ATE448175T1 - Schutz von in einer fläche eines mikrostrukturierten elements mündenden hohlräumen - Google Patents

Schutz von in einer fläche eines mikrostrukturierten elements mündenden hohlräumen

Info

Publication number
ATE448175T1
ATE448175T1 AT07727715T AT07727715T ATE448175T1 AT E448175 T1 ATE448175 T1 AT E448175T1 AT 07727715 T AT07727715 T AT 07727715T AT 07727715 T AT07727715 T AT 07727715T AT E448175 T1 ATE448175 T1 AT E448175T1
Authority
AT
Austria
Prior art keywords
cavities
finishing
protection
microstructured element
microstructured
Prior art date
Application number
AT07727715T
Other languages
English (en)
Inventor
Barbara Charlet
Poche Helene Le
Yveline Gobil
Original Assignee
Commissariat Energie Atomique
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE448175T1 publication Critical patent/ATE448175T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00777—Preserve existing structures from alteration, e.g. temporary protection during manufacturing
    • B81C1/00833—Methods for preserving structures not provided for in groups B81C1/00785 - B81C1/00825
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H01J9/022—Manufacture of electrodes or electrode systems of cold cathodes
    • H01J9/025—Manufacture of electrodes or electrode systems of cold cathodes of field emission cathodes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/03—Static structures
    • B81B2203/0315—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/05—Temporary protection of devices or parts of the devices during manufacturing
    • B81C2201/053—Depositing a protective layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Materials For Medical Uses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Heat Treatment Of Articles (AREA)
  • Cold Cathode And The Manufacture (AREA)
  • Air Bags (AREA)
  • Spinning Methods And Devices For Manufacturing Artificial Fibers (AREA)
AT07727715T 2006-04-05 2007-04-03 Schutz von in einer fläche eines mikrostrukturierten elements mündenden hohlräumen ATE448175T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0651210A FR2899572B1 (fr) 2006-04-05 2006-04-05 Protection de cavites debouchant sur une face d'un element microstructure
PCT/EP2007/053244 WO2007113300A1 (fr) 2006-04-05 2007-04-03 Protection de cavites debouchant sur une face d'un element microstructure.

Publications (1)

Publication Number Publication Date
ATE448175T1 true ATE448175T1 (de) 2009-11-15

Family

ID=37467469

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07727715T ATE448175T1 (de) 2006-04-05 2007-04-03 Schutz von in einer fläche eines mikrostrukturierten elements mündenden hohlräumen

Country Status (7)

Country Link
US (1) US8153503B2 (de)
EP (1) EP2054338B1 (de)
JP (1) JP2009532836A (de)
AT (1) ATE448175T1 (de)
DE (1) DE602007003233D1 (de)
FR (1) FR2899572B1 (de)
WO (1) WO2007113300A1 (de)

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JPH05299009A (ja) * 1992-04-23 1993-11-12 New Japan Radio Co Ltd 電界放射装置
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US5559389A (en) * 1993-09-08 1996-09-24 Silicon Video Corporation Electron-emitting devices having variously constituted electron-emissive elements, including cones or pedestals
JPH07104682A (ja) * 1993-09-29 1995-04-21 Futaba Corp 電界放出陰極を用いた表示装置
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US5451830A (en) * 1994-01-24 1995-09-19 Industrial Technology Research Institute Single tip redundancy method with resistive base and resultant flat panel display
FR2715502B1 (fr) * 1994-01-26 1996-04-05 Commissariat Energie Atomique Structure présentant des cavités et procédé de réalisation d'une telle structure.
GB9416754D0 (en) * 1994-08-18 1994-10-12 Isis Innovation Field emitter structures
EP0700063A1 (de) * 1994-08-31 1996-03-06 International Business Machines Corporation Aufbau und Verfahren zur Herstellung einer Feldemissionsanordnung
US5509840A (en) * 1994-11-28 1996-04-23 Industrial Technology Research Institute Fabrication of high aspect ratio spacers for field emission display
KR100351070B1 (ko) * 1995-01-27 2003-01-29 삼성에스디아이 주식회사 전계방출표시소자의제조방법
KR100343213B1 (ko) * 1995-11-14 2002-11-27 삼성에스디아이 주식회사 전계방출소자의제조방법
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US5710483A (en) * 1996-04-08 1998-01-20 Industrial Technology Research Institute Field emission device with micromesh collimator
US5882532A (en) * 1996-05-31 1999-03-16 Hewlett-Packard Company Fabrication of single-crystal silicon structures using sacrificial-layer wafer bonding
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US6064149A (en) * 1998-02-23 2000-05-16 Micron Technology Inc. Field emission device with silicon-containing adhesion layer
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US6197607B1 (en) * 1999-03-01 2001-03-06 Micron Technology, Inc. Method of fabricating field emission arrays to optimize the size of grid openings and to minimize the occurrence of electrical shorts
US6369497B1 (en) * 1999-03-01 2002-04-09 Micron Technology, Inc. Method of fabricating row lines of a field emission array and forming pixel openings therethrough by employing two masks
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KR100480771B1 (ko) * 2000-01-05 2005-04-06 삼성에스디아이 주식회사 전계방출소자 및 그 제조방법
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Also Published As

Publication number Publication date
US8153503B2 (en) 2012-04-10
EP2054338A1 (de) 2009-05-06
FR2899572A1 (fr) 2007-10-12
WO2007113300A1 (fr) 2007-10-11
EP2054338B1 (de) 2009-11-11
US20090263920A1 (en) 2009-10-22
FR2899572B1 (fr) 2008-09-05
JP2009532836A (ja) 2009-09-10
DE602007003233D1 (de) 2009-12-24

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