | Scanning electron microscope and sample observation method |
| WO2011060444A2 (en) * | 2009-11-16 | 2011-05-19 | Fei Company | Gas delivery for beam processing systems |
| US9721754B2 (en) * | 2011-04-26 | 2017-08-01 | Carl Zeiss Smt Gmbh | Method and apparatus for processing a substrate with a focused particle beam |
| US9169567B2 (en) | 2012-03-30 | 2015-10-27 | General Electric Company | Components having tab members |
| US9671030B2 (en) | 2012-03-30 | 2017-06-06 | General Electric Company | Metallic seal assembly, turbine component, and method of regulating airflow in turbo-machinery |
| US9587632B2 (en) | 2012-03-30 | 2017-03-07 | General Electric Company | Thermally-controlled component and thermal control process |
| JP6126425B2 (ja) | 2013-03-27 | 2017-05-10 | 株式会社日立ハイテクサイエンス | 集束イオンビーム装置及びその制御方法 |
| US9123506B2 (en) * | 2013-06-10 | 2015-09-01 | Fei Company | Electron beam-induced etching |
| DE102021206564A1 (de) * | 2021-06-24 | 2022-12-29 | Carl Zeiss Smt Gmbh | Endpunktbestimmung durch induzierte desorption von gasen und analyse der wiederbedeckung |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3968476A (en) * | 1974-07-17 | 1976-07-06 | Sperry Rand Corporation | Spurious signal removal in optical processor fingerprint identification apparatus |
| US4650778A (en) * | 1985-01-18 | 1987-03-17 | E. I. Du Pont De Nemours And Company | Metal halide vaporization into diluents |
| JP2650930B2 (ja) * | 1987-11-24 | 1997-09-10 | 株式会社日立製作所 | 超格子構作の素子製作方法 |
| JPH0262039A (ja) * | 1988-08-29 | 1990-03-01 | Hitachi Ltd | 多層素子の微細加工方法およびその装置 |
| US5151135A (en) * | 1989-09-15 | 1992-09-29 | Amoco Corporation | Method for cleaning surfaces using UV lasers |
| US6067062A (en) * | 1990-09-05 | 2000-05-23 | Seiko Instruments Inc. | Light valve device |
| US5683547A (en) * | 1990-11-21 | 1997-11-04 | Hitachi, Ltd. | Processing method and apparatus using focused energy beam |
| JP3235144B2 (ja) * | 1991-08-02 | 2001-12-04 | ソニー株式会社 | 量子箱列の作製方法 |
| JP3331563B2 (ja) * | 1992-08-28 | 2002-10-07 | 石川島播磨重工業株式会社 | 電子ビーム加熱装置 |
| JP2671089B2 (ja) * | 1992-11-20 | 1997-10-29 | 光技術研究開発株式会社 | 量子構造作製方法 |
| US5472749A (en) * | 1994-10-27 | 1995-12-05 | Northwestern University | Graphite encapsulated nanophase particles produced by a tungsten arc method |
| JP3464320B2 (ja) * | 1995-08-02 | 2003-11-10 | 株式会社荏原製作所 | 高速原子線を用いた加工方法及び加工装置 |
| US5665658A (en) * | 1996-03-21 | 1997-09-09 | Motorola | Method of forming a dielectric layer structure |
| US6673127B1 (en) * | 1997-01-22 | 2004-01-06 | Denora S.P.A. | Method of forming robust metal, metal oxide, and metal alloy layers on ion-conductive polymer membranes |
| AU719341B2 (en) * | 1997-01-22 | 2000-05-04 | De Nora Elettrodi S.P.A. | Method of forming robust metal, metal oxide, and metal alloy layers on ion-conductive polymer membranes |
| JPH10223512A (ja) * | 1997-02-10 | 1998-08-21 | Nikon Corp | 電子ビーム投影露光装置 |
| US6261938B1 (en) * | 1997-02-12 | 2001-07-17 | Quantiscript, Inc. | Fabrication of sub-micron etch-resistant metal/semiconductor structures using resistless electron beam lithography |
| US6783643B2 (en) * | 1999-06-22 | 2004-08-31 | President And Fellows Of Harvard College | Control of solid state dimensional features |
| US6387530B1 (en) * | 1999-08-27 | 2002-05-14 | Seagate Technology Llc | Patterned magnetic media via thermally induced phase transition |
| JP2001242300A (ja) * | 2000-03-02 | 2001-09-07 | Sony Corp | 電子ビーム照射装置 |
| US6751516B1 (en) * | 2000-08-10 | 2004-06-15 | Richardson Technologies, Inc. | Method and system for direct writing, editing and transmitting a three dimensional part and imaging systems therefor |
| DE10042098A1 (de) * | 2000-08-26 | 2002-03-14 | Deutsche Telekom Ag | Gasversorgung für Additive Lithographie |
| JP2002252212A (ja) * | 2001-02-23 | 2002-09-06 | Mitsubishi Heavy Ind Ltd | 表面加工方法、光起電力発生装置の製造方法及び製造装置 |
| US20030000921A1 (en) * | 2001-06-29 | 2003-01-02 | Ted Liang | Mask repair with electron beam-induced chemical etching |
| EP1363164B1 (de) | 2002-05-16 | 2015-04-29 | NaWoTec GmbH | Verfahren zum Ätzen einer Oberfläche mittels durch fokussierten Elektronenstrahl hervorgerufenen chemischen Reaktionen auf dieser Oberfläche |
| US6843927B2 (en) * | 2002-08-27 | 2005-01-18 | Kla-Tencor Technologies Corporation | Method and apparatus for endpoint detection in electron beam assisted etching |
| US6677586B1 (en) * | 2002-08-27 | 2004-01-13 | Kla -Tencor Technologies Corporation | Methods and apparatus for electron beam inspection of samples |
| US6943350B2 (en) * | 2002-08-27 | 2005-09-13 | Kla-Tencor Technologies Corporation | Methods and apparatus for electron beam inspection of samples |
| US6787783B2 (en) * | 2002-12-17 | 2004-09-07 | International Business Machines Corporation | Apparatus and techniques for scanning electron beam based chip repair |
| DE10302794A1 (de) | 2003-01-24 | 2004-07-29 | Nawotec Gmbh | Verfahren und Vorrichtung zur Herstellung von Korpuskularstrahlsystemen |
-
2002
- 2002-10-16 AT AT02023217T patent/ATE497250T1/de not_active IP Right Cessation
- 2002-10-16 EP EP02023217A patent/EP1411538B1/de not_active Expired - Lifetime
- 2002-10-16 DE DE60239062T patent/DE60239062D1/de not_active Expired - Lifetime
-
2003
- 2003-07-28 US US10/628,174 patent/US7452477B2/en not_active Expired - Lifetime
- 2003-07-29 TW TW092120662A patent/TWI334155B/zh not_active IP Right Cessation
- 2003-09-18 IL IL157999A patent/IL157999A/en active IP Right Grant
- 2003-09-24 JP JP2003332272A patent/JP2004140346A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004140346A (ja) | 2004-05-13 |
| EP1411538B1 (de) | 2011-01-26 |
| DE60239062D1 (de) | 2011-03-10 |
| US7452477B2 (en) | 2008-11-18 |
| EP1411538A1 (de) | 2004-04-21 |
| TWI334155B (en) | 2010-12-01 |
| TW200406803A (en) | 2004-05-01 |
| IL157999A0 (en) | 2004-03-28 |
| US20050072753A1 (en) | 2005-04-07 |
| IL157999A (en) | 2013-06-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |