ATE463594T1 - Lösung zur plattierung von palladium - Google Patents

Lösung zur plattierung von palladium

Info

Publication number
ATE463594T1
ATE463594T1 AT07102550T AT07102550T ATE463594T1 AT E463594 T1 ATE463594 T1 AT E463594T1 AT 07102550 T AT07102550 T AT 07102550T AT 07102550 T AT07102550 T AT 07102550T AT E463594 T1 ATE463594 T1 AT E463594T1
Authority
AT
Austria
Prior art keywords
palladium
plating film
plating solution
amount
salt
Prior art date
Application number
AT07102550T
Other languages
English (en)
Inventor
Shingo Watanabe
Junji Ohnishi
Hiroshi Wachi
Takayuki Sone
Original Assignee
Electroplating Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Eng filed Critical Electroplating Eng
Application granted granted Critical
Publication of ATE463594T1 publication Critical patent/ATE463594T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
AT07102550T 2006-03-03 2007-02-16 Lösung zur plattierung von palladium ATE463594T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006057797 2006-03-03
JP2007027861A JP4598782B2 (ja) 2006-03-03 2007-02-07 パラジウムめっき液

Publications (1)

Publication Number Publication Date
ATE463594T1 true ATE463594T1 (de) 2010-04-15

Family

ID=38254881

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07102550T ATE463594T1 (de) 2006-03-03 2007-02-16 Lösung zur plattierung von palladium

Country Status (5)

Country Link
US (1) US7887692B2 (de)
EP (1) EP1852525B1 (de)
JP (1) JP4598782B2 (de)
AT (1) ATE463594T1 (de)
DE (1) DE602007005714D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5042894B2 (ja) * 2008-03-19 2012-10-03 松田産業株式会社 電子部品およびその製造方法
EP2743273A1 (de) 2012-12-12 2014-06-18 Umicore AG & Co. KG Verfahren zur Herstellung wasserhaltiger Zubereitungen von Komplexen der Platingruppenmetalle
CN103820827A (zh) * 2014-02-24 2014-05-28 北京工业大学 一种从离子液体中电沉积钯的方法
US11946153B2 (en) 2019-02-01 2024-04-02 Ishihara Chemical Co., Ltd. Copper or copper alloy electroplating bath
JP7353249B2 (ja) 2020-08-19 2023-09-29 Ｅｅｊａ株式会社 シアン系電解銀合金めっき液
JP7833603B1 (ja) * 2025-11-05 2026-03-19 Ｅｅｊａ株式会社 パラジウムめっき液

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH572989A5 (de) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
SE8106867L (sv) * 1980-12-11 1982-06-12 Hooker Chemicals Plastics Corp Elektrolytisk avsettning av palladium och palladiumlegeringar
JPH0741697Y2 (ja) * 1990-02-21 1995-09-27 レオン自動機株式会社 菓子片の移送装置
JPH0828561B2 (ja) * 1991-01-18 1996-03-21 石原薬品株式会社 プリント配線板の製造法
JP3560250B2 (ja) * 1993-02-02 2004-09-02 新光電気工業株式会社 半導体装置用リードフレーム
JP3345529B2 (ja) 1995-06-20 2002-11-18 日立化成工業株式会社 ワイヤボンディング用端子とその製造方法並びにそのワイヤボンディング端子を用いた半導体搭載用基板の製造方法
JP3379412B2 (ja) * 1997-05-30 2003-02-24 松下電器産業株式会社 パラジウムめっき液とこれを用いたパラジウムめっき皮膜及びこのパラジウムめっき皮膜を有する半導体装置用リードフレーム
JPH11189891A (ja) * 1997-12-25 1999-07-13 Matsuda Sangyo Co Ltd パラジウム電気めっき液
JP3816241B2 (ja) * 1998-07-14 2006-08-30 株式会社大和化成研究所 金属を還元析出させるための水溶液
JP4570213B2 (ja) * 2000-01-12 2010-10-27 古河電気工業株式会社 パラジウムめっき液
JP2001335986A (ja) * 2000-05-30 2001-12-07 Matsuda Sangyo Co Ltd パラジウムめっき液

Also Published As

Publication number Publication date
EP1852525B1 (de) 2010-04-07
JP4598782B2 (ja) 2010-12-15
DE602007005714D1 (de) 2010-05-20
EP1852525A1 (de) 2007-11-07
US7887692B2 (en) 2011-02-15
US20070205109A1 (en) 2007-09-06
JP2007262573A (ja) 2007-10-11

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Legal Events

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