ATE385324T1 - Lichtempfindliche harzzusammensetzungen - Google Patents

Lichtempfindliche harzzusammensetzungen

Info

Publication number
ATE385324T1
ATE385324T1 AT99950005T AT99950005T ATE385324T1 AT E385324 T1 ATE385324 T1 AT E385324T1 AT 99950005 T AT99950005 T AT 99950005T AT 99950005 T AT99950005 T AT 99950005T AT E385324 T1 ATE385324 T1 AT E385324T1
Authority
AT
Austria
Prior art keywords
group
mixtures
diol
photosensitive resin
heterocyclic
Prior art date
Application number
AT99950005T
Other languages
English (en)
Inventor
Pamela Waterson
Ahmad Naiini
William Weber
Original Assignee
Arch Spec Chem Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arch Spec Chem Inc filed Critical Arch Spec Chem Inc
Application granted granted Critical
Publication of ATE385324T1 publication Critical patent/ATE385324T1/de

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/22—Polybenzoxazoles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/022—Quinonediazides
    • G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
    • G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0751—Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
AT99950005T 1998-10-01 1999-09-29 Lichtempfindliche harzzusammensetzungen ATE385324T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10269498P 1998-10-01 1998-10-01
US09/406,007 US6127086A (en) 1998-10-01 1999-09-24 Photosensitive resin compositions

Publications (1)

Publication Number Publication Date
ATE385324T1 true ATE385324T1 (de) 2008-02-15

Family

ID=26799635

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99950005T ATE385324T1 (de) 1998-10-01 1999-09-29 Lichtempfindliche harzzusammensetzungen

Country Status (8)

Country Link
US (1) US6127086A (de)
EP (1) EP1171802B1 (de)
JP (1) JP4088910B2 (de)
KR (1) KR100767197B1 (de)
AT (1) ATE385324T1 (de)
DE (1) DE69938082T2 (de)
TW (1) TWI229238B (de)
WO (1) WO2000019275A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6214516B1 (en) * 1998-10-01 2001-04-10 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
EP1554033A4 (de) * 2002-02-06 2007-12-05 Fujifilm Electronic Materials Verbesserte zusammensetzungen zur entfernung von randperlen von halbleiterbelastungspufferbeschichtungen und verfahren zu ihrer verwendung
WO2004081663A2 (en) * 2003-03-11 2004-09-23 Arch Specialty Chemicals, Inc. Novel photosensitive resin compositions
KR20060002751A (ko) * 2003-03-11 2006-01-09 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 새로운 감광성 수지 조성물들
US7195849B2 (en) * 2003-03-11 2007-03-27 Arch Specialty Chemicals, Inc. Photosensitive resin compositions
JP2007525545A (ja) * 2003-03-11 2007-09-06 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規な感光性樹脂組成物
EP1636648B1 (de) * 2003-06-05 2015-08-12 FujiFilm Electronic Materials USA, Inc. Neuartige positiv-lichtempfindliche harzzusammensetzungen
TW200512543A (en) * 2003-08-06 2005-04-01 Sumitomo Bakelite Co Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
TWI363249B (en) * 2003-10-15 2012-05-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
EP1885819A2 (de) * 2005-06-03 2008-02-13 FujiFilm Electronic Materials USA, Inc. Zusammensetzungen zur vorbehandlung
JP4530949B2 (ja) * 2005-08-29 2010-08-25 富士フイルム株式会社 感光性樹脂組成物及びそれを用いた半導体装置の製造方法
TW200927832A (en) * 2007-10-16 2009-07-01 Fujifilm Electronic Materials Novel photosensitive resin compositions
KR102605655B1 (ko) 2017-06-16 2023-11-23 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 다층 구조물
WO2021146033A1 (en) 2020-01-16 2021-07-22 Fujifilm Electronic Materials U.S.A., Inc. Dry film

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2931297A1 (de) * 1979-08-01 1981-02-19 Siemens Ag Waermebestaendige positivresists und verfahren zur herstellung waermebestaendiger reliefstrukturen
JPS57202536A (en) * 1981-06-09 1982-12-11 Fujitsu Ltd Positive type resist composition
US4684597A (en) * 1985-10-25 1987-08-04 Eastman Kodak Company Non-precipitating quinone diazide polymer containing photoresist composition with o-quinone diazide trisester as dissolution inhibitor
US5037720A (en) * 1987-07-21 1991-08-06 Hoechst Celanese Corporation Hydroxylated aromatic polyamide polymer containing bound naphthoquinone diazide photosensitizer, method of making and use
US4957846A (en) * 1988-12-27 1990-09-18 Olin Hunt Specialty Products Inc. Radiation sensitive compound and mixtures with trinuclear novolak oligomer with o-naphthoquinone diazide sulfonyl group
EP0388482B1 (de) * 1989-03-20 1994-07-06 Siemens Aktiengesellschaft Lichtempfindliches Gemisch
JPH087434B2 (ja) * 1989-10-30 1996-01-29 日本ゼオン株式会社 ポジ型レジスト組成物
JP2813033B2 (ja) * 1990-05-25 1998-10-22 東京応化工業株式会社 ポジ型感光性樹脂組成物
JP2877895B2 (ja) * 1990-05-29 1999-04-05 住友ベークライト株式会社 ポジ型感光性樹脂組成物
DE69131529T2 (de) * 1990-05-29 2000-01-20 Sumitomo Bakelite Co. Ltd., Tokio/Tokyo Positiv arbeitende lichtempfindliche Harzzusammensetzung
JPH087436B2 (ja) * 1990-07-06 1996-01-29 住友ベークライト株式会社 感光性ジアゾキノン化合物及びそれを用いたポジ型感光性樹脂組成物
JPH04251849A (ja) * 1991-01-29 1992-09-08 Fuji Photo Film Co Ltd 感電離放射線性樹脂組成物
JP3000705B2 (ja) * 1991-03-20 2000-01-17 日本ゼオン株式会社 ポジ型レジスト組成物
JPH0548063A (ja) * 1991-03-25 1993-02-26 Hitachi Ltd カラー固体撮像素子及びその製造方法
JP2817441B2 (ja) * 1991-03-29 1998-10-30 日本ゼオン株式会社 ポジ型レジスト組成物
JP2981024B2 (ja) * 1991-07-05 1999-11-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物
JPH0537720A (ja) * 1991-07-31 1993-02-12 Kuraray Co Ltd 光学読取り装置用のパツド
US5296330A (en) * 1991-08-30 1994-03-22 Ciba-Geigy Corp. Positive photoresists containing quinone diazide photosensitizer, alkali-soluble resin and tetra(hydroxyphenyl) alkane additive
US5302489A (en) * 1991-10-29 1994-04-12 E. I. Du Pont De Nemours And Company Positive photoresist compositions containing base polymer which is substantially insoluble at pH between 7 and 10, quinonediazide acid generator and silanol solubility enhancer
JP2626479B2 (ja) * 1993-06-29 1997-07-02 日本ゼオン株式会社 ポジ型レジスト組成物
JPH07168355A (ja) * 1993-12-13 1995-07-04 Sumitomo Chem Co Ltd ポジ型レジスト組成物
JPH0895240A (ja) * 1994-07-26 1996-04-12 Nippon Zeon Co Ltd ポジ型レジスト組成物
US5541033A (en) * 1995-02-01 1996-07-30 Ocg Microelectronic Materials, Inc. Selected o-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositions
JP3499032B2 (ja) * 1995-02-02 2004-02-23 ダウ コーニング アジア株式会社 放射線硬化性組成物、その硬化方法及びパターン形成方法
JP3664334B2 (ja) * 1995-04-27 2005-06-22 富士写真フイルム株式会社 ポジ型フォトレジスト組成物
JPH0915853A (ja) * 1995-04-27 1997-01-17 Fuji Photo Film Co Ltd ポジ型フォトレジスト組成物
JP3467118B2 (ja) * 1995-05-24 2003-11-17 富士写真フイルム株式会社 ポジ型フォトレジスト組成物
JPH09127690A (ja) * 1995-10-30 1997-05-16 Shin Etsu Chem Co Ltd ポジ型フォトレジスト材料
US5856065A (en) * 1996-03-27 1999-01-05 Olin Microelectronic Chemicals, Inc. Negative working photoresist composition based on polyimide primers
US6051358A (en) * 1997-11-04 2000-04-18 Shipley Company, L.L.C. Photoresist with novel photoactive compound
JP3449933B2 (ja) * 1997-12-09 2003-09-22 住友ベークライト株式会社 ポジ型感光性樹脂組成物及びそれを用いた半導体装置
JP3992351B2 (ja) * 1998-03-12 2007-10-17 住友ベークライト株式会社 ポジ型感光性樹脂組成物及びそれを用いた半導体装置
JP3369471B2 (ja) * 1998-05-29 2003-01-20 東京応化工業株式会社 ポジ型ホトレジスト組成物およびレジストパターンの形成方法
JP2000019724A (ja) * 1998-06-30 2000-01-21 Fuji Photo Film Co Ltd 感光性樹脂組成物

