ATE397992T1 - Verfahren und vorrichtung zum tauchbeloten - Google Patents
Verfahren und vorrichtung zum tauchbelotenInfo
- Publication number
- ATE397992T1 ATE397992T1 AT02250154T AT02250154T ATE397992T1 AT E397992 T1 ATE397992 T1 AT E397992T1 AT 02250154 T AT02250154 T AT 02250154T AT 02250154 T AT02250154 T AT 02250154T AT E397992 T1 ATE397992 T1 AT E397992T1
- Authority
- AT
- Austria
- Prior art keywords
- solder
- leads
- circuit board
- plate
- piloting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0100626A GB2371006B (en) | 2001-01-10 | 2001-01-10 | Nozzle for soldering apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE397992T1 true ATE397992T1 (de) | 2008-07-15 |
Family
ID=9906572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT02250154T ATE397992T1 (de) | 2001-01-10 | 2002-01-10 | Verfahren und vorrichtung zum tauchbeloten |
Country Status (5)
Country | Link |
---|---|
US (1) | US7650851B2 (de) |
EP (1) | EP1222988B1 (de) |
AT (1) | ATE397992T1 (de) |
DE (2) | DE20200554U1 (de) |
GB (1) | GB2371006B (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050069668A1 (en) * | 2003-09-30 | 2005-03-31 | Daodang Hung Q. | Disk lubricant tank insert to suppress lubricant surface waves |
US7358856B2 (en) * | 2004-03-18 | 2008-04-15 | Savi Technology, Inc. | Two-phase commit synchronizing seal state |
JP4370225B2 (ja) * | 2004-08-19 | 2009-11-25 | 住友電装株式会社 | プリント基板への端子実装方法、該方法で形成した端子実装プリント基板および該端子実装プリント基板を収容している電気接続箱 |
US8590765B2 (en) * | 2010-02-26 | 2013-11-26 | Panasonic Corporation | Soldering apparatus |
DE102013110731B3 (de) * | 2013-09-27 | 2014-11-06 | Ersa Gmbh | Trennstreifen-Anordnung für Lötdüse, sowie Lötdüseneinrichtung zum selektiven Wellenlöten |
DE102018105388A1 (de) * | 2018-03-08 | 2019-09-12 | Ersa Gmbh | Lötdüse und Lötanlage |
US20190337075A1 (en) * | 2018-05-01 | 2019-11-07 | Artos Engineering Company | Systems and devices for improved solder dispensing |
JP7340388B2 (ja) * | 2019-08-21 | 2023-09-07 | 株式会社デンソーテン | はんだ付け装置 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2770875A (en) * | 1952-06-09 | 1956-11-20 | Motorola Inc | Soldering machine |
US3056370A (en) * | 1955-10-14 | 1962-10-02 | Fry S Metal Foundries Ltd | Apparatus for soldering |
US3196829A (en) * | 1963-02-21 | 1965-07-27 | Fry S Metal Foundries Ltd | Soldering machines |
US3151592A (en) * | 1963-05-20 | 1964-10-06 | Howard W Wegener | Sump and nozzle for soldering machines |
US3303983A (en) * | 1964-11-12 | 1967-02-14 | Gen Dynamics Corp | Ultrasonic soldering apparatus |
US3565319A (en) * | 1967-05-15 | 1971-02-23 | Banner Ind Inc | Apparatus for application of solder to circuit boards |
US4527731A (en) * | 1983-03-31 | 1985-07-09 | At&T Technologies, Inc. | Method and apparatus for applying stripes of solder to articles |
US4545520A (en) * | 1983-08-30 | 1985-10-08 | At&T Technologies, Inc. | Method and system for soldering insulation coated parts |
EP0147000A1 (de) * | 1983-12-15 | 1985-07-03 | Hollis Automation Inc. | Massen-Lötwellensystem-I |
US4684056A (en) * | 1985-05-03 | 1987-08-04 | Electrovert Limited | Vibratory wave soldering |
US4739919A (en) * | 1987-06-15 | 1988-04-26 | Northern Telecom Limited | Masking of circuit boards for wave soldering |
US4981249A (en) * | 1988-08-31 | 1991-01-01 | Matsushita Electric Industrial Co., Ltd. | Automatic jet soldering apparatus |
US5203489A (en) * | 1991-12-06 | 1993-04-20 | Electrovert Ltd. | Gas shrouded wave soldering |
US5227589A (en) * | 1991-12-23 | 1993-07-13 | Motorola, Inc. | Plated-through interconnect solder thief |
US5611480A (en) * | 1992-03-03 | 1997-03-18 | Pillarhouse International Limited | Soldering process |
US5679927A (en) * | 1993-05-13 | 1997-10-21 | Communications Technology Corporation | Buried service wire closure |
US5604333A (en) * | 1994-11-30 | 1997-02-18 | Intel Corporation | Process and structure for a solder thief on circuit boards |
DE19506874C1 (de) * | 1995-02-16 | 1996-04-25 | Ersa Loettechnik Gmbh | Schwall-Lötdüse |
US5679929A (en) * | 1995-07-28 | 1997-10-21 | Solectron Corporqtion | Anti-bridging pads for printed circuit boards and interconnecting substrates |
JPH09107181A (ja) * | 1995-08-07 | 1997-04-22 | Nippon Superia Shiya:Kk | 噴流式はんだ付け装置 |
JPH09323165A (ja) * | 1996-06-04 | 1997-12-16 | Sharp Corp | 噴流半田槽ノズル |
JPH1070360A (ja) * | 1996-08-28 | 1998-03-10 | Toshiba Corp | 半田付装置 |
GB9703790D0 (en) * | 1997-02-24 | 1997-04-16 | Pillarhouse Int Ltd | Soldering apparatus |
GB2360237B (en) * | 2000-03-16 | 2003-09-03 | Evenoak Ltd | Nozzle for soldering apparatus |
-
2001
- 2001-01-10 GB GB0100626A patent/GB2371006B/en not_active Expired - Fee Related
-
2002
- 2002-01-10 US US10/044,798 patent/US7650851B2/en not_active Expired - Fee Related
- 2002-01-10 AT AT02250154T patent/ATE397992T1/de not_active IP Right Cessation
- 2002-01-10 DE DE20200554U patent/DE20200554U1/de not_active Expired - Lifetime
- 2002-01-10 EP EP02250154A patent/EP1222988B1/de not_active Expired - Lifetime
- 2002-01-10 DE DE60227015T patent/DE60227015D1/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1222988A3 (de) | 2003-02-12 |
US7650851B2 (en) | 2010-01-26 |
DE60227015D1 (de) | 2008-07-24 |
DE20200554U1 (de) | 2002-05-29 |
EP1222988B1 (de) | 2008-06-11 |
GB2371006A (en) | 2002-07-17 |
US20020110636A1 (en) | 2002-08-15 |
EP1222988A2 (de) | 2002-07-17 |
GB2371006B (en) | 2005-05-04 |
GB0100626D0 (en) | 2001-02-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |