ATE414328T1 - Vertikal kontaktierte, übereinander gestapelte chips - Google Patents

Vertikal kontaktierte, übereinander gestapelte chips

Info

Publication number
ATE414328T1
ATE414328T1 AT02745398T AT02745398T ATE414328T1 AT E414328 T1 ATE414328 T1 AT E414328T1 AT 02745398 T AT02745398 T AT 02745398T AT 02745398 T AT02745398 T AT 02745398T AT E414328 T1 ATE414328 T1 AT E414328T1
Authority
AT
Austria
Prior art keywords
contact surface
contact
another
surface zones
size
Prior art date
Application number
AT02745398T
Other languages
German (de)
English (en)
Inventor
Thomas Grassl
Original Assignee
Giesecke & Devrient Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke & Devrient Gmbh filed Critical Giesecke & Devrient Gmbh
Application granted granted Critical
Publication of ATE414328T1 publication Critical patent/ATE414328T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/20—Configurations of stacked chips
    • H10W90/297—Configurations of stacked chips characterised by the through-semiconductor vias [TSVs] in the stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Bipolar Transistors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Battery Mounting, Suspending (AREA)
  • Crushing And Grinding (AREA)
AT02745398T 2001-06-21 2002-06-20 Vertikal kontaktierte, übereinander gestapelte chips ATE414328T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE10130864A DE10130864A1 (de) 2001-06-21 2001-06-21 Vertikal kontaktierte, übereinander gestapelte Chips

Publications (1)

Publication Number Publication Date
ATE414328T1 true ATE414328T1 (de) 2008-11-15

Family

ID=7689553

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02745398T ATE414328T1 (de) 2001-06-21 2002-06-20 Vertikal kontaktierte, übereinander gestapelte chips

Country Status (6)

Country Link
EP (1) EP1402575B1 (enExample)
JP (1) JP4481638B2 (enExample)
AT (1) ATE414328T1 (enExample)
AU (1) AU2002316990A1 (enExample)
DE (2) DE10130864A1 (enExample)
WO (1) WO2003001597A2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8124429B2 (en) * 2006-12-15 2012-02-28 Richard Norman Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
WO2008137511A1 (en) 2007-05-04 2008-11-13 Crossfire Technologies, Inc. Accessing or interconnecting integrated circuits

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61206249A (ja) * 1985-03-11 1986-09-12 Hitachi Ltd 積層半導体集積回路装置
EP0481703B1 (en) * 1990-10-15 2003-09-17 Aptix Corporation Interconnect substrate having integrated circuit for programmable interconnection and sample testing
US5424589A (en) * 1993-02-12 1995-06-13 The Board Of Trustees Of The Leland Stanford Junior University Electrically programmable inter-chip interconnect architecture
DE4314907C1 (de) * 1993-05-05 1994-08-25 Siemens Ag Verfahren zur Herstellung von vertikal miteinander elektrisch leitend kontaktierten Halbleiterbauelementen
DE19702121C1 (de) * 1997-01-22 1998-06-18 Siemens Ag Verfahren zur Herstellung von vertikalen Chipverbindungen
DE19813239C1 (de) * 1998-03-26 1999-12-23 Fraunhofer Ges Forschung Verdrahtungsverfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur und vertikale integrierte Schaltungsstruktur
JP2001127243A (ja) * 1999-10-26 2001-05-11 Sharp Corp 積層半導体装置

Also Published As

Publication number Publication date
JP2004531083A (ja) 2004-10-07
AU2002316990A1 (en) 2003-01-08
WO2003001597A2 (de) 2003-01-03
JP4481638B2 (ja) 2010-06-16
EP1402575B1 (de) 2008-11-12
EP1402575A2 (de) 2004-03-31
WO2003001597A3 (de) 2003-12-18
DE10130864A1 (de) 2003-01-02
DE50213010D1 (de) 2008-12-24

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Legal Events

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