Also Published As

Publication number Publication date
WO2000019275A1 (en) 2000-04-06
DE69938082T2 (de) 2009-02-12
DE69938082D1 (de) 2008-03-20
KR20010088829A (ko) 2001-09-28
EP1171802B1 (de) 2008-01-30
US6127086A (en) 2000-10-03
EP1171802A4 (de) 2002-03-13
JP4088910B2 (ja) 2008-05-21
TWI229238B (en) 2005-03-11
EP1171802A1 (de) 2002-01-16
KR100767197B1 (ko) 2007-10-17
JP2002526794A (ja) 2002-08-20

Similar Documents

Publication Publication Date Title
ATE385324T1 (de) Lichtempfindliche harzzusammensetzungen
MX9504437A (es) Composiciones de revestimiento curable que contienen aditivos de carbamato.
PE11595A1 (es) Composicion topica para el cuidado personal, la cual contiene un polimero adhesivo injertado con polisiloxano y un auxiliar secante
ATE249466T1 (de) Silizium enthaltender kettenverlängerer
NO983859L (no) Beleggingssammensetninger inneholdende en bicyclo- eller spiro-ortoesterfunksjonell forbindelse
ATE342927T1 (de) Nicht-elastomere polyurethanzusammensetzungen
JPS57159865A (en) Primer composition for bonding
MXPA98001339A (es) Composiciones de revestimiento curable que contienen aditivos de carbamato.
JP2002519405A5 (de)
BR0112421A (pt) Polìmero de poliuretano sililado, e, método de fabricação do mesmo
CA2159710A1 (en) Organosilicon-Containing Materials Useful for Biomedical Devices
KR970006360A (ko) 에폭시수지 경화제 및 일액형 에폭시수지 조성물
DK392084A (da) Haerdelige materialer
ATE273348T1 (de) Latente katalysatoren für epoxidharz- härtungssysteme
JPS5744674A (en) Resin composition for coating material
CA2039050A1 (en) Curing resin composition and its cured product
KR960017808A (ko) 카르바메이트 수지 및 카르바메이트 첨가제를 함유하는 경화성 코팅 조성물
TR200100462T2 (tr) Muskarinik agonistleri ve antagonistleri
ATE195332T1 (de) Beschichtungszusammensetzung
CA2080459A1 (en) Compositions for moisture curing hot melt adhesives
DE58902340D1 (de) Hitzehaertbare beschichtungszusammensetzung auf polyurethanharnstoff-basis.
BR0115812A (pt) Composição de revestimento compreendendo um composto funcional de biciclo-ortoéster, um composto funcional de isocianato, e um composto funcional de tiol
MD940197A (ro) Oligomeri cu solidificare termică cu capacitate de penetrare şi compoziţia lichidă cu solidificare termică obţinută în baza lor pentru acoperirea suprafeţei sticlei
BR9205508A (pt) Produto de reacao de amino-diol e pelo menos uma substancia polifuncional e composicao de pintura
DK0904270T3 (da) Dihydrobenzofuran og beslægtede forbindelser anvendelige som antiinflammatoriske midler

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties