ATE422709T1 - Bonding maschine um transponder zu befestigen und verfahren - Google Patents

Bonding maschine um transponder zu befestigen und verfahren

Info

Publication number
ATE422709T1
ATE422709T1 AT08156368T AT08156368T ATE422709T1 AT E422709 T1 ATE422709 T1 AT E422709T1 AT 08156368 T AT08156368 T AT 08156368T AT 08156368 T AT08156368 T AT 08156368T AT E422709 T1 ATE422709 T1 AT E422709T1
Authority
AT
Austria
Prior art keywords
chip
substrate
cut
location
procedure
Prior art date
Application number
AT08156368T
Other languages
English (en)
Inventor
Eric Eckstein
Thomas Clare
Andre Cote
Original Assignee
Checkpoint Systems Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Checkpoint Systems Inc filed Critical Checkpoint Systems Inc
Application granted granted Critical
Publication of ATE422709T1 publication Critical patent/ATE422709T1/de

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
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    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Near-Field Transmission Systems (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Cash Registers Or Receiving Machines (AREA)
  • Supply And Installment Of Electrical Components (AREA)
AT08156368T 2004-06-24 2005-06-24 Bonding maschine um transponder zu befestigen und verfahren ATE422709T1 (de)

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US63419004P 2004-12-08 2004-12-08

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EP (1) EP1774573A1 (de)
JP (1) JP2008504691A (de)
KR (1) KR20070058437A (de)
AT (1) ATE422709T1 (de)
AU (1) AU2005258234B2 (de)
CA (2) CA2571801C (de)
DE (1) DE602005012742D1 (de)
ES (1) ES2321888T3 (de)
MX (1) MX2007000031A (de)
TW (1) TWI288885B (de)
WO (1) WO2006002335A1 (de)

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ES2321888T3 (es) 2009-06-12
CA2571801C (en) 2010-10-19
TW200606735A (en) 2006-02-16
CA2571801A1 (en) 2006-01-05
AU2005258234B2 (en) 2008-05-01
US20100218899A1 (en) 2010-09-02
TWI288885B (en) 2007-10-21
CA2660860A1 (en) 2006-01-05
EP1774573A1 (de) 2007-04-18
MX2007000031A (es) 2007-03-07
JP2008504691A (ja) 2008-02-14
KR20070058437A (ko) 2007-06-08
AU2005258234A1 (en) 2006-01-05
WO2006002335A1 (en) 2006-01-05
US7709294B2 (en) 2010-05-04
DE602005012742D1 (de) 2009-03-26
US20050284917A1 (en) 2005-12-29

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