ATE368266T1 - Rfid-einrichtung und herstellungsverfahren - Google Patents

Rfid-einrichtung und herstellungsverfahren

Info

Publication number
ATE368266T1
ATE368266T1 AT04816794T AT04816794T ATE368266T1 AT E368266 T1 ATE368266 T1 AT E368266T1 AT 04816794 T AT04816794 T AT 04816794T AT 04816794 T AT04816794 T AT 04816794T AT E368266 T1 ATE368266 T1 AT E368266T1
Authority
AT
Austria
Prior art keywords
substrate
conductive pattern
layer
antenna
seed layer
Prior art date
Application number
AT04816794T
Other languages
English (en)
Inventor
Peikang Liu
Stephen Kennedy
Christine Dang
Scott Ferguson
Jason Munn
Original Assignee
Avery Dennison Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avery Dennison Corp filed Critical Avery Dennison Corp
Application granted granted Critical
Publication of ATE368266T1 publication Critical patent/ATE368266T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Details Of Aerials (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AT04816794T 2003-08-05 2004-08-04 Rfid-einrichtung und herstellungsverfahren ATE368266T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/634,243 US7120987B2 (en) 2003-08-05 2003-08-05 Method of making RFID device

Publications (1)

Publication Number Publication Date
ATE368266T1 true ATE368266T1 (de) 2007-08-15

Family

ID=34116007

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04816794T ATE368266T1 (de) 2003-08-05 2004-08-04 Rfid-einrichtung und herstellungsverfahren

Country Status (10)

Country Link
US (2) US7120987B2 (de)
EP (1) EP1656636B1 (de)
KR (1) KR20060080916A (de)
CN (1) CN100414564C (de)
AT (1) ATE368266T1 (de)
AU (1) AU2004284716A1 (de)
CA (1) CA2534730A1 (de)
DE (1) DE602004007807T2 (de)
ES (1) ES2289596T3 (de)
WO (1) WO2005041121A2 (de)

