ATE434178T1 - Oberflächenprüfung unter verwendung einer nicht vibrierenden kontaktpotenzialsonde - Google Patents

Oberflächenprüfung unter verwendung einer nicht vibrierenden kontaktpotenzialsonde

Info

Publication number
ATE434178T1
ATE434178T1 AT04780139T AT04780139T ATE434178T1 AT E434178 T1 ATE434178 T1 AT E434178T1 AT 04780139 T AT04780139 T AT 04780139T AT 04780139 T AT04780139 T AT 04780139T AT E434178 T1 ATE434178 T1 AT E434178T1
Authority
AT
Austria
Prior art keywords
contact potential
vibrating contact
surface testing
potential probe
contamination
Prior art date
Application number
AT04780139T
Other languages
English (en)
Inventor
M Steele
Jeffrey Hawthorne
Chunho Kim
David Sowell
Original Assignee
Qcept Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qcept Technologies Inc filed Critical Qcept Technologies Inc
Application granted granted Critical
Publication of ATE434178T1 publication Critical patent/ATE434178T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/002—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating the work function voltage
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0095—Semiconductive materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Food Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Liquid Crystal (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Measuring Leads Or Probes (AREA)
AT04780139T 2004-02-03 2004-08-05 Oberflächenprüfung unter verwendung einer nicht vibrierenden kontaktpotenzialsonde ATE434178T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/771,628 US7308367B2 (en) 2003-02-03 2004-02-03 Wafer inspection system
PCT/US2004/025249 WO2005083407A1 (en) 2004-02-03 2004-08-05 Surface inspection using a non-vibrating contact potential probe

Publications (1)

Publication Number Publication Date
ATE434178T1 true ATE434178T1 (de) 2009-07-15

Family

ID=34911306

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04780139T ATE434178T1 (de) 2004-02-03 2004-08-05 Oberflächenprüfung unter verwendung einer nicht vibrierenden kontaktpotenzialsonde

Country Status (7)

Country Link
US (1) US7308367B2 (de)
EP (1) EP1711801B1 (de)
JP (1) JP2007520721A (de)
AT (1) ATE434178T1 (de)
DE (1) DE602004021637D1 (de)
TW (1) TWI350914B (de)
WO (1) WO2005083407A1 (de)

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US7752000B2 (en) * 2008-05-02 2010-07-06 Qcept Technologies, Inc. Calibration of non-vibrating contact potential difference measurements to detect surface variations that are perpendicular to the direction of sensor motion
FR2944873B1 (fr) * 2009-04-22 2011-05-13 Centre Nat Rech Scient Systeme pour la detection de complexes d'hybridation de sondes avec des ligands specifiques, et utilisations
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TWI525317B (zh) * 2013-10-08 2016-03-11 國立清華大學 整合影像分析與資料挖礦之自動光學檢測缺陷影像分類方法
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WO2017072976A1 (ja) * 2015-10-30 2017-05-04 三菱電機株式会社 ワイヤ放電加工機、ワイヤ放電加工機の制御装置の制御方法及び位置決め方法
KR20190066011A (ko) * 2016-10-22 2019-06-12 마탄 라피닷 결함 발생 및 위치 탐지를 위한 모바일 검사 시스템
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US11181498B2 (en) 2016-11-16 2021-11-23 3M Innovative Propperties Company Temperature-independent verifying of structural integrity of materials using electrical properties
EP3545290A4 (de) 2016-11-16 2020-06-10 3M Innovative Properties Company Unterdrückung von thermisch induzierten spannungen zur überprüfung der strukturellen integrität von materialien
WO2018093906A1 (en) * 2016-11-16 2018-05-24 3M Innovative Properties Company Verifying structural integrity of materials using multiple current injection points and one or more current extraction points
WO2018093887A1 (en) 2016-11-16 2018-05-24 3M Innovative Properties Company Verifying structural integrity of materials
US10816495B2 (en) 2016-12-16 2020-10-27 3M Innovative Properties Company Verifying structural integrity of materials
EP3555606B1 (de) 2016-12-16 2022-08-17 3M Innovative Properties Company Überprüfung der struktureller integrität von materialien mittels eines referenzimpedanzes
WO2018140148A2 (en) 2016-12-16 2018-08-02 3M Innovative Properties Company Verifying structural integrity of materials
CN109405734B (zh) * 2018-12-14 2023-11-21 中核新科（天津）精密机械制造有限公司 快速高精度平面平行度测量装置及测量方法
JP7453853B2 (ja) * 2020-05-27 2024-03-21 株式会社日立製作所 処理条件決定システムおよび処理条件探索方法
CZ309031B6 (cs) * 2020-06-05 2021-12-08 Tescan Brno, S.R.O. Způsob automatické detekce požadovaného píku při opracování vzorku fokusovaným iontovým svazkem
CN113643296B (zh) * 2021-10-18 2022-02-08 季华实验室 电感元件装配质量检测方法、装置、电子设备及存储介质
US12412292B2 (en) 2022-01-19 2025-09-09 Samsung Electronics Co., Ltd. System and method for brightfield inspection of circular rotating wafers
CN116721079A (zh) * 2023-06-09 2023-09-08 西安奕斯伟材料科技股份有限公司 一种硅片表面缺陷的机器视觉识别方法、装置及介质
CN121140589A (zh) * 2025-11-18 2025-12-16 上海集迦电子科技有限公司 晶圆测距系统

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Also Published As

Publication number Publication date
TWI350914B (en) 2011-10-21
WO2005083407A1 (en) 2005-09-09
US20040241890A1 (en) 2004-12-02
US7308367B2 (en) 2007-12-11
EP1711801B1 (de) 2009-06-17
DE602004021637D1 (de) 2009-07-30
EP1711801A1 (de) 2006-10-18
JP2007520721A (ja) 2007-07-26
TW200526949A (en) 2005-08-16

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