ATE371962T1 - Verfahren zur bildung einer hochfrequenzantenne aus leitfähigen tinten - Google Patents
Verfahren zur bildung einer hochfrequenzantenne aus leitfähigen tintenInfo
- Publication number
- ATE371962T1 ATE371962T1 AT01920313T AT01920313T ATE371962T1 AT E371962 T1 ATE371962 T1 AT E371962T1 AT 01920313 T AT01920313 T AT 01920313T AT 01920313 T AT01920313 T AT 01920313T AT E371962 T1 ATE371962 T1 AT E371962T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- conductive ink
- electrical
- frequency antenna
- short
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
- H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole
- H01Q9/26—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole with folded element or elements, the folded parts being spaced apart a small fraction of operating wavelength
- H01Q9/27—Spiral antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
- H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
- H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49016—Antenna or wave energy "plumbing" making
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Details Of Aerials (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Conductive Materials (AREA)
- Geophysics And Detection Of Objects (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/524,505 US6476775B1 (en) | 2000-03-13 | 2000-03-13 | Method for forming radio frequency antenna |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE371962T1 true ATE371962T1 (de) | 2007-09-15 |
Family
ID=24089485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT01920313T ATE371962T1 (de) | 2000-03-13 | 2001-03-13 | Verfahren zur bildung einer hochfrequenzantenne aus leitfähigen tinten |
Country Status (6)
Country | Link |
---|---|
US (3) | US6476775B1 (de) |
EP (1) | EP1266426B1 (de) |
AT (1) | ATE371962T1 (de) |
AU (1) | AU2001247384A1 (de) |
DE (1) | DE60130199T2 (de) |
WO (1) | WO2001069717A1 (de) |
Families Citing this family (37)
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FR2769390B1 (fr) * | 1997-10-08 | 2003-02-14 | Gemplus Card Int | Procede de fabrication de cartes a puce aptes a assurer un fonctionnement a contact et sans contact, et de cartes a puce sans contact |
US6925068B1 (en) * | 1999-05-21 | 2005-08-02 | Wi-Lan, Inc. | Method and apparatus for allocating bandwidth in a wireless communication system |
US7268740B2 (en) * | 2000-03-13 | 2007-09-11 | Rcd Technology Inc. | Method for forming radio frequency antenna |
US7394425B2 (en) * | 2001-03-26 | 2008-07-01 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
US6693541B2 (en) * | 2001-07-19 | 2004-02-17 | 3M Innovative Properties Co | RFID tag with bridge circuit assembly and methods of use |
EP1315234A1 (de) * | 2001-11-26 | 2003-05-28 | Eta SA Fabriques d'Ebauches | VHF-Empfangsantenne integriert in das Armband einer tragbaren elektronischen Vorrichtung |
SG102646A1 (en) * | 2001-12-07 | 2004-03-26 | Advanced Systems Automation | Apparatus and method for direct transfer of an electrolytically formed antenna |
US20030130015A1 (en) * | 2002-01-09 | 2003-07-10 | Mctaggart Stephen I. | Paper printed radio |
KR100464005B1 (ko) * | 2002-02-01 | 2004-12-30 | 엘지전자 주식회사 | 마이크로파 소자 제조방법 |
US20040200061A1 (en) | 2003-04-11 | 2004-10-14 | Coleman James P. | Conductive pattern and method of making |
US7930815B2 (en) * | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
US7120987B2 (en) * | 2003-08-05 | 2006-10-17 | Avery Dennison Corporation | Method of making RFID device |
US7370808B2 (en) * | 2004-01-12 | 2008-05-13 | Symbol Technologies, Inc. | Method and system for manufacturing radio frequency identification tag antennas |
US7255782B2 (en) * | 2004-04-30 | 2007-08-14 | Kenneth Crouse | Selective catalytic activation of non-conductive substrates |
US20060012482A1 (en) * | 2004-07-16 | 2006-01-19 | Peter Zalud | Radio frequency identification tag having an inductively coupled antenna |
US20100026442A1 (en) * | 2004-08-31 | 2010-02-04 | Koninklijke Philips Electronics N.V. | Method of manufacturing an RFID antenna |
US7315248B2 (en) * | 2005-05-13 | 2008-01-01 | 3M Innovative Properties Company | Radio frequency identification tags for use on metal or other conductive objects |
