ATE414328T1 - Vertikal kontaktierte, übereinander gestapelte chips - Google Patents
Vertikal kontaktierte, übereinander gestapelte chipsInfo
- Publication number
- ATE414328T1 ATE414328T1 AT02745398T AT02745398T ATE414328T1 AT E414328 T1 ATE414328 T1 AT E414328T1 AT 02745398 T AT02745398 T AT 02745398T AT 02745398 T AT02745398 T AT 02745398T AT E414328 T1 ATE414328 T1 AT E414328T1
- Authority
- AT
- Austria
- Prior art keywords
- contact surface
- contact
- another
- surface zones
- size
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10D89/00
- H01L25/0657—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
- H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes
- H01L2225/04—All the devices being of a type provided for in the same main group of the same subclass of class H10, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same main group of the same subclass of class H10
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Semiconductor Integrated Circuits (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Battery Mounting, Suspending (AREA)
- Crushing And Grinding (AREA)
- Bipolar Transistors (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10130864A DE10130864A1 (de) | 2001-06-21 | 2001-06-21 | Vertikal kontaktierte, übereinander gestapelte Chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE414328T1 true ATE414328T1 (de) | 2008-11-15 |
Family
ID=7689553
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT02745398T ATE414328T1 (de) | 2001-06-21 | 2002-06-20 | Vertikal kontaktierte, übereinander gestapelte chips |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1402575B1 (enExample) |
| JP (1) | JP4481638B2 (enExample) |
| AT (1) | ATE414328T1 (enExample) |
| AU (1) | AU2002316990A1 (enExample) |
| DE (2) | DE10130864A1 (enExample) |
| WO (1) | WO2003001597A2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8124429B2 (en) * | 2006-12-15 | 2012-02-28 | Richard Norman | Reprogrammable circuit board with alignment-insensitive support for multiple component contact types |
| WO2008137511A1 (en) | 2007-05-04 | 2008-11-13 | Crossfire Technologies, Inc. | Accessing or interconnecting integrated circuits |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61206249A (ja) * | 1985-03-11 | 1986-09-12 | Hitachi Ltd | 積層半導体集積回路装置 |
| DE69133311T2 (de) * | 1990-10-15 | 2004-06-24 | Aptix Corp., San Jose | Verbindungssubstrat mit integrierter Schaltung zur programmierbaren Verbindung und Probenuntersuchung |
| US5424589A (en) * | 1993-02-12 | 1995-06-13 | The Board Of Trustees Of The Leland Stanford Junior University | Electrically programmable inter-chip interconnect architecture |
| DE4314907C1 (de) * | 1993-05-05 | 1994-08-25 | Siemens Ag | Verfahren zur Herstellung von vertikal miteinander elektrisch leitend kontaktierten Halbleiterbauelementen |
| DE19702121C1 (de) * | 1997-01-22 | 1998-06-18 | Siemens Ag | Verfahren zur Herstellung von vertikalen Chipverbindungen |
| DE19813239C1 (de) * | 1998-03-26 | 1999-12-23 | Fraunhofer Ges Forschung | Verdrahtungsverfahren zur Herstellung einer vertikalen integrierten Schaltungsstruktur und vertikale integrierte Schaltungsstruktur |
| JP2001127243A (ja) * | 1999-10-26 | 2001-05-11 | Sharp Corp | 積層半導体装置 |
-
2001
- 2001-06-21 DE DE10130864A patent/DE10130864A1/de not_active Withdrawn
-
2002
- 2002-06-20 AU AU2002316990A patent/AU2002316990A1/en not_active Abandoned
- 2002-06-20 DE DE50213010T patent/DE50213010D1/de not_active Expired - Lifetime
- 2002-06-20 AT AT02745398T patent/ATE414328T1/de not_active IP Right Cessation
- 2002-06-20 EP EP02745398A patent/EP1402575B1/de not_active Expired - Lifetime
- 2002-06-20 JP JP2003507891A patent/JP4481638B2/ja not_active Expired - Fee Related
- 2002-06-20 WO PCT/EP2002/006861 patent/WO2003001597A2/de not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004531083A (ja) | 2004-10-07 |
| WO2003001597A3 (de) | 2003-12-18 |
| EP1402575A2 (de) | 2004-03-31 |
| DE10130864A1 (de) | 2003-01-02 |
| EP1402575B1 (de) | 2008-11-12 |
| DE50213010D1 (de) | 2008-12-24 |
| WO2003001597A2 (de) | 2003-01-03 |
| JP4481638B2 (ja) | 2010-06-16 |
| AU2002316990A1 (en) | 2003-01-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| REN | Ceased due to non-payment of the annual fee |