ATE425234T1 - Verfahren zur herstellung von ceroxid- schleifmitteln durch einstellung der brenntemperatur von cercarbonat - Google Patents
Verfahren zur herstellung von ceroxid- schleifmitteln durch einstellung der brenntemperatur von cercarbonatInfo
- Publication number
- ATE425234T1 ATE425234T1 AT04747955T AT04747955T ATE425234T1 AT E425234 T1 ATE425234 T1 AT E425234T1 AT 04747955 T AT04747955 T AT 04747955T AT 04747955 T AT04747955 T AT 04747955T AT E425234 T1 ATE425234 T1 AT E425234T1
- Authority
- AT
- Austria
- Prior art keywords
- producing
- firing temperature
- ceriocarbonate
- ceroxide
- abrasives
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 239000003082 abrasive agent Substances 0.000 title 1
- 238000010304 firing Methods 0.000 abstract 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 229910000420 cerium oxide Inorganic materials 0.000 abstract 1
- GHLITDDQOMIBFS-UHFFFAOYSA-H cerium(3+);tricarbonate Chemical compound [Ce+3].[Ce+3].[O-]C([O-])=O.[O-]C([O-])=O.[O-]C([O-])=O GHLITDDQOMIBFS-UHFFFAOYSA-H 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 abstract 1
- 239000002994 raw material Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
- H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/20—Compounds containing only rare earth metals as the metal element
- C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
- C01F17/224—Oxides or hydroxides of lanthanides
- C01F17/235—Cerium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1409—Abrasive particles per se
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/10—Particle morphology extending in one dimension, e.g. needle-like
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003198726 | 2003-07-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE425234T1 true ATE425234T1 (de) | 2009-03-15 |
Family
ID=35476689
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04747955T ATE425234T1 (de) | 2003-07-17 | 2004-07-20 | Verfahren zur herstellung von ceroxid- schleifmitteln durch einstellung der brenntemperatur von cercarbonat |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20060120930A1 (de) |
| EP (1) | EP1646700B1 (de) |
| KR (1) | KR100637746B1 (de) |
| CN (1) | CN1701109A (de) |
| AT (1) | ATE425234T1 (de) |
| DE (1) | DE602004019925D1 (de) |
| TW (1) | TWI332981B (de) |
| WO (1) | WO2005007769A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6863825B2 (en) | 2003-01-29 | 2005-03-08 | Union Oil Company Of California | Process for removing arsenic from aqueous streams |
| JP2007231158A (ja) * | 2006-03-01 | 2007-09-13 | Mitsui Mining & Smelting Co Ltd | セリウム系研摩材 |
| US8066874B2 (en) | 2006-12-28 | 2011-11-29 | Molycorp Minerals, Llc | Apparatus for treating a flow of an aqueous solution containing arsenic |
| US8349764B2 (en) | 2007-10-31 | 2013-01-08 | Molycorp Minerals, Llc | Composition for treating a fluid |
| US8252087B2 (en) | 2007-10-31 | 2012-08-28 | Molycorp Minerals, Llc | Process and apparatus for treating a gas containing a contaminant |
| KR100922922B1 (ko) | 2007-12-28 | 2009-10-22 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
| KR100922921B1 (ko) | 2007-12-28 | 2009-10-22 | 주식회사 동부하이텍 | 이미지센서 및 그 제조방법 |
| US9233863B2 (en) | 2011-04-13 | 2016-01-12 | Molycorp Minerals, Llc | Rare earth removal of hydrated and hydroxyl species |
| DE102012018489A1 (de) | 2012-09-17 | 2014-03-20 | GM Global Technology Operations, LLC (n.d. Ges. d. Staates Delaware) | Kraftfahrzeug-Klappenanordnung |
| MX370462B (es) | 2014-03-07 | 2019-12-13 | Secure Natural Resources Llc | Oxido de cerio (iv) con propiedades de remocion de arsenico excepcionales. |
| CN104017500A (zh) * | 2014-06-11 | 2014-09-03 | 泰安麦丰新材料科技有限公司 | 一种稀土抛光粉的制备方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1610367B1 (de) * | 1996-09-30 | 2010-03-17 | Hitachi Chemical Co., Ltd. | Schleifmittel auf Basis von Ceroxid und Verfahren zum Polieren von Oberflächen |
| TW365563B (en) * | 1997-04-28 | 1999-08-01 | Seimi Chem Kk | Polishing agent for semiconductor and method for its production |
| JPH1112561A (ja) * | 1997-04-28 | 1999-01-19 | Seimi Chem Co Ltd | 半導体用研磨剤および半導体用研磨剤の製造方法 |
| KR100475976B1 (ko) * | 1998-12-25 | 2005-03-15 | 히다치 가세고교 가부시끼가이샤 | Ｃｍｐ 연마제, ｃｍｐ 연마제용 첨가액 및 기판의 연마방법 |
| US6615499B1 (en) * | 1999-05-28 | 2003-09-09 | Hitachi Chemical Co., Ltd. | Method for producing cerium oxide, cerium oxide abrasive, method for polishing substrate using the same and method for manufacturing semiconductor device |
| US6602111B1 (en) * | 1999-07-16 | 2003-08-05 | Seimi Chemical Co., Ltd. | Abrasive |
| JP2001089748A (ja) * | 1999-07-16 | 2001-04-03 | Seimi Chem Co Ltd | 研磨剤 |
| MY126099A (en) * | 2000-09-20 | 2006-09-29 | Mitsui Mining & Smelting Co | Cerium-based abrasive, method of examining quality thereof, and method of producing the same |
| JP4064636B2 (ja) * | 2001-02-07 | 2008-03-19 | 三井金属鉱業株式会社 | セリウム系研摩材粒子及びその製造方法 |
| JP4070180B2 (ja) * | 2001-05-01 | 2008-04-02 | 三井金属鉱業株式会社 | セリウム系研摩材の製造方法 |
| JP4033440B2 (ja) * | 2001-09-17 | 2008-01-16 | 三井金属鉱業株式会社 | セリウム系研摩材スラリー及びセリウム系研摩材スラリーの製造方法 |
| DE10251029A1 (de) * | 2002-11-02 | 2004-05-19 | Degussa Ag | Pyrogen hergestelltes Ceroxid |
-
2004
- 2004-07-19 TW TW093121586A patent/TWI332981B/zh active
- 2004-07-20 AT AT04747955T patent/ATE425234T1/de not_active IP Right Cessation
- 2004-07-20 EP EP04747955A patent/EP1646700B1/de not_active Not-in-force
- 2004-07-20 CN CNA2004800008667A patent/CN1701109A/zh active Pending
- 2004-07-20 US US10/528,055 patent/US20060120930A1/en not_active Abandoned
- 2004-07-20 DE DE602004019925T patent/DE602004019925D1/de active Active
- 2004-07-20 WO PCT/JP2004/010592 patent/WO2005007769A1/en active IP Right Grant
- 2004-07-20 KR KR1020057004603A patent/KR100637746B1/ko active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| DE602004019925D1 (de) | 2009-04-23 |
| TWI332981B (en) | 2010-11-11 |
| KR100637746B1 (ko) | 2006-10-24 |
| EP1646700B1 (de) | 2009-03-11 |
| US20060120930A1 (en) | 2006-06-08 |
| EP1646700A1 (de) | 2006-04-19 |
| TW200508377A (en) | 2005-03-01 |
| CN1701109A (zh) | 2005-11-23 |
| WO2005007769A1 (en) | 2005-01-27 |
| KR20050074445A (ko) | 2005-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |