ATE388255T1 - Verwendung von im wesentlichen sauerstofffreiem, dendritischem und unbeschichtetem kupfer zur galvanischen beschichtung von druckzylindern - Google Patents

Verwendung von im wesentlichen sauerstofffreiem, dendritischem und unbeschichtetem kupfer zur galvanischen beschichtung von druckzylindern

Info

Publication number
ATE388255T1
ATE388255T1 AT01108922T AT01108922T ATE388255T1 AT E388255 T1 ATE388255 T1 AT E388255T1 AT 01108922 T AT01108922 T AT 01108922T AT 01108922 T AT01108922 T AT 01108922T AT E388255 T1 ATE388255 T1 AT E388255T1
Authority
AT
Austria
Prior art keywords
copper
dendritic
free
bath
anode
Prior art date
Application number
AT01108922T
Other languages
German (de)
English (en)
Inventor
Heinz Cohn
Original Assignee
Umicore Climeta Sas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=8177102&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE388255(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Umicore Climeta Sas filed Critical Umicore Climeta Sas
Application granted granted Critical
Publication of ATE388255T1 publication Critical patent/ATE388255T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/04—Printing plates or foils; Materials therefor metallic
    • B41N1/06—Printing plates or foils; Materials therefor metallic for relief printing or intaglio printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N3/00—Preparing for use and conserving printing surfaces
    • B41N3/003—Preparing for use and conserving printing surfaces of intaglio formes, e.g. application of a wear-resistant coating, such as chrome, on the already-engraved plate or cylinder; Preparing for reuse, e.g. removing of the Ballard shell; Correction of the engraving
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AT01108922T 2001-04-10 2001-04-10 Verwendung von im wesentlichen sauerstofffreiem, dendritischem und unbeschichtetem kupfer zur galvanischen beschichtung von druckzylindern ATE388255T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP01108922A EP1249518B1 (de) 2001-04-10 2001-04-10 Verwendung von im wesentlichen sauerstofffreiem, dendritischem und unbeschichtetem Kupfer zur galvanischen Beschichtung von Druckzylindern

Publications (1)

Publication Number Publication Date
ATE388255T1 true ATE388255T1 (de) 2008-03-15

Family

ID=8177102

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01108922T ATE388255T1 (de) 2001-04-10 2001-04-10 Verwendung von im wesentlichen sauerstofffreiem, dendritischem und unbeschichtetem kupfer zur galvanischen beschichtung von druckzylindern

Country Status (5)

Country Link
EP (1) EP1249518B1 (es)
AT (1) ATE388255T1 (es)
DE (1) DE50113696D1 (es)
ES (1) ES2301505T3 (es)
PT (1) PT1249518E (es)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2923671A (en) * 1957-03-19 1960-02-02 American Metal Climax Inc Copper electrodeposition process and anode for use in same
DE2449735A1 (de) * 1974-10-19 1976-04-29 Otto Nockemann Verfahren zur elektrolytischen abscheidung von metallen auf zylinderfoermigen gegenstaenden und vorrichtung zur durchfuehrung des verfahrens
US4736789A (en) * 1978-07-28 1988-04-12 Kennecott Corporation Apparatus and method for continuous casting of metallic strands at exceptionally high speeds using an oscillating mold assembly
JPS596736B2 (ja) * 1978-12-28 1984-02-14 日立製線株式会社 低酸素銅線の連続製造法
JPS6024198B2 (ja) * 1982-11-11 1985-06-11 日本鉱業株式会社 銅メツキ用アノード材の製造方法
JPH0867932A (ja) * 1994-08-29 1996-03-12 Mitsubishi Materials Corp 高電流密度メッキ用銅陽極
JP4123330B2 (ja) * 2001-03-13 2008-07-23 三菱マテリアル株式会社 電気メッキ用含燐銅陽極

Also Published As

Publication number Publication date
EP1249518A1 (de) 2002-10-16
EP1249518B1 (de) 2008-03-05
ES2301505T3 (es) 2008-07-01
DE50113696D1 (de) 2008-04-17
PT1249518E (pt) 2008-05-13

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Legal Events

Date Code Title Description
RZN Patent revoked