US7651032B2 (en) * | 2005-06-22 | 2010-01-26 | Smurfit-Stone Container Enterprises, Inc. | Methods and systems for in-line RFID transponder assembly |
US8786510B2 (en) * | 2006-01-24 | 2014-07-22 | Avery Dennison Corporation | Radio frequency (RF) antenna containing element and methods of making the same |
US7642916B2 (en) * | 2006-03-23 | 2010-01-05 | Xerox Corporation | RFID bridge antenna |
US20090033582A1 (en) * | 2006-06-01 | 2009-02-05 | Blenkhorn Gary P | RFID tags and antennas and methods of their manufacture |
US7901533B2 (en) * | 2006-06-30 | 2011-03-08 | Tamarack Products, Inc. | Method of making an RFID article |
JP4855880B2 (ja) * | 2006-09-20 | 2012-01-18 | リンテック株式会社 | アンテナ回路、アンテナ回路の製造方法、icインレット、icタグ |
TW200919327A (en) * | 2007-10-29 | 2009-05-01 | China Steel Corp | Three-dimensional wireless identification label adhered onto metal |
US20090128417A1 (en) * | 2007-11-16 | 2009-05-21 | Rcd Technology, Inc. | Electroless/electrolytic seed layer process |
US7870665B2 (en) * | 2008-03-28 | 2011-01-18 | Ibiden Co., Ltd. | Method of manufacturing a conductor circuit, and a coil sheet and laminated coil |
JP2009266134A (ja) * | 2008-04-29 | 2009-11-12 | Shinwa Kogyo Kk | 非接触カード又はタグ用アンテナの製造方法並びに非接触カード又はタグ用アンテナ |
BR122020013215B8 (pt) | 2010-06-14 | 2023-01-24 | Avery Dennison Corp | Substrato tendo uma estrutura condutora |
US8646695B2 (en) | 2010-10-01 | 2014-02-11 | Disney Enterprises, Inc. | Combined HF and UHF RFID device |
FI125720B (fi) | 2011-05-19 | 2016-01-29 | Tecnomar Oy | Rullalta rullalle -massavalmistukseen soveltuva sähköisten siltojen valmistusmenetelmä |
DE102011087588A1 (de) * | 2011-12-01 | 2013-06-06 | Endress + Hauser Conducta Gesellschaft für Mess- und Regeltechnik mbH + Co. KG | Feldgerät für die Automatisierungstechnik |
US8967472B2 (en) | 2012-05-02 | 2015-03-03 | Disney Enterprises, Inc. | High frequency antenna formed on a compound surface |
USD776664S1 (en) * | 2015-05-20 | 2017-01-17 | Chaya Coleena Hendrick | Smart card |
KR20170089668A (ko) * | 2016-01-27 | 2017-08-04 | 엘지전자 주식회사 | 안테나를 구비하는 와치 타입의 이동 단말기 |
JP6776867B2 (ja) | 2016-12-15 | 2020-10-28 | Tdk株式会社 | 配線部品 |
JP6776868B2 (ja) | 2016-12-15 | 2020-10-28 | Tdk株式会社 | 平面コイルの製造方法 |
EP4327347A4 (de) * | 2021-04-19 | 2024-10-09 | Jabil Inc | Gedruckte spule und antennenabstimmung |
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US6462711B1 (en) * | 2001-04-02 | 2002-10-08 | Comsat Corporation | Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing |
US7363705B2 (en) * | 2003-02-04 | 2008-04-29 | Microfabrica, Inc. | Method of making a contact |
US6948231B2 (en) * | 2002-05-21 | 2005-09-27 | International Business Machines Corporation | Method of depositing material into high aspect ratio features |
US6849936B1 (en) | 2002-09-25 | 2005-02-01 | Lsi Logic Corporation | System and method for using film deposition techniques to provide an antenna within an integrated circuit package |
US20040070510A1 (en) | 2002-10-15 | 2004-04-15 | Yimin Zhang | Radio frequency wetness detection system |
-
2000
- 2000-03-13 US US09/524,505 patent/US6476775B1/en not_active Expired - Fee Related
-
2001
- 2001-03-13 AT AT01920313T patent/ATE371962T1/de not_active IP Right Cessation
- 2001-03-13 DE DE60130199T patent/DE60130199T2/de not_active Expired - Fee Related
- 2001-03-13 AU AU2001247384A patent/AU2001247384A1/en not_active Abandoned
- 2001-03-13 EP EP01920313A patent/EP1266426B1/de not_active Expired - Lifetime
- 2001-03-13 WO PCT/US2001/007897 patent/WO2001069717A1/en active IP Right Grant
-
2002
- 2002-09-11 US US10/238,598 patent/US6933892B2/en not_active Expired - Fee Related
-
2005
- 2005-07-26 US US11/189,503 patent/US7639184B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20050253772A1 (en) | 2005-11-17 |
US6933892B2 (en) | 2005-08-23 |
EP1266426A1 (de) | 2002-12-18 |
EP1266426B1 (de) | 2007-08-29 |
US20030011523A1 (en) | 2003-01-16 |
AU2001247384A1 (en) | 2001-09-24 |
US6476775B1 (en) | 2002-11-05 |
WO2001069717A1 (en) | 2001-09-20 |
EP1266426A4 (de) | 2004-12-08 |
DE60130199D1 (de) | 2007-10-11 |
US7639184B2 (en) | 2009-12-29 |
WO2001069717A9 (en) | 2003-01-09 |
DE60130199T2 (de) | 2008-05-21 |
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