ATE413363T1 - Vorrichtung und verfahren zur hermetischen abdichtung eines hohlraums in einem elektronischen bauteil - Google Patents

Vorrichtung und verfahren zur hermetischen abdichtung eines hohlraums in einem elektronischen bauteil

Info

Publication number
ATE413363T1
ATE413363T1 AT05824668T AT05824668T ATE413363T1 AT E413363 T1 ATE413363 T1 AT E413363T1 AT 05824668 T AT05824668 T AT 05824668T AT 05824668 T AT05824668 T AT 05824668T AT E413363 T1 ATE413363 T1 AT E413363T1
Authority
AT
Austria
Prior art keywords
cavity
electronic component
hermetic sealing
sealing device
cap
Prior art date
Application number
AT05824668T
Other languages
English (en)
Inventor
Aymeric Lai
Original Assignee
Commissariat Energie Atomique
Centre Nat Etd Spatiales
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat Energie Atomique, Centre Nat Etd Spatiales filed Critical Commissariat Energie Atomique
Application granted granted Critical
Publication of ATE413363T1 publication Critical patent/ATE413363T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00277—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00293—Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS maintaining a controlled atmosphere with processes not provided for in B81C1/00285
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0145—Hermetically sealing an opening in the lid
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/73—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control for cooling by change of state

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Casings For Electric Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
AT05824668T 2004-12-15 2005-12-13 Vorrichtung und verfahren zur hermetischen abdichtung eines hohlraums in einem elektronischen bauteil ATE413363T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0452994A FR2879184B1 (fr) 2004-12-15 2004-12-15 Dispositif et procede de fermeture hermetique d'une cavite d'un compose electronique.

Publications (1)

Publication Number Publication Date
ATE413363T1 true ATE413363T1 (de) 2008-11-15

Family

ID=34953626

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05824668T ATE413363T1 (de) 2004-12-15 2005-12-13 Vorrichtung und verfahren zur hermetischen abdichtung eines hohlraums in einem elektronischen bauteil

Country Status (7)

Country Link
US (1) US7816770B2 (de)
EP (1) EP1824779B1 (de)
JP (1) JP2008524838A (de)
AT (1) ATE413363T1 (de)
DE (1) DE602005010904D1 (de)
FR (1) FR2879184B1 (de)
WO (1) WO2006064158A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5982972B2 (ja) * 2012-04-10 2016-08-31 日本電気株式会社 真空パッケージ、センサ、および真空パッケージの製造方法
JP5982973B2 (ja) * 2012-04-10 2016-08-31 日本電気株式会社 真空パッケージ、真空パッケージの製造方法およびセンサ
CN116504765B (zh) * 2023-04-27 2023-12-08 盐城矽润半导体有限公司 一种大功率二极管模组
US20260081334A1 (en) * 2024-03-05 2026-03-19 Google Llc Thermalized pocketed cryogenic circulator with ground tuning

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS618957A (ja) * 1984-06-25 1986-01-16 Hitachi Ltd 電子装置の組立方法
DE3433046A1 (de) * 1984-09-08 1986-03-20 Basf Ag, 6700 Ludwigshafen Verfahren zum verschliessen des spaltes zwischen den enden von auf formzylindern aufgespannten tiefdruckplatten
US4732042A (en) * 1986-04-22 1988-03-22 Motorola Inc. Cast membrane protected pressure sensor
US4733872A (en) * 1986-06-16 1988-03-29 Nobuyuki Sugimura Fusible packing for a supply port of an accumulator
JPH01244651A (ja) * 1988-03-26 1989-09-29 Nec Corp セラミックパッケージ型半導体装置
US6586841B1 (en) * 2000-02-23 2003-07-01 Onix Microsystems, Inc. Mechanical landing pad formed on the underside of a MEMS device
US6247493B1 (en) * 2000-03-09 2001-06-19 Richard C. Henderson Miniature pulsatile flow controller
CA2312646A1 (en) * 2000-06-28 2001-12-28 Institut National D'optique Hybrid micropackaging of microdevices
CN1240981C (zh) * 2000-10-10 2006-02-08 约翰·格兰威尔·派林斯 用于饮料容器的存储装置
JP3721986B2 (ja) * 2000-12-20 2005-11-30 日立電線株式会社 半導体装置及びその製造方法
JP3712982B2 (ja) * 2002-02-06 2005-11-02 株式会社ケーヒン 電子回路基板の収容ケース
JP3991274B2 (ja) * 2003-05-19 2007-10-17 セイコーエプソン株式会社 圧電デバイス
FR2898597B1 (fr) * 2006-03-16 2008-09-19 Commissariat Energie Atomique Encapsulation dans une cavite hermetique d'un compose microelectronique, notamment d'un mems

Also Published As

Publication number Publication date
EP1824779B1 (de) 2008-11-05
DE602005010904D1 (de) 2008-12-18
WO2006064158A1 (fr) 2006-06-22
US20090261535A1 (en) 2009-10-22
JP2008524838A (ja) 2008-07-10
FR2879184A1 (fr) 2006-06-16
US7816770B2 (en) 2010-10-19
EP1824779A1 (de) 2007-08-29
FR2879184B1 (fr) 2007-03-09

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