ATE403522T1 - Vorrichtung und verfahren zum positionieren von elektronischen chips - Google Patents

Vorrichtung und verfahren zum positionieren von elektronischen chips

Info

Publication number
ATE403522T1
ATE403522T1 AT05848175T AT05848175T ATE403522T1 AT E403522 T1 ATE403522 T1 AT E403522T1 AT 05848175 T AT05848175 T AT 05848175T AT 05848175 T AT05848175 T AT 05848175T AT E403522 T1 ATE403522 T1 AT E403522T1
Authority
AT
Austria
Prior art keywords
die
electronic chips
positioning electronic
polishing
autocollimator
Prior art date
Application number
AT05848175T
Other languages
English (en)
Inventor
Joseph Rubin
Timothy Hazeldine
Original Assignee
Ultra Tec Mfg Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultra Tec Mfg Inc filed Critical Ultra Tec Mfg Inc
Application granted granted Critical
Publication of ATE403522T1 publication Critical patent/ATE403522T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Wire Bonding (AREA)
AT05848175T 2004-11-10 2005-11-09 Vorrichtung und verfahren zum positionieren von elektronischen chips ATE403522T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/985,680 US7066788B2 (en) 2004-11-10 2004-11-10 Electronic die positioning device and method

Publications (1)

Publication Number Publication Date
ATE403522T1 true ATE403522T1 (de) 2008-08-15

Family

ID=36316935

Family Applications (1)

Application Number Title Priority Date Filing Date
AT05848175T ATE403522T1 (de) 2004-11-10 2005-11-09 Vorrichtung und verfahren zum positionieren von elektronischen chips

Country Status (5)

Country Link
US (1) US7066788B2 (de)
EP (1) EP1809439B1 (de)
AT (1) ATE403522T1 (de)
DE (1) DE602005008762D1 (de)
WO (1) WO2006053057A1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2225069A2 (de) * 2007-12-19 2010-09-08 Nxp B.V. Schleifung eines aufnahme- und ablegewerkzeugs
US9496187B2 (en) * 2013-11-20 2016-11-15 Globalfoundries Singapore Pte. Ltd. Setup for multiple cross-section sample preparation
JP6274956B2 (ja) * 2014-04-17 2018-02-07 株式会社ディスコ 研削装置
CN107206566B (zh) 2014-11-12 2021-05-18 伊利诺斯工具制品有限公司 平面研磨机
US9782687B2 (en) 2016-01-12 2017-10-10 Gracewood Management, Inc. Magnetic construction block toy set
US10573547B1 (en) 2018-11-05 2020-02-25 Honeywell Federal Manufacturing & Technologies, Llc Apparatus and method for facilitating planar delayering of integrated circuit die
KR102387021B1 (ko) * 2019-12-19 2022-04-15 김동현 퓨징 브래지어
GB2614526A (en) * 2021-11-16 2023-07-12 Element Six Tech Ltd Method and apparatus for processing diamond surface
KR102511111B1 (ko) * 2021-12-20 2023-03-17 주식회사 인텍코포레이션 디레이어링용 폴리싱 장치

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4159422A (en) * 1977-10-26 1979-06-26 Shigeo Okubo Temperature stable displacement sensor with fine resolution
US4812654A (en) * 1986-12-29 1989-03-14 The Charles Stark Draper Laboratory, Inc. Two-axis quartz fiber passive tilt meter
US5337144A (en) * 1990-06-19 1994-08-09 Applied Materials, Inc. Etch rate monitor using collimated light and method of using same
US6614529B1 (en) * 1992-12-28 2003-09-02 Applied Materials, Inc. In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization
US5891352A (en) * 1993-09-16 1999-04-06 Luxtron Corporation Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment
JP3270282B2 (ja) * 1994-02-21 2002-04-02 株式会社東芝 半導体製造装置及び半導体装置の製造方法
US6075606A (en) * 1996-02-16 2000-06-13 Doan; Trung T. Endpoint detector and method for measuring a change in wafer thickness in chemical-mechanical polishing of semiconductor wafers and other microelectronic substrates
US6151100A (en) * 1996-12-12 2000-11-21 Canon Kabushiki Kaisha Positioning system
JP3454658B2 (ja) * 1997-02-03 2003-10-06 大日本スクリーン製造株式会社 研磨処理モニター装置
US6010392A (en) * 1998-02-17 2000-01-04 International Business Machines Corporation Die thinning apparatus
US6007409A (en) * 1998-04-08 1999-12-28 Taiwan Semiconductor Manufacturing Company, Ltd. Sample holder for parallel lapping tool and method of using
US6448801B2 (en) * 1998-06-05 2002-09-10 Advanced Micro Devices, Inc. Method and device for supporting flip chip circuitry in analysis
US6139403A (en) * 1998-06-05 2000-10-31 Advanced Micro Devices Method and device for positioning and accessing a die under analysis
US6335208B1 (en) * 1999-05-10 2002-01-01 Intersil Americas Inc. Laser decapsulation method
US6726528B2 (en) * 2002-05-14 2004-04-27 Strasbaugh Polishing pad with optical sensor
US6506097B1 (en) * 2000-01-18 2003-01-14 Applied Materials, Inc. Optical monitoring in a two-step chemical mechanical polishing process
US6309899B1 (en) * 2000-02-22 2001-10-30 Advanced Micro Devices, Inc. Method and system for removing a die from a semiconductor package
US6483071B1 (en) * 2000-05-16 2002-11-19 General Scanning Inc. Method and system for precisely positioning a waist of a material-processing laser beam to process microstructures within a laser-processing site
US6429028B1 (en) * 2000-08-29 2002-08-06 Dpa Labs, Incorporated Process to remove semiconductor chips from a plastic package
US6368886B1 (en) * 2000-09-15 2002-04-09 The Charles Stark Draper Laboratory, Inc. Method of recovering encapsulated die
US6672947B2 (en) * 2001-03-13 2004-01-06 Nptest, Llc Method for global die thinning and polishing of flip-chip packaged integrated circuits
US6517666B2 (en) * 2001-03-27 2003-02-11 Advanced Micro Devices, Inc. Automatic decapsulation system utilizing an integrated spacer/protection plate
US20040014401A1 (en) * 2001-08-07 2004-01-22 Chun-Cheng Tsao Method for backside die thinning and polishing of packaged integrated circuits
US6709888B2 (en) * 2002-07-26 2004-03-23 Motorola, Inc. Method of decapsulating a packaged copper-technology integrated circuit

Also Published As

Publication number Publication date
EP1809439A4 (de) 2007-12-12
US20060099886A1 (en) 2006-05-11
US7066788B2 (en) 2006-06-27
EP1809439A1 (de) 2007-07-25
WO2006053057A1 (en) 2006-05-18
DE602005008762D1 (de) 2008-09-18
EP1809439B1 (de) 2008-08-06

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