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6468638B2 (en) * 1999-03-16 2002-10-22 Alien Technology Corporation Web process interconnect in electronic assemblies
US7564409B2 (en) * 2001-03-26 2009-07-21 Ertek Inc. Antennas and electrical connections of electrical devices
US6606247B2 (en) 2001-05-31 2003-08-12 Alien Technology Corporation Multi-feature-size electronic structures
US7253735B2 (en) 2003-03-24 2007-08-07 Alien Technology Corporation RFID tags and processes for producing RFID tags
US7120987B2 (en) * 2003-08-05 2006-10-17 Avery Dennison Corporation Method of making RFID device
US7398054B2 (en) 2003-08-29 2008-07-08 Zih Corp. Spatially selective UHF near field microstrip coupler device and RFID systems using device
US8596532B2 (en) * 2004-06-10 2013-12-03 Zih Corp. Apparatus and method for communicating with an RFID transponder
US7292148B2 (en) * 2004-06-18 2007-11-06 Avery Dennison Corporation Method of variable position strap mounting for RFID transponder
US7688206B2 (en) 2004-11-22 2010-03-30 Alien Technology Corporation Radio frequency identification (RFID) tag for an item having a conductive layer included or attached
KR101038494B1 (ko) * 2004-12-28 2011-06-01 삼성테크윈 주식회사 Ｒｆｉｄ 태그용 안테나 제조 방법
US20070040686A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
CN101361231A (zh) * 2005-12-16 2009-02-04 Fci公司 卷曲方法及由此制造的器件
KR100746635B1 (ko) 2006-03-21 2007-08-06 삼성전기주식회사 Ｒｆｉｄ 시스템의 태그 및 그 제조 방법
US20080129455A1 (en) * 2006-05-24 2008-06-05 Rcd Technology Inc. Method for forming rfid tags
KR100854104B1 (ko) * 2006-12-11 2008-08-26 한국생산기술연구원 Ｒｆｉｄ 태그 제조 방법, ｒｆｉｄ 태그 및 ｒｆｉｄ태그용 전기 연결 부재
DE102006060801B4 (de) * 2006-12-22 2009-03-19 Infineon Technologies Ag Verfahren zur Herstellung eines Chipkartenmoduls und Chipkartenmodul
JP4952280B2 (ja) * 2007-02-09 2012-06-13 富士通株式会社 電子装置製造システムおよび電子装置製造方法
EP1978472A3 (de) * 2007-04-06 2015-04-22 Semiconductor Energy Laboratory Co., Ltd. Halbleiterbauelement und Verfahren zu seiner Herstellung
DE102007022615A1 (de) * 2007-05-15 2008-11-20 Infineon Technologies Ag Kontaktloses Übertragungssystem und Verfahren zum Herstellen desselben
TW200919327A (en) * 2007-10-29 2009-05-01 China Steel Corp Three-dimensional wireless identification label adhered onto metal
US9108434B2 (en) * 2007-12-18 2015-08-18 Zih Corp. RFID near-field antenna and associated systems
DE102008024790A1 (de) 2008-05-23 2009-12-10 Smartrac Ip B.V. Antennenanordnung für eine Chipkarte
JP5199010B2 (ja) * 2008-10-01 2013-05-15 富士通株式会社 Ｒｆｉｄタグの製造方法およびｒｆｉｄタグ
US8450893B2 (en) 2008-11-06 2013-05-28 Aisan Kogyo Kabushiki Kaisha Motor structure with planar coil type rotation detector
KR101555232B1 (ko) * 2008-12-15 2015-09-23 스마트랙 아이피 비.브이. 식각법을 이용한 구성품 제조 방법
WO2010070964A1 (ja) * 2008-12-16 2010-06-24 株式会社村田製作所 回路モジュール及びその管理方法
FR2944124B1 (fr) 2009-04-03 2012-05-11 Paragon Identification Etiquette d'identification de radio frequence(rfid) et procede de fabrication de l'etiquette
US20100301006A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Component on a Substrate
US20100301005A1 (en) * 2009-05-29 2010-12-02 Nilsson Peter L J Method of Manufacturing an Electrical Circuit on a Substrate
US8221753B2 (en) 2009-09-30 2012-07-17 Tracon Pharmaceuticals, Inc. Endoglin antibodies
DE102010005714B4 (de) * 2010-01-26 2019-03-14 Schreiner Group Gmbh & Co. Kg Sicherheitsanhänger, Anordnung mit einem Sicherheitsanhänger und Verfahren zum Betreiben eines Sicherheitsanhängers
US9299021B2 (en) * 2010-11-11 2016-03-29 Avery Dennison Corporation RFID devices and methods for manufacturing
EP2729546A1 (de) 2011-07-05 2014-05-14 Avery Dennison Corporation Waschfester klebstoff für getränkeetiketten
EP2544300A1 (de) * 2011-07-08 2013-01-09 Tyco Electronics Belgium EC BVBA Gedruckte Antenne
US9634391B2 (en) 2011-08-08 2017-04-25 Féinics Amatech Teoranta RFID transponder chip modules
US9489613B2 (en) 2011-08-08 2016-11-08 Féinics Amatech Teoranta RFID transponder chip modules with a band of the antenna extending inward
US9622359B2 (en) 2011-08-08 2017-04-11 Féinics Amatech Teoranta RFID transponder chip modules
US9812782B2 (en) 2011-08-08 2017-11-07 Féinics Amatech Teoranta Coupling frames for RFID devices
CN103036022A (zh) * 2011-10-10 2013-04-10 启碁科技股份有限公司 便携式电子装置及其天线结构和天线制作方法
US11502551B2 (en) 2012-07-06 2022-11-15 Energous Corporation Wirelessly charging multiple wireless-power receivers using different subsets of an antenna array to focus energy at different locations
US10965164B2 (en) 2012-07-06 2021-03-30 Energous Corporation Systems and methods of wirelessly delivering power to a receiver device
US12057715B2 (en) 2012-07-06 2024-08-06 Energous Corporation Systems and methods of wirelessly delivering power to a wireless-power receiver device in response to a change of orientation of the wireless-power receiver device
US10992185B2 (en) 2012-07-06 2021-04-27 Energous Corporation Systems and methods of using electromagnetic waves to wirelessly deliver power to game controllers
UA115789C2 (uk) 2012-09-05 2017-12-26 Трейкон Фармасутікалз, Інк. Композиція антитіла до cd105 та її застосування
US10248902B1 (en) 2017-11-06 2019-04-02 Féinics Amatech Teoranta Coupling frames for RFID devices
US10839282B2 (en) 2014-03-08 2020-11-17 Féinics Amatech Teoranta RFID transponder chip modules, elements thereof, and methods
AU2015346444A1 (en) 2014-11-12 2017-05-04 Tracon Pharmaceuticals, Inc. Anti-endoglin antibodies and uses thereof
