ATE393472T1 - Herstellungsverfahren für einen elektronischen modul mit einem aktiven bauteil auf einem substrat - Google Patents
Herstellungsverfahren für einen elektronischen modul mit einem aktiven bauteil auf einem substratInfo
- Publication number
- ATE393472T1 ATE393472T1 AT03292810T AT03292810T ATE393472T1 AT E393472 T1 ATE393472 T1 AT E393472T1 AT 03292810 T AT03292810 T AT 03292810T AT 03292810 T AT03292810 T AT 03292810T AT E393472 T1 ATE393472 T1 AT E393472T1
- Authority
- AT
- Austria
- Prior art keywords
- active component
- electronic module
- substrate
- production method
- base
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 title 1
- 230000004927 fusion Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/05001—Internal layers
- H01L2224/0502—Disposition
- H01L2224/05023—Disposition the whole internal layer protruding from the surface
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/05001—Internal layers
- H01L2224/05075—Plural internal layers
- H01L2224/0508—Plural internal layers being stacked
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0554—External layer
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- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- H01L2224/13001—Core members of the bump connector
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H01L2224/818—Bonding techniques
- H01L2224/81894—Direct bonding, i.e. joining surfaces by means of intermolecular attracting interactions at their interfaces, e.g. covalent bonds, van der Waals forces
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12043—Photo diode
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
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- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30105—Capacitance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Light Receiving Elements (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0215331A FR2848338B1 (fr) | 2002-12-05 | 2002-12-05 | Procede de fabrication d'un module electronique comportant un composant actif sur une embase |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE393472T1 true ATE393472T1 (de) | 2008-05-15 |
Family
ID=32310006
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03292810T ATE393472T1 (de) | 2002-12-05 | 2003-11-10 | Herstellungsverfahren für einen elektronischen modul mit einem aktiven bauteil auf einem substrat |
Country Status (6)
Country | Link |
---|---|
US (1) | US6991151B2 (de) |
EP (1) | EP1427008B1 (de) |
JP (1) | JP2004186692A (de) |
AT (1) | ATE393472T1 (de) |
DE (1) | DE60320513T2 (de) |
FR (1) | FR2848338B1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100372642C (zh) * | 2004-10-20 | 2008-03-05 | 桂迪 | 微带电容的实用焊接工艺 |
US7402509B2 (en) * | 2005-03-16 | 2008-07-22 | Intel Corporation | Method of forming self-passivating interconnects and resulting devices |
JP2007234782A (ja) * | 2006-02-28 | 2007-09-13 | Toyota Industries Corp | 複合回路基板 |
JP6546376B2 (ja) * | 2014-08-07 | 2019-07-17 | 浜松ホトニクス株式会社 | 電子部品 |
CN114784612B (zh) * | 2022-06-20 | 2022-11-11 | 深圳市埃尔法光电科技有限公司 | 一种拓扑结构激光芯片的晶圆排布方法 |
CN114784613B (zh) * | 2022-06-20 | 2022-11-11 | 深圳市埃尔法光电科技有限公司 | 一种单元化双拓扑结构的激光芯片 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3670396A (en) * | 1971-04-12 | 1972-06-20 | Us Navy | Method of making a circuit assembly |
JP2762792B2 (ja) * | 1991-08-30 | 1998-06-04 | 日本電気株式会社 | 光半導体装置 |
DE4226167C2 (de) * | 1992-08-07 | 1996-10-24 | Sel Alcatel Ag | Verfahren zum elektrisch leitenden Verbinden unter Anwendung der Flipchip-Technik |
US6013948A (en) * | 1995-11-27 | 2000-01-11 | Micron Technology, Inc. | Stackable chip scale semiconductor package with mating contacts on opposed surfaces |
JP4429564B2 (ja) * | 1999-09-09 | 2010-03-10 | 富士通株式会社 | 光部品及び電気部品の実装構造及びその方法 |
JP2002334902A (ja) * | 2001-05-09 | 2002-11-22 | Hitachi Ltd | 光素子の実装構造および実装方法 |
-
2002
- 2002-12-05 FR FR0215331A patent/FR2848338B1/fr not_active Expired - Fee Related
-
2003
- 2003-11-10 DE DE60320513T patent/DE60320513T2/de not_active Expired - Lifetime
- 2003-11-10 EP EP03292810A patent/EP1427008B1/de not_active Expired - Lifetime
- 2003-11-10 AT AT03292810T patent/ATE393472T1/de not_active IP Right Cessation
- 2003-11-14 US US10/712,357 patent/US6991151B2/en not_active Expired - Lifetime
- 2003-12-03 JP JP2003404252A patent/JP2004186692A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
EP1427008A1 (de) | 2004-06-09 |
EP1427008B1 (de) | 2008-04-23 |
DE60320513D1 (de) | 2008-06-05 |
FR2848338A1 (fr) | 2004-06-11 |
JP2004186692A (ja) | 2004-07-02 |
FR2848338B1 (fr) | 2005-05-13 |
US6991151B2 (en) | 2006-01-31 |
DE60320513T2 (de) | 2009-06-04 |
US20040108363A1 (en) | 2004-06-10 |
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