ATE432537T1 - Piezoelektrischer aktor - Google Patents

Piezoelektrischer aktor

Info

Publication number
ATE432537T1
ATE432537T1 AT07250905T AT07250905T ATE432537T1 AT E432537 T1 ATE432537 T1 AT E432537T1 AT 07250905 T AT07250905 T AT 07250905T AT 07250905 T AT07250905 T AT 07250905T AT E432537 T1 ATE432537 T1 AT E432537T1
Authority
AT
Austria
Prior art keywords
piezoelectric
stack
internal
insulating means
internal electrodes
Prior art date
Application number
AT07250905T
Other languages
English (en)
Inventor
Michael P Cooke
Christopher A Goat
Simon R Panteny
Gordon M Reid
Original Assignee
Delphi Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from EP07250387A external-priority patent/EP1953841B1/de
Application filed by Delphi Tech Inc filed Critical Delphi Tech Inc
Application granted granted Critical
Publication of ATE432537T1 publication Critical patent/ATE432537T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/87—Electrodes or interconnections, e.g. leads or terminals
    • H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
    • H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • H10N30/503—Piezoelectric or electrostrictive devices having a stacked or multilayer structure having a non-rectangular cross-section in a plane orthogonal to the stacking direction, e.g. polygonal or circular in top view

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Electrically Driven Valve-Operating Means (AREA)
AT07250905T 2006-03-17 2007-03-05 Piezoelektrischer aktor ATE432537T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06251437 2006-03-17
EP07250387A EP1953841B1 (de) 2007-01-30 2007-01-30 Herstellungsverfahren für einen piezoelektrischen Aktor

Publications (1)

Publication Number Publication Date
ATE432537T1 true ATE432537T1 (de) 2009-06-15

Family

ID=38517068

Family Applications (1)

Application Number Title Priority Date Filing Date
AT07250905T ATE432537T1 (de) 2006-03-17 2007-03-05 Piezoelektrischer aktor

Country Status (5)

Country Link
US (1) US7839054B2 (de)
EP (1) EP1835553B1 (de)
JP (1) JP2007294904A (de)
AT (1) ATE432537T1 (de)
DE (1) DE602007001155D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8339017B2 (en) * 2005-08-29 2012-12-25 Kyocera Corporation Multi-layer piezoelectric element and injection apparatus using the same
DE102006002695A1 (de) * 2006-01-11 2007-08-09 Siemens Ag Piezostack mit neuartiger Passivierung
DE102006049323A1 (de) 2006-10-19 2008-04-24 Epcos Ag Piezoelektrisches Bauelement
ES2423954T3 (es) * 2007-01-25 2013-09-25 Petratec International Ltd. Lector de etiquetas de identificación de vehículos
US8364094B2 (en) * 2007-03-13 2013-01-29 Petratec International Ltd. Antenna assembly for service station
CN101896922B (zh) * 2007-10-19 2014-12-03 佩特拉特克国际有限公司 尤其在导电物体附近使用的rfid标签
DE102007058874A1 (de) * 2007-12-06 2010-05-20 Siemens Ag Piezoelektrisches Bauteil mit direkt strukturierter Außenkontaktierung, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
DE102007058873A1 (de) * 2007-12-06 2009-06-10 Siemens Ag Piezoelektrisches Bauteil mit Außenkontaktierung, die eine Gasphasen-Abscheidung aufweist, Verfahren zum Herstellen des Bauteils und Verwendung des Bauteils
EP2237337B1 (de) * 2007-12-26 2016-03-16 Kyocera Corporation Laminiertes piezoelektrisches element und einspritzeinrichtung und kraftstoffeinspritzsystem damit
US8258677B2 (en) 2008-07-31 2012-09-04 Siemens Aktiengesellschaft Piezoelectric component with directly structured external contacting, method for manufacturing the component and use of said component
DE102008048051B4 (de) 2008-09-19 2018-04-05 Continental Automotive Gmbh Bauelement sowie Verfahren zum Kontaktieren eines Bauelements
DE102012104830A1 (de) 2012-06-04 2013-12-05 Epcos Ag Vielschichtbauelement und Verfahren zum Herstellen eines Vielschichtbauelements
DE102012218755B4 (de) 2012-10-15 2018-07-05 Continental Automotive Gmbh Verfahren zum Herstellen eines elektronischen Bauelements als Stapel und als Stapel ausgebildetes elektronisches Bauelement
JP5993330B2 (ja) * 2013-03-18 2016-09-14 オリンパス株式会社 積層型超音波振動デバイス、積層型超音波振動デバイスの製造方法および超音波医療装置
CN106465021B (zh) 2014-08-28 2019-04-19 京瓷株式会社 压电元件及具备该压电元件的音响产生器、音响产生装置、电子设备
JPWO2017018222A1 (ja) * 2015-07-24 2018-06-07 株式会社ユーテック 圧電体膜及びその製造方法、バイモルフ素子、圧電体素子及びその製造方法
JP6477422B2 (ja) * 2015-10-30 2019-03-06 株式会社村田製作所 積層型電子部品およびその製造方法
DE102016204308A1 (de) * 2016-03-16 2017-09-21 Continental Automotive Gmbh Piezoelektrisches Aktuatorbauelement und Herstellungsverfahren zum Herstellen eines piezoelektrischen Aktuatorbauelementes
DE102019201650A1 (de) * 2019-02-08 2020-08-13 Pi Ceramic Gmbh Verfahren zur Herstellung eines piezoelektrischen Stapelaktors und piezoelektrischer Stapelaktor, vorzugsweise hergestellt nach dem Verfahren

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62239588A (ja) * 1986-04-10 1987-10-20 Nagai Denshi Kogyo Kyodo Kumiai 積層セラミツク圧電素子の製造方法
JPS6384175A (ja) 1986-09-29 1988-04-14 Toyota Motor Corp 積層型セラミツクス素子の製造方法
JPH02203578A (ja) 1989-02-01 1990-08-13 Hitachi Metals Ltd 積層型変位素子の製造方法
JP2508314B2 (ja) * 1989-11-15 1996-06-19 トヨタ自動車株式会社 積層型圧電素子の製造方法
JP2508323B2 (ja) * 1989-12-15 1996-06-19 トヨタ自動車株式会社 積層型圧電アクチュエ―タの製造方法
JPH0529680A (ja) * 1991-07-25 1993-02-05 Hitachi Metals Ltd 積層型変位素子およびその製造方法
JPH0774410A (ja) * 1994-09-06 1995-03-17 Ngk Spark Plug Co Ltd 電歪積層板の製造方法
JPH09153649A (ja) 1995-12-01 1997-06-10 Sony Corp 積層型圧電素子の製造方法
JPH10223936A (ja) * 1997-02-10 1998-08-21 Minolta Co Ltd 積層型圧電素子の製造方法
US5844349A (en) * 1997-02-11 1998-12-01 Tetrad Corporation Composite autoclavable ultrasonic transducers and methods of making
JP2000332313A (ja) * 1999-05-21 2000-11-30 Matsushita Electric Ind Co Ltd 薄膜圧電型バイモルフ素子及びその応用
US6822374B1 (en) * 2000-11-15 2004-11-23 General Electric Company Multilayer piezoelectric structure with uniform electric field
JP2004063886A (ja) * 2002-07-30 2004-02-26 Nec Tokin Corp 積層型圧電セラミック素子
JP4483275B2 (ja) * 2003-02-05 2010-06-16 株式会社デンソー 積層型圧電素子及びその製造方法
JP2005086110A (ja) * 2003-09-10 2005-03-31 Denso Corp 積層型圧電体素子
JP4934988B2 (ja) * 2004-07-27 2012-05-23 株式会社デンソー 積層型圧電体素子及び、これを用いたインジェクタ

Also Published As

Publication number Publication date
EP1835553B1 (de) 2009-05-27
US20070216265A1 (en) 2007-09-20
JP2007294904A (ja) 2007-11-08
EP1835553A1 (de) 2007-09-19
US7839054B2 (en) 2010-11-23
DE602007001155D1 (de) 2009-07-09

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Legal Events

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