US9926375B2 (en) 2014-11-12 2018-03-27 Tracon Pharmaceuticals, Inc. Anti-endoglin antibodies and uses thereof
WO2017055917A1 (en) 2015-10-01 2017-04-06 Star Systems International, Ltd. Switchable radio-frequency identification tag device
WO2018183892A1 (en) 2017-03-30 2018-10-04 Energous Corporation Flat antennas having two or more resonant frequencies for use in wireless power transmission systems
US10511097B2 (en) 2017-05-12 2019-12-17 Energous Corporation Near-field antennas for accumulating energy at a near-field distance with minimal far-field gain
US11462949B2 (en) 2017-05-16 2022-10-04 Wireless electrical Grid LAN, WiGL Inc Wireless charging method and system
US12074460B2 (en) 2017-05-16 2024-08-27 Wireless Electrical Grid Lan, Wigl Inc. Rechargeable wireless power bank and method of using
US11342798B2 (en) 2017-10-30 2022-05-24 Energous Corporation Systems and methods for managing coexistence of wireless-power signals and data signals operating in a same frequency band
ES2732716B2 (es) * 2018-05-25 2021-10-04 Fundacio Privada Elisava Escola Univ Dispositivo de comunicacion previsto para disponerse sobre la piel de un usuario
CN109379460B (zh) 2018-10-15 2019-11-26 华为技术有限公司 镜头、主动发光模组及终端
EP3921945A1 (de) 2019-02-06 2021-12-15 Energous Corporation Systeme und verfahren zur schätzung der optimalen phasen zur verwendung für einzelne antennen in einer antennenanordnung
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
US11329371B2 (en) * 2019-10-17 2022-05-10 Mediatek Inc. Antenna device including antenna and substrate generated with non-opaque material
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
EP4418459A2 (de) 2019-12-28 2024-08-21 Avery Dennison Retail Information Services LLC Radiofrequenzidentifikationsetiketten für dreidimensionale objekte
CN115087985A (zh) 2019-12-28 2022-09-20 艾利丹尼森零售信息服务有限公司 与电抗型连接带联用的调谐组件方法和系统
US20210249168A1 (en) * 2020-02-11 2021-08-12 Dupont Electronics, Inc. Plated copper conductor structures for self-resonant sensor and manufacture thereof
USD942538S1 (en) 2020-07-30 2022-02-01 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
USD943024S1 (en) 2020-07-30 2022-02-08 Federal Card Services, LLC Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3944777A (en) * 1974-12-13 1976-03-16 David Porat Method for joining resistive and conductive materials
US5430441A (en) * 1993-10-12 1995-07-04 Motorola, Inc. Transponding tag and method
US5528222A (en) * 1994-09-09 1996-06-18 International Business Machines Corporation Radio frequency circuit and memory in thin flexible package
US6145901A (en) 1996-03-11 2000-11-14 Rich; Donald S. Pick and place head construction
US6268016B1 (en) 1996-06-28 2001-07-31 International Business Machines Corporation Manufacturing computer systems with fine line circuitized substrates
EP0818752A2 (de) 1996-07-08 1998-01-14 Fela Holding AG Leiterplatte (Inlet) für Chip-Karten
US5892661A (en) * 1996-10-31 1999-04-06 Motorola, Inc. Smartcard and method of making
EP0966775A4 (de) 1997-03-10 2004-09-22 Prec Dynamics Corp Reaktanzgekoppelte elemente in schaltungen auf flexiblen substraten
US6136693A (en) 1997-10-27 2000-10-24 Chartered Semiconductor Manufacturing Ltd. Method for planarized interconnect vias using electroless plating and CMP
US6018299A (en) * 1998-06-09 2000-01-25 Motorola, Inc. Radio frequency identification tag having a printed antenna and method
CN1243294A (zh) * 1998-07-28 2000-02-02 东芝株式会社 集成电路卡和数据读写装置和无线标记及它们的制造方法
CN1312928A (zh) * 1998-08-14 2001-09-12 3M创新有限公司 射频识别系统的应用
US6100804A (en) * 1998-10-29 2000-08-08 Intecmec Ip Corp. Radio frequency identification system
EP1039543B1 (de) 1999-03-24 2014-02-26 Motorola Solutions, Inc. Schaltungschip-Verbinder und Verbindungsmethode eines solchen
US6518885B1 (en) 1999-10-14 2003-02-11 Intermec Ip Corp. Ultra-thin outline package for integrated circuit
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
EP1130556B1 (de) 2000-03-02 2004-09-01 Lucatron AG Elektronisch detektierbare Resonanzetikette, insbesondere RFID-Labels
US6476775B1 (en) 2000-03-13 2002-11-05 Rcd Technology Corporation Method for forming radio frequency antenna
US6400271B1 (en) 2000-03-20 2002-06-04 Checkpoint Systems, Inc. Activate/deactiveable security tag with enhanced electronic protection for use with an electronic security system
US20020018880A1 (en) * 2000-08-01 2002-02-14 Young Robert P. Stamping foils for use in making printed circuits and radio frequency antennas
DE10136359C2 (de) 2001-07-26 2003-06-12 Muehlbauer Ag Verfahren zum Verbinden von Mikrochipmodulen mit auf einem ersten Trägerband angeordneten Antennen zum Herstellen eines Transponders
FI119401B (fi) 2001-12-21 2008-10-31 Upm Raflatac Oy Älytarraraina ja menetelmä sen valmistamiseksi
US20040200061A1 (en) * 2003-04-11 2004-10-14 Coleman James P. Conductive pattern and method of making
US7120987B2 (en) * 2003-08-05 2006-10-17 Avery Dennison Corporation Method of making RFID device
EP1687761B1 (de) * 2003-11-04 2010-03-31 Avery Dennison Corporation Rfid-etikett mit verbesserter lesbarkeit
US7292148B2 (en) * 2004-06-18 2007-11-06 Avery Dennison Corporation Method of variable position strap mounting for RFID transponder
EP1628360B1 (de) * 2004-08-21 2007-10-10 Samsung Electronics Co., Ltd Kleine gleichrichtende Antenne
US20060187060A1 (en) * 2005-02-07 2006-08-24 Colby Steven M Identity devices including radio frequency shielding

Also Published As

Publication number Publication date
WO2005041121B1 (en) 2005-09-29
ES2289596T3 (es) 2008-02-01
WO2005041121A2 (en) 2005-05-06
US20050032267A1 (en) 2005-02-10
WO2005041121A3 (en) 2005-07-28
US7333061B2 (en) 2008-02-19
EP1656636A2 (de) 2006-05-17
CN100414564C (zh) 2008-08-27
US7120987B2 (en) 2006-10-17
CN1829999A (zh) 2006-09-06
EP1656636B1 (de) 2007-07-25
AU2004284716A1 (en) 2005-05-06
KR20060080916A (ko) 2006-07-11
DE602004007807T2 (de) 2008-04-17
US20070008238A1 (en) 2007-01-11
CA2534730A1 (en) 2005-05-06
DE602004007807D1 (de) 2007-09-06

Similar Documents

Publication Publication Date Title
ATE368266T1 (de) Rfid-einrichtung und herstellungsverfahren
WO2005112591A3 (en) Radiofrequency antennae and identification tags and methods of manufacturing radiofrequency antennae and radiofrequency identification tags
EP1755073A3 (de) RFID Inlay und Herstellungsverfahren
WO2004086289A3 (en) Rfid tags and processes for producing rfid tags
TW200606729A (en) Radio frequency identification (RFID) tag and manufacturing method thereof
TW200621523A (en) Deposition fabrication using inkjet technology
TW200710736A (en) Radio frequency identification tags for use on metal or other conductive objects
TW200715384A (en) Methods for manufacturing RFID tags and structures formed therefrom
TW200737013A (en) RFID tag and manufacturing method thereof
ATE440346T1 (de) Smartcard-kírper, smartcard und herstellungsverfahren
US20070216580A1 (en) Electro-stimulating massage confiner
ES2189461T3 (es) Procedimiento de fabricacion de tarjetas sin contacto.
DE60319970T8 (de) Mikrostreifenantenne für ein identifikationsgerät
TW200641918A (en) Method for manufacturing base material provided with conductor layer pattern, base material provided with conductor layer pattern and electromagnetic wave blocking member using such base material
WO2007086809A8 (en) An on-chip antenna and a method of fabricating the same
WO2006124400A3 (en) Method of making an electronic device using an electrically conductive polymer, and associated products
FR2882174B1 (fr) Procede de fabrication d'un dispositif microelectronique a fonctionnement sans contact notamment pour passeport electronique
DE602006012184D1 (de) Hybrides leitfähiges Beschichtungsverfahren zur elektrischen Brückenverbindung von RFID-Einzelchips mit einer Verbundantenne
EP1302895A3 (de) Leitungselement und Antenne in Tintendrucktechnik
MY136587A (en) Method for producing an electrical circuit
US20180269568A1 (en) Electronic device and substrate with lds antennas and manufacturing method thereof
ATE371225T1 (de) Sicherheitselement zur rf-identifikation
TW200735349A (en) Semiconductor devices having plated contacts, and methods of manufacturing the same
TW200636595A (en) RFID tag set, RFID tag and RFID tag component
TW200723594A (en) Radio frequency identification (RFID) antenna and fabricating method thereof

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties