GB2360237B - Nozzle for soldering apparatus - Google Patents

Nozzle for soldering apparatus

Info

Publication number
GB2360237B
GB2360237B GB0006402A GB0006402A GB2360237B GB 2360237 B GB2360237 B GB 2360237B GB 0006402 A GB0006402 A GB 0006402A GB 0006402 A GB0006402 A GB 0006402A GB 2360237 B GB2360237 B GB 2360237B
Authority
GB
United Kingdom
Prior art keywords
nozzle
soldering apparatus
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0006402A
Other versions
GB0006402D0 (en
GB2360237A (en
Inventor
Michael Tombs
Charles Kent
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evenoak Ltd
Original Assignee
Evenoak Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evenoak Ltd filed Critical Evenoak Ltd
Priority to GB0006402A priority Critical patent/GB2360237B/en
Publication of GB0006402D0 publication Critical patent/GB0006402D0/en
Publication of GB2360237A publication Critical patent/GB2360237A/en
Application granted granted Critical
Publication of GB2360237B publication Critical patent/GB2360237B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB0006402A 2000-03-16 2000-03-16 Nozzle for soldering apparatus Expired - Fee Related GB2360237B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0006402A GB2360237B (en) 2000-03-16 2000-03-16 Nozzle for soldering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0006402A GB2360237B (en) 2000-03-16 2000-03-16 Nozzle for soldering apparatus

Publications (3)

Publication Number Publication Date
GB0006402D0 GB0006402D0 (en) 2000-05-03
GB2360237A GB2360237A (en) 2001-09-19
GB2360237B true GB2360237B (en) 2003-09-03

Family

ID=9887780

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0006402A Expired - Fee Related GB2360237B (en) 2000-03-16 2000-03-16 Nozzle for soldering apparatus

Country Status (1)

Country Link
GB (1) GB2360237B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2371006B (en) 2001-01-10 2005-05-04 Evenoak Ltd Nozzle for soldering apparatus
SG117410A1 (en) * 2002-05-03 2005-12-29 Casem Asia Pte Ltd Method and apparatus for dispensing solder
NL1024476C2 (en) * 2003-10-07 2005-04-08 Vitronics Soltec B V Device for selective soldering of components on a print plate with classical connecting wires includes means to blow oxygen on solder to make sure its flow in correct direction to prevent formation of bridges between connecting wires
US20060186183A1 (en) * 2005-02-18 2006-08-24 Speedline Technologies, Inc. Wave solder nozzle
KR101089648B1 (en) * 2009-12-24 2011-12-06 삼성전기주식회사 Apparatus for wave soldering
JP6590232B1 (en) * 2019-04-22 2019-10-16 千住金属工業株式会社 Soldering apparatus and soldering method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1110892A (en) * 1965-04-28 1968-04-24 British Aircraft Corp Ltd Improvements relating to wave soldering
GB2008013A (en) * 1977-08-31 1979-05-31 Frys Metals Ltd Improvements in wave soldering machines
GB2146564A (en) * 1983-09-09 1985-04-24 Dolphin Machinery Soldering apparatus
EP0212911A2 (en) * 1985-08-09 1987-03-04 Dolphin Machinery Limited Soldering apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1110892A (en) * 1965-04-28 1968-04-24 British Aircraft Corp Ltd Improvements relating to wave soldering
GB2008013A (en) * 1977-08-31 1979-05-31 Frys Metals Ltd Improvements in wave soldering machines
GB2146564A (en) * 1983-09-09 1985-04-24 Dolphin Machinery Soldering apparatus
EP0212911A2 (en) * 1985-08-09 1987-03-04 Dolphin Machinery Limited Soldering apparatus

Also Published As

Publication number Publication date
GB0006402D0 (en) 2000-05-03
GB2360237A (en) 2001-09-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20070316