ATE422709T1 - Bonding maschine um transponder zu befestigen und verfahren - Google Patents
Bonding maschine um transponder zu befestigen und verfahrenInfo
- Publication number
- ATE422709T1 ATE422709T1 AT08156368T AT08156368T ATE422709T1 AT E422709 T1 ATE422709 T1 AT E422709T1 AT 08156368 T AT08156368 T AT 08156368T AT 08156368 T AT08156368 T AT 08156368T AT E422709 T1 ATE422709 T1 AT E422709T1
- Authority
- AT
- Austria
- Prior art keywords
- chip
- substrate
- cut
- location
- procedure
- Prior art date
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- H—ELECTRICITY
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- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
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- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Power Engineering (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
- Near-Field Transmission Systems (AREA)
- Radar Systems Or Details Thereof (AREA)
- Cash Registers Or Receiving Machines (AREA)
- Supply And Installment Of Electrical Components (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58274104P | 2004-06-24 | 2004-06-24 | |
US63419004P | 2004-12-08 | 2004-12-08 |
Publications (1)
Publication Number | Publication Date |
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ATE422709T1 true ATE422709T1 (de) | 2009-02-15 |
Family
ID=35094451
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT08156368T ATE422709T1 (de) | 2004-06-24 | 2005-06-24 | Bonding maschine um transponder zu befestigen und verfahren |
Country Status (12)
Country | Link |
---|---|
US (2) | US7709294B2 (de) |
EP (1) | EP1774573A1 (de) |
JP (1) | JP2008504691A (de) |
KR (1) | KR20070058437A (de) |
AT (1) | ATE422709T1 (de) |
AU (1) | AU2005258234B2 (de) |
CA (2) | CA2571801C (de) |
DE (1) | DE602005012742D1 (de) |
ES (1) | ES2321888T3 (de) |
MX (1) | MX2007000031A (de) |
TW (1) | TWI288885B (de) |
WO (1) | WO2006002335A1 (de) |
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BR112012031670B8 (pt) * | 2010-06-14 | 2023-01-24 | Avery Dennison Corp | Método de fabricação de uma trama de estruturas condutoras |
JP2012069733A (ja) * | 2010-09-24 | 2012-04-05 | Hitachi High-Tech Instruments Co Ltd | ダイボンダの治工具管理方法、および、ダイボンダ |
EP2638510B1 (de) * | 2010-11-08 | 2019-05-22 | Smartrac Investment B.V. | Verfahren zur herstellung eines rfid-transponders |
US8865487B2 (en) * | 2011-09-20 | 2014-10-21 | General Electric Company | Large area hermetic encapsulation of an optoelectronic device using vacuum lamination |
JP2012044214A (ja) * | 2011-10-28 | 2012-03-01 | Sony Chemical & Information Device Corp | 接続装置、及び接続構造体の製造方法 |
CN104137123B (zh) * | 2011-12-29 | 2017-02-15 | 斯马特拉克 Ip 有限公司 | 通过蚀刻来生产rfid应答器的方法 |
US20150008950A1 (en) * | 2011-12-31 | 2015-01-08 | Roy E. Swart | Manufacturing advanced test probes |
CN102785032B (zh) * | 2012-08-20 | 2014-09-17 | 中国电子科技集团公司第十研究所 | 激光切割陶瓷电路基片工作台 |
DE102012223471A1 (de) * | 2012-12-17 | 2014-06-18 | Bundesdruckerei Gmbh | Verfahren und Vorrichtung zur Herstellung eines Wert- und/oder Sicherheitsdokuments mit einer Datenübertragungseinrichtung |
DE102020104817A1 (de) * | 2020-02-24 | 2021-08-26 | Philip Mangelberger | Vorrichtung und Verfahren zum Befestigen eines Transponders an einer elektrischen Leitung, Konfektionierungseinrichtung und elektrische Leitung |
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-
2005
- 2005-06-23 TW TW094120947A patent/TWI288885B/zh not_active IP Right Cessation
- 2005-06-24 MX MX2007000031A patent/MX2007000031A/es active IP Right Grant
- 2005-06-24 CA CA2571801A patent/CA2571801C/en not_active Expired - Fee Related
- 2005-06-24 AU AU2005258234A patent/AU2005258234B2/en not_active Ceased
- 2005-06-24 DE DE602005012742T patent/DE602005012742D1/de active Active
- 2005-06-24 US US11/166,534 patent/US7709294B2/en not_active Expired - Fee Related
- 2005-06-24 EP EP05764304A patent/EP1774573A1/de not_active Ceased
- 2005-06-24 CA CA002660860A patent/CA2660860A1/en not_active Abandoned
- 2005-06-24 KR KR1020077001650A patent/KR20070058437A/ko not_active Application Discontinuation
- 2005-06-24 AT AT08156368T patent/ATE422709T1/de not_active IP Right Cessation
- 2005-06-24 JP JP2007518290A patent/JP2008504691A/ja active Pending
- 2005-06-24 WO PCT/US2005/022364 patent/WO2006002335A1/en active Application Filing
- 2005-06-24 ES ES08156368T patent/ES2321888T3/es active Active
-
2010
- 2010-04-13 US US12/759,400 patent/US20100218899A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
EP1774573A1 (de) | 2007-04-18 |
DE602005012742D1 (de) | 2009-03-26 |
US20100218899A1 (en) | 2010-09-02 |
WO2006002335A1 (en) | 2006-01-05 |
CA2571801A1 (en) | 2006-01-05 |
ES2321888T3 (es) | 2009-06-12 |
MX2007000031A (es) | 2007-03-07 |
TWI288885B (en) | 2007-10-21 |
TW200606735A (en) | 2006-02-16 |
AU2005258234A1 (en) | 2006-01-05 |
US7709294B2 (en) | 2010-05-04 |
KR20070058437A (ko) | 2007-06-08 |
JP2008504691A (ja) | 2008-02-14 |
AU2005258234B2 (en) | 2008-05-01 |
CA2571801C (en) | 2010-10-19 |
US20050284917A1 (en) | 2005-12-29 |
CA2660860A1 (en) | 2006-01-05 |
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