SG117410A1 - Method and apparatus for dispensing solder - Google Patents

Method and apparatus for dispensing solder

Info

Publication number
SG117410A1
SG117410A1 SG200202667A SG200202667A SG117410A1 SG 117410 A1 SG117410 A1 SG 117410A1 SG 200202667 A SG200202667 A SG 200202667A SG 200202667 A SG200202667 A SG 200202667A SG 117410 A1 SG117410 A1 SG 117410A1
Authority
SG
Singapore
Prior art keywords
dispensing solder
solder
dispensing
Prior art date
Application number
SG200202667A
Inventor
Elisabeth Anna Radec Stephanie
Michael Anastasius Gotsi Franz
Feng Yu
Original Assignee
Casem Asia Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Casem Asia Pte Ltd filed Critical Casem Asia Pte Ltd
Priority to SG200202667A priority Critical patent/SG117410A1/en
Priority to AU2003217148A priority patent/AU2003217148A1/en
Priority to PCT/SG2003/000056 priority patent/WO2003092947A1/en
Publication of SG117410A1 publication Critical patent/SG117410A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0615—Solder feeding devices forming part of a soldering iron
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Coating Apparatus (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
SG200202667A 2002-05-03 2002-05-03 Method and apparatus for dispensing solder SG117410A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
SG200202667A SG117410A1 (en) 2002-05-03 2002-05-03 Method and apparatus for dispensing solder
AU2003217148A AU2003217148A1 (en) 2002-05-03 2003-03-21 Method and apparatus for dispensing solder
PCT/SG2003/000056 WO2003092947A1 (en) 2002-05-03 2003-03-21 Method and apparatus for dispensing solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200202667A SG117410A1 (en) 2002-05-03 2002-05-03 Method and apparatus for dispensing solder

Publications (1)

Publication Number Publication Date
SG117410A1 true SG117410A1 (en) 2005-12-29

Family

ID=29398804

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200202667A SG117410A1 (en) 2002-05-03 2002-05-03 Method and apparatus for dispensing solder

Country Status (3)

Country Link
AU (1) AU2003217148A1 (en)
SG (1) SG117410A1 (en)
WO (1) WO2003092947A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707258A (en) * 1969-03-26 1972-12-26 Klaus Schlitt Soldering gun for one-handed manipulation
US5042708A (en) * 1990-09-24 1991-08-27 International Business Machines Corporation Solder placement nozzle assembly
WO2001089753A1 (en) * 2000-05-24 2001-11-29 Casem (Asia) Pte Ltd Improved apparatus and method for dispensing solder

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4420110A (en) * 1981-10-05 1983-12-13 Materials Technology Corporation Non-wetting articles and method for soldering operations
GB2360237B (en) * 2000-03-16 2003-09-03 Evenoak Ltd Nozzle for soldering apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3707258A (en) * 1969-03-26 1972-12-26 Klaus Schlitt Soldering gun for one-handed manipulation
US5042708A (en) * 1990-09-24 1991-08-27 International Business Machines Corporation Solder placement nozzle assembly
WO2001089753A1 (en) * 2000-05-24 2001-11-29 Casem (Asia) Pte Ltd Improved apparatus and method for dispensing solder

Also Published As

Publication number Publication date
WO2003092947A1 (en) 2003-11-13
AU2003217148A1 (en) 2003-11-17
WO2003092947A8 (en) 2004-03-18

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