ATE473199T1 - Method of manufacturing mechanical components of mems or nems structures in monocrystalline silicon - Google Patents
Method of manufacturing mechanical components of mems or nems structures in monocrystalline siliconInfo
- Publication number
- ATE473199T1 ATE473199T1 AT08172514T AT08172514T ATE473199T1 AT E473199 T1 ATE473199 T1 AT E473199T1 AT 08172514 T AT08172514 T AT 08172514T AT 08172514 T AT08172514 T AT 08172514T AT E473199 T1 ATE473199 T1 AT E473199T1
- Authority
- AT
- Austria
- Prior art keywords
- mems
- monocrystalline silicon
- mechanical components
- etching
- substrate
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/00468—Releasing structures
- B81C1/00484—Processes for releasing structures not provided for in group B81C1/00476
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
- B81C1/00682—Treatments for improving mechanical properties, not provided for in B81C1/00658 - B81C1/0065
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
- B81C2201/053—Depositing a protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Micromachines (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Pressure Sensors (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0760426A FR2925890B1 (fr) | 2007-12-28 | 2007-12-28 | Procede de fabrication de composants mecaniques de structures mems ou nems en silicium monocristallin |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE473199T1 true ATE473199T1 (de) | 2010-07-15 |
Family
ID=39769267
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08172514T ATE473199T1 (de) | 2007-12-28 | 2008-12-22 | Method of manufacturing mechanical components of mems or nems structures in monocrystalline silicon |
Country Status (6)
Country | Link |
---|---|
US (1) | US7932118B2 (de) |
EP (1) | EP2075222B1 (de) |
JP (1) | JP2009160728A (de) |
AT (1) | ATE473199T1 (de) |
DE (1) | DE602008001711D1 (de) |
FR (1) | FR2925890B1 (de) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008039372A2 (en) * | 2006-09-22 | 2008-04-03 | Carnegie Mellon University | Assembling and applying nano-electro-mechanical systems |
TWI373450B (en) * | 2009-07-29 | 2012-10-01 | Pixart Imaging Inc | Microelectronic device and method for fabricating mems resonator thereof |
CN101993033B (zh) * | 2009-08-19 | 2012-05-23 | 微智半导体股份有限公司 | 微机电的结构及制造方法 |
US8603848B2 (en) * | 2009-08-25 | 2013-12-10 | Electronics And Telecommunications Research Institute | Three-dimensional MEMS structure and method of manufacturing the same |
US8642370B2 (en) * | 2011-03-04 | 2014-02-04 | Texas Instruments Incorporated | Cavity open process to improve undercut |
CN102584331B (zh) * | 2012-01-18 | 2013-10-30 | 广西大学 | 纳米颗粒阵列为模版的双组分双层纳米润滑薄膜的制备方法 |
US10246325B2 (en) * | 2014-09-03 | 2019-04-02 | Infineon Technologies Ag | MEMS device and method for manufacturing a MEMS device |
US9630836B2 (en) * | 2015-09-30 | 2017-04-25 | Mems Drive, Inc. | Simplified MEMS device fabrication process |
EP3088969B1 (de) * | 2016-03-17 | 2018-12-26 | Sigatec SA | Thermocompensierte spiralfeder und verfahren zu deren herstellung |
EP3285124B1 (de) * | 2016-08-17 | 2020-12-16 | Tronic's Microsystems S.A | Mechanischer resonator für uhrwerk, sowie herstellungsverfahren eines solchen resonators |
DE102018214634B3 (de) | 2018-08-29 | 2019-09-12 | Robert Bosch Gmbh | Sensoreinrichtung und Verfahren zur Herstellung einer Sensoreinrichtung |
US20220415703A1 (en) * | 2021-06-24 | 2022-12-29 | Stmicroelectronics S.R.L. | Ultra-thin semiconductor die with irregular textured surfaces |
CN115966865A (zh) * | 2022-12-29 | 2023-04-14 | 中国电子科技集团公司第二十六研究所 | 一种基于三维堆叠产生带外零点的mems滤波器及其制作方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5198390A (en) * | 1992-01-16 | 1993-03-30 | Cornell Research Foundation, Inc. | RIE process for fabricating submicron, silicon electromechanical structures |
US6635506B2 (en) * | 2001-11-07 | 2003-10-21 | International Business Machines Corporation | Method of fabricating micro-electromechanical switches on CMOS compatible substrates |
DE10235371A1 (de) * | 2002-08-02 | 2004-02-12 | Robert Bosch Gmbh | Verfahren zur Herstellung einer mikromechanischen Vorrichtung, insbesondere einer mikromechanischen Schwingspiegelvorrichtung |
FR2857952B1 (fr) * | 2003-07-25 | 2005-12-16 | St Microelectronics Sa | Resonateur electromecanique et procede de fabrication d'un tel resonateur |
EP1521301A1 (de) * | 2003-09-30 | 2005-04-06 | Interuniversitaire Microelectronica Centrum vzw ( IMEC) | Herstellung von luftgefüllten Lücken um Verbindungsleitung herum |
EP1544163B1 (de) * | 2003-12-16 | 2021-02-24 | Robert Bosch GmbH | Verfahren zur Herstellung eines Membransensors und entsprechender Membransensor |
-
2007
- 2007-12-28 FR FR0760426A patent/FR2925890B1/fr not_active Expired - Fee Related
-
2008
- 2008-12-17 US US12/336,930 patent/US7932118B2/en active Active
- 2008-12-22 DE DE602008001711T patent/DE602008001711D1/de active Active
- 2008-12-22 EP EP08172514A patent/EP2075222B1/de active Active
- 2008-12-22 AT AT08172514T patent/ATE473199T1/de not_active IP Right Cessation
- 2008-12-22 JP JP2008325334A patent/JP2009160728A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
US20090170231A1 (en) | 2009-07-02 |
FR2925890B1 (fr) | 2010-01-29 |
EP2075222A1 (de) | 2009-07-01 |
DE602008001711D1 (de) | 2010-08-19 |
FR2925890A1 (fr) | 2009-07-03 |
JP2009160728A (ja) | 2009-07-23 |
US7932118B2 (en) | 2011-04-26 |
EP2075222B1 (de) | 2010-07-07 |
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Legal Events
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RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |