ATE401550T1 - Verfahren und vorrichtung zur bestimmung des verziehens einer halbleiterscheibe - Google Patents

Verfahren und vorrichtung zur bestimmung des verziehens einer halbleiterscheibe

Info

Publication number
ATE401550T1
ATE401550T1 AT00962314T AT00962314T ATE401550T1 AT E401550 T1 ATE401550 T1 AT E401550T1 AT 00962314 T AT00962314 T AT 00962314T AT 00962314 T AT00962314 T AT 00962314T AT E401550 T1 ATE401550 T1 AT E401550T1
Authority
AT
Austria
Prior art keywords
determining
warping
gravity
support members
semiconductor disc
Prior art date
Application number
AT00962314T
Other languages
English (en)
Inventor
Joachim Schober
Original Assignee
Nxp Bv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nxp Bv filed Critical Nxp Bv
Application granted granted Critical
Publication of ATE401550T1 publication Critical patent/ATE401550T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/32—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring the deformation in a solid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
    • G01B21/30—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring roughness or irregularity of surfaces
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • G01B5/0004—Supports
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0011—Arrangements for eliminating or compensation of measuring errors due to temperature or weight
    • G01B5/0016—Arrangements for eliminating or compensation of measuring errors due to temperature or weight due to weight

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
AT00962314T 1999-08-31 2000-08-14 Verfahren und vorrichtung zur bestimmung des verziehens einer halbleiterscheibe ATE401550T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP99890278 1999-08-31

Publications (1)

Publication Number Publication Date
ATE401550T1 true ATE401550T1 (de) 2008-08-15

Family

ID=8244006

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00962314T ATE401550T1 (de) 1999-08-31 2000-08-14 Verfahren und vorrichtung zur bestimmung des verziehens einer halbleiterscheibe

Country Status (8)

Country Link
US (1) US6567169B1 (de)
EP (1) EP1125096B1 (de)
JP (1) JP2003508736A (de)
KR (1) KR100728402B1 (de)
AT (1) ATE401550T1 (de)
DE (1) DE60039491D1 (de)
TW (1) TW544510B (de)
WO (1) WO2001016559A1 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4469462B2 (ja) * 2000-05-25 2010-05-26 株式会社ニコン キャリア形状測定機
WO2007015772A2 (en) * 2005-07-27 2007-02-08 Corning Incorporated Apparatus and method for measuring a glass sheet
JP7364037B2 (ja) * 2020-03-09 2023-10-18 村田機械株式会社 平面度測定ユニット

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2641958A (en) * 1951-01-09 1953-06-16 Theodor W Zobel Method and test equipment for measuring the quality of glass surfaces of unusually large dimensions under different supporting and loading conditions
JPS549903B2 (de) * 1973-03-31 1979-04-28
FR2494428A1 (fr) * 1980-11-18 1982-05-21 Jacquot Jules Platine de mesure a grand debattement et tres haute sensibilite
JP2704734B2 (ja) * 1988-09-05 1998-01-26 キヤノン株式会社 ステージ位置決め補正方法及び装置
US5424552A (en) * 1991-07-09 1995-06-13 Nikon Corporation Projection exposing apparatus
DE4231205A1 (de) 1992-09-18 1994-03-24 Siemens Ag Verfahren zur Bestimmung mechanischer Spannungen in einem Verbundkörper sowie Verwendung dieses Verfahrens
US6122036A (en) * 1993-10-21 2000-09-19 Nikon Corporation Projection exposure apparatus and method
JP3401769B2 (ja) * 1993-12-28 2003-04-28 株式会社ニコン 露光方法、ステージ装置、及び露光装置
US5671054A (en) * 1995-07-18 1997-09-23 Nikon Corporation Method and apparatus for measuring position of pattern formed on a substrate having a thickness
US5924058A (en) * 1997-02-14 1999-07-13 Applied Materials, Inc. Permanently mounted reference sample for a substrate measurement tool

Also Published As

Publication number Publication date
KR100728402B1 (ko) 2007-06-13
EP1125096A1 (de) 2001-08-22
US6567169B1 (en) 2003-05-20
DE60039491D1 (de) 2008-08-28
JP2003508736A (ja) 2003-03-04
TW544510B (en) 2003-08-01
KR20010085968A (ko) 2001-09-07
WO2001016559A1 (en) 2001-03-08
EP1125096B1 (de) 2008-07-16

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties