ATE372399T1 - Sputtern von lithium - Google Patents
Sputtern von lithiumInfo
- Publication number
- ATE372399T1 ATE372399T1 AT96943612T AT96943612T ATE372399T1 AT E372399 T1 ATE372399 T1 AT E372399T1 AT 96943612 T AT96943612 T AT 96943612T AT 96943612 T AT96943612 T AT 96943612T AT E372399 T1 ATE372399 T1 AT E372399T1
- Authority
- AT
- Austria
- Prior art keywords
- lithium
- sputtering
- khz
- sputtered
- coatings
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3485—Sputtering using pulsed power to the target
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
- C23C14/185—Metallic material, boron or silicon on other inorganic substrates by cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3464—Sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Secondary Cells (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/567,781 US5830336A (en) | 1995-12-05 | 1995-12-05 | Sputtering of lithium |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE372399T1 true ATE372399T1 (de) | 2007-09-15 |
Family
ID=24268620
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT96943612T ATE372399T1 (de) | 1995-12-05 | 1996-12-05 | Sputtern von lithium |
Country Status (11)
Country | Link |
---|---|
US (2) | US5830336A (de) |
EP (1) | EP0865513B1 (de) |
JP (1) | JP4059302B2 (de) |
KR (1) | KR19990071940A (de) |
AT (1) | ATE372399T1 (de) |
AU (1) | AU703062B2 (de) |
BR (1) | BR9611887A (de) |
CA (1) | CA2238319C (de) |
DE (1) | DE69637232T2 (de) |
ES (1) | ES2293652T3 (de) |
WO (1) | WO1997020962A1 (de) |
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-
1995
- 1995-12-05 US US08/567,781 patent/US5830336A/en not_active Expired - Lifetime
-
1996
- 1996-12-05 EP EP96943612A patent/EP0865513B1/de not_active Expired - Lifetime
- 1996-12-05 BR BR9611887A patent/BR9611887A/pt not_active Application Discontinuation
- 1996-12-05 WO PCT/US1996/019408 patent/WO1997020962A1/en active IP Right Grant
- 1996-12-05 ES ES96943612T patent/ES2293652T3/es not_active Expired - Lifetime
- 1996-12-05 AT AT96943612T patent/ATE372399T1/de not_active IP Right Cessation
- 1996-12-05 DE DE69637232T patent/DE69637232T2/de not_active Expired - Lifetime
- 1996-12-05 JP JP52144297A patent/JP4059302B2/ja not_active Expired - Lifetime
- 1996-12-05 CA CA002238319A patent/CA2238319C/en not_active Expired - Fee Related
- 1996-12-05 KR KR1019980704228A patent/KR19990071940A/ko not_active Application Discontinuation
- 1996-12-05 AU AU12810/97A patent/AU703062B2/en not_active Ceased
-
1997
- 1997-05-29 US US08/865,544 patent/US6039850A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69637232T2 (de) | 2008-01-03 |
WO1997020962A1 (en) | 1997-06-12 |
KR19990071940A (ko) | 1999-09-27 |
ES2293652T3 (es) | 2008-03-16 |
EP0865513A4 (de) | 2001-02-21 |
AU703062B2 (en) | 1999-03-11 |
EP0865513B1 (de) | 2007-09-05 |
AU1281097A (en) | 1997-06-27 |
CA2238319A1 (en) | 1997-06-12 |
BR9611887A (pt) | 1999-02-17 |
EP0865513A1 (de) | 1998-09-23 |
CA2238319C (en) | 2001-04-17 |
US5830336A (en) | 1998-11-03 |
DE69637232D1 (de) | 2007-10-18 |
US6039850A (en) | 2000-03-21 |
JP2000509100A (ja) | 2000-07-18 |
JP4059302B2 (ja) | 2008-03-12 |
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