ATE464588T1 - Lichtempfindliche harzzusammensetzung und deren verwendung - Google Patents
Lichtempfindliche harzzusammensetzung und deren verwendungInfo
- Publication number
- ATE464588T1 ATE464588T1 AT05005613T AT05005613T ATE464588T1 AT E464588 T1 ATE464588 T1 AT E464588T1 AT 05005613 T AT05005613 T AT 05005613T AT 05005613 T AT05005613 T AT 05005613T AT E464588 T1 ATE464588 T1 AT E464588T1
- Authority
- AT
- Austria
- Prior art keywords
- resin composition
- photosensitive resin
- pattern
- polyimide film
- specific
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004076146A JP4256806B2 (ja) | 2004-03-17 | 2004-03-17 | 感光性樹脂組成物とその利用 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE464588T1 true ATE464588T1 (de) | 2010-04-15 |
Family
ID=34836540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05005613T ATE464588T1 (de) | 2004-03-17 | 2005-03-15 | Lichtempfindliche harzzusammensetzung und deren verwendung |
Country Status (6)
Country | Link |
---|---|
US (1) | US7008752B2 (de) |
EP (1) | EP1577708B1 (de) |
JP (1) | JP4256806B2 (de) |
CN (1) | CN100498529C (de) |
AT (1) | ATE464588T1 (de) |
DE (1) | DE602005020543D1 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010181817A (ja) * | 2009-02-09 | 2010-08-19 | Asahi Kasei E-Materials Corp | 感光性樹脂組成物 |
JP5644068B2 (ja) * | 2009-07-06 | 2014-12-24 | 日立化成デュポンマイクロシステムズ株式会社 | 感光性樹脂組成物、レジストパターンの製造法、及びハードディスクサスペンション |
JP5208085B2 (ja) * | 2009-10-14 | 2013-06-12 | 日東電工株式会社 | 感光性樹脂組成物およびそれを用いた金属支持体付回路基板の製法、ならびに金属支持体付回路基板 |
JP2011253044A (ja) * | 2010-06-02 | 2011-12-15 | Nippon Kayaku Co Ltd | 感光性樹脂組成物、その用途及びその使用方法 |
JP2012063645A (ja) | 2010-09-17 | 2012-03-29 | Nitto Denko Corp | 感光性樹脂組成物およびそれを用いた金属支持体付回路基板 |
EP3098653B1 (de) * | 2014-01-24 | 2020-07-29 | Toray Industries, Inc. | Negative lichtempfindliche harzzusammensetzung, durch härtung davon erhaltener gehärteter film, verfahren zur herstellung des gehärteten films, optische vorrichtung mit dem gehärteten film und rückseitenbeleuchteter cmos-bildsensor |
JP7492880B2 (ja) | 2020-08-03 | 2024-05-30 | 日東電工株式会社 | ポリイミド前駆体組成物 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4911541A (de) | 1972-06-01 | 1974-02-01 | ||
JPS5246723B2 (de) | 1974-04-26 | 1977-11-28 | ||
JPS5952822B2 (ja) | 1978-04-14 | 1984-12-21 | 東レ株式会社 | 耐熱性感光材料 |
JPS606368B2 (ja) | 1979-08-01 | 1985-02-18 | 東レ株式会社 | 感光性ポリイミド前駆体 |
JP3093055B2 (ja) | 1992-07-07 | 2000-10-03 | 日東電工株式会社 | 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法 |
JP3709997B2 (ja) | 1994-03-29 | 2005-10-26 | 日東電工株式会社 | 耐熱性ネガ型フォトレジスト組成物および感光性基材、ならびにネガ型パターン形成方法 |
JP3176795B2 (ja) | 1994-04-06 | 2001-06-18 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物 |
JP2000267276A (ja) * | 1999-03-18 | 2000-09-29 | Nitto Denko Corp | 転写シート |
JP2002148804A (ja) | 2000-11-08 | 2002-05-22 | Nitto Denko Corp | 感光性樹脂組成物および回路基板 |
US7141614B2 (en) * | 2001-10-30 | 2006-11-28 | Kaneka Corporation | Photosensitive resin composition and photosensitive films and laminates made by using the same |
JP2003186192A (ja) * | 2001-12-19 | 2003-07-03 | Nitto Denko Corp | 感光性樹脂組成物およびポリイミド樹脂 |
-
2004
- 2004-03-17 JP JP2004076146A patent/JP4256806B2/ja not_active Expired - Lifetime
-
2005
- 2005-03-15 AT AT05005613T patent/ATE464588T1/de not_active IP Right Cessation
- 2005-03-15 DE DE602005020543T patent/DE602005020543D1/de active Active
- 2005-03-15 EP EP05005613A patent/EP1577708B1/de not_active Not-in-force
- 2005-03-17 US US11/081,516 patent/US7008752B2/en active Active
- 2005-03-17 CN CNB200510055133XA patent/CN100498529C/zh active Active
Also Published As
Publication number | Publication date |
---|---|
EP1577708A3 (de) | 2009-05-13 |
DE602005020543D1 (de) | 2010-05-27 |
EP1577708A2 (de) | 2005-09-21 |
US20050208421A1 (en) | 2005-09-22 |
US7008752B2 (en) | 2006-03-07 |
CN100498529C (zh) | 2009-06-10 |
JP2005266075A (ja) | 2005-09-29 |
JP4256806B2 (ja) | 2009-04-22 |
EP1577708B1 (de) | 2010-04-14 |
CN1670626A (zh) | 2005-09-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |