ATE422101T1 - In eine mehrschichtstruktur integrierte invertierte mikrostreifenübertragungsleitung - Google Patents

In eine mehrschichtstruktur integrierte invertierte mikrostreifenübertragungsleitung

Info

Publication number
ATE422101T1
ATE422101T1 AT00917089T AT00917089T ATE422101T1 AT E422101 T1 ATE422101 T1 AT E422101T1 AT 00917089 T AT00917089 T AT 00917089T AT 00917089 T AT00917089 T AT 00917089T AT E422101 T1 ATE422101 T1 AT E422101T1
Authority
AT
Austria
Prior art keywords
cable
transmission line
layer structure
strip transmission
micro strip
Prior art date
Application number
AT00917089T
Other languages
English (en)
Inventor
Olli Salmela
Original Assignee
Nokia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Corp filed Critical Nokia Corp
Application granted granted Critical
Publication of ATE422101T1 publication Critical patent/ATE422101T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/08—Microstrips; Strip lines
    • H01P3/081—Microstriplines
    • H01P3/084—Suspended microstriplines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Waveguides (AREA)
  • Communication Cables (AREA)
  • Optical Integrated Circuits (AREA)
  • Geophysics And Detection Of Objects (AREA)
  • Electrotherapy Devices (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Transmitters (AREA)
  • Insulated Conductors (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Push-Button Switches (AREA)
AT00917089T 1999-03-31 2000-03-30 In eine mehrschichtstruktur integrierte invertierte mikrostreifenübertragungsleitung ATE422101T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI990717A FI113580B (fi) 1999-03-31 1999-03-31 Invertoitu mikroliuska-siirtolinja monikerrosrakenteeseen integroituna

Publications (1)

Publication Number Publication Date
ATE422101T1 true ATE422101T1 (de) 2009-02-15

Family

ID=8554327

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00917089T ATE422101T1 (de) 1999-03-31 2000-03-30 In eine mehrschichtstruktur integrierte invertierte mikrostreifenübertragungsleitung

Country Status (11)

Country Link
US (1) US6714104B1 (de)
EP (1) EP1166385B1 (de)
JP (1) JP4170594B2 (de)
CN (1) CN1192452C (de)
AT (1) ATE422101T1 (de)
AU (1) AU758158B2 (de)
BR (1) BR0008596A (de)
CA (1) CA2367036C (de)
DE (1) DE60041484D1 (de)
FI (1) FI113580B (de)
WO (1) WO2000062368A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814702A (en) * 1996-02-20 1998-09-29 General Electric Company Elastomer composition and thermoplastic resin composition modified therewith
US20050190019A1 (en) * 2004-02-27 2005-09-01 Carsten Metz Low-loss transmission line structure
JP2009302606A (ja) * 2008-06-10 2009-12-24 Nippon Telegr & Teleph Corp <Ntt> 伝送線路及び伝送線路の製造方法
CN105514554A (zh) * 2016-01-07 2016-04-20 北京同方吉兆科技有限公司 一种适用于大功率传输的倒置微带线结构
KR102891999B1 (ko) * 2020-12-30 2025-12-01 삼성전자주식회사 삽입 손실을 줄이기 위한 전송 선로 구조 및 이를 포함하는 전자 장치
CN115842227A (zh) * 2021-09-22 2023-03-24 康普技术有限责任公司 移相器及其制造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3904997A (en) 1973-09-13 1975-09-09 Microwave Ass Trapped-radiation microwave transmission line
US5105055A (en) * 1990-10-17 1992-04-14 Digital Equipment Corporation Tunnelled multiconductor system and method
JPH04368005A (ja) 1991-06-14 1992-12-21 Sanyo Electric Co Ltd マイクロ波伝送線路
WO1993002485A1 (fr) 1991-07-19 1993-02-04 Fujitsu Limited Ligne microruban et procede de fabrication
JP2983169B2 (ja) 1996-03-07 1999-11-29 株式会社移動体通信先端技術研究所 高周波用伝送線路の製造方法
JP3218996B2 (ja) * 1996-11-28 2001-10-15 松下電器産業株式会社 ミリ波導波路
US6590161B1 (en) * 1998-12-22 2003-07-08 Lk A/S Electrical cable

Also Published As

Publication number Publication date
BR0008596A (pt) 2002-01-08
FI113580B (fi) 2004-05-14
CN1346524A (zh) 2002-04-24
JP4170594B2 (ja) 2008-10-22
DE60041484D1 (de) 2009-03-19
CA2367036A1 (en) 2000-10-19
EP1166385A1 (de) 2002-01-02
CA2367036C (en) 2010-06-29
FI990717L (fi) 2000-10-01
JP2002542641A (ja) 2002-12-10
CN1192452C (zh) 2005-03-09
FI990717A0 (fi) 1999-03-31
AU3821100A (en) 2000-11-14
US6714104B1 (en) 2004-03-30
EP1166385B1 (de) 2009-01-28
AU758158B2 (en) 2003-03-20
WO2000062368A1 (en) 2000-10-19

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