ATE463594T1 - Lösung zur plattierung von palladium - Google Patents
Lösung zur plattierung von palladiumInfo
- Publication number
- ATE463594T1 ATE463594T1 AT07102550T AT07102550T ATE463594T1 AT E463594 T1 ATE463594 T1 AT E463594T1 AT 07102550 T AT07102550 T AT 07102550T AT 07102550 T AT07102550 T AT 07102550T AT E463594 T1 ATE463594 T1 AT E463594T1
- Authority
- AT
- Austria
- Prior art keywords
- palladium
- plating film
- plating solution
- amount
- salt
- Prior art date
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title abstract 10
- 238000007747 plating Methods 0.000 title abstract 7
- 229910052763 palladium Inorganic materials 0.000 title abstract 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 229910052732 germanium Inorganic materials 0.000 abstract 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 150000002940 palladium Chemical class 0.000 abstract 2
- 150000003839 salts Chemical class 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 238000004381 surface treatment Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
- C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006057797 | 2006-03-03 | ||
| JP2007027861A JP4598782B2 (ja) | 2006-03-03 | 2007-02-07 | パラジウムめっき液 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE463594T1 true ATE463594T1 (de) | 2010-04-15 |
Family
ID=38254881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT07102550T ATE463594T1 (de) | 2006-03-03 | 2007-02-16 | Lösung zur plattierung von palladium |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7887692B2 (de) |
| EP (1) | EP1852525B1 (de) |
| JP (1) | JP4598782B2 (de) |
| AT (1) | ATE463594T1 (de) |
| DE (1) | DE602007005714D1 (de) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5042894B2 (ja) * | 2008-03-19 | 2012-10-03 | 松田産業株式会社 | 電子部品およびその製造方法 |
| EP2743273A1 (de) | 2012-12-12 | 2014-06-18 | Umicore AG & Co. KG | Verfahren zur Herstellung wasserhaltiger Zubereitungen von Komplexen der Platingruppenmetalle |
| CN103820827A (zh) * | 2014-02-24 | 2014-05-28 | 北京工业大学 | 一种从离子液体中电沉积钯的方法 |
| US11946153B2 (en) | 2019-02-01 | 2024-04-02 | Ishihara Chemical Co., Ltd. | Copper or copper alloy electroplating bath |
| JP7353249B2 (ja) | 2020-08-19 | 2023-09-29 | Ｅｅｊａ株式会社 | シアン系電解銀合金めっき液 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH572989A5 (de) * | 1973-04-27 | 1976-02-27 | Oxy Metal Industries Corp | |
| SE8106867L (sv) * | 1980-12-11 | 1982-06-12 | Hooker Chemicals Plastics Corp | Elektrolytisk avsettning av palladium och palladiumlegeringar |
| JPH0741697Y2 (ja) * | 1990-02-21 | 1995-09-27 | レオン自動機株式会社 | 菓子片の移送装置 |
| JPH0828561B2 (ja) * | 1991-01-18 | 1996-03-21 | 石原薬品株式会社 | プリント配線板の製造法 |
| JP3560250B2 (ja) * | 1993-02-02 | 2004-09-02 | 新光電気工業株式会社 | 半導体装置用リードフレーム |
| JP3345529B2 (ja) | 1995-06-20 | 2002-11-18 | 日立化成工業株式会社 | ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法 |
| JP3379412B2 (ja) * | 1997-05-30 | 2003-02-24 | 松下電器産業株式会社 | パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム |
| JPH11189891A (ja) * | 1997-12-25 | 1999-07-13 | Matsuda Sangyo Co Ltd | パラジウム電気めっき液 |
| JP3816241B2 (ja) * | 1998-07-14 | 2006-08-30 | 株式会社大和化成研究所 | 金属を還元析出させるための水溶液 |
| JP4570213B2 (ja) * | 2000-01-12 | 2010-10-27 | 古河電気工業株式会社 | パラジウムめっき液 |
| JP2001335986A (ja) * | 2000-05-30 | 2001-12-07 | Matsuda Sangyo Co Ltd | パラジウムめっき液 |
-
2007
- 2007-02-07 JP JP2007027861A patent/JP4598782B2/ja active Active
- 2007-02-16 EP EP07102550A patent/EP1852525B1/de not_active Not-in-force
- 2007-02-16 AT AT07102550T patent/ATE463594T1/de not_active IP Right Cessation
- 2007-02-16 DE DE602007005714T patent/DE602007005714D1/de active Active
- 2007-02-27 US US11/711,516 patent/US7887692B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| DE602007005714D1 (de) | 2010-05-20 |
| EP1852525A1 (de) | 2007-11-07 |
| EP1852525B1 (de) | 2010-04-07 |
| JP2007262573A (ja) | 2007-10-11 |
| US7887692B2 (en) | 2011-02-15 |
| US20070205109A1 (en) | 2007-09-06 |
| JP4598782B2 (ja) | 2010-12-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |