ATE335289T1 - Elektrische einrichtung mit einem phasenänderungsmaterial - Google Patents
Elektrische einrichtung mit einem phasenänderungsmaterialInfo
- Publication number
- ATE335289T1 ATE335289T1 AT03807898T AT03807898T ATE335289T1 AT E335289 T1 ATE335289 T1 AT E335289T1 AT 03807898 T AT03807898 T AT 03807898T AT 03807898 T AT03807898 T AT 03807898T AT E335289 T1 ATE335289 T1 AT E335289T1
- Authority
- AT
- Austria
- Prior art keywords
- phase
- change material
- phase change
- resistor
- electrical device
- Prior art date
Links
- 239000012782 phase change material Substances 0.000 title abstract 5
- 239000004020 conductor Substances 0.000 abstract 2
- 239000003989 dielectric material Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 2
- 239000011148 porous material Substances 0.000 abstract 2
- 230000007704 transition Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/20—Multistable switching devices, e.g. memristors
- H10N70/231—Multistable switching devices, e.g. memristors based on solid-state phase change, e.g. between amorphous and crystalline phases, Ovshinsky effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/20—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having two electrodes, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/105—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including field-effect components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B63/00—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices
- H10B63/30—Resistance change memory devices, e.g. resistive RAM [ReRAM] devices comprising selection components having three or more electrodes, e.g. transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/821—Device geometry
- H10N70/826—Device geometry adapted for essentially vertical current flow, e.g. sandwich or pillar type devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/841—Electrodes
- H10N70/8413—Electrodes adapted for resistive heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/861—Thermal details
- H10N70/8616—Thermal insulation means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N70/00—Solid-state devices having no potential barriers, and specially adapted for rectifying, amplifying, oscillating or switching
- H10N70/801—Constructional details of multistable switching devices
- H10N70/881—Switching materials
- H10N70/882—Compounds of sulfur, selenium or tellurium, e.g. chalcogenides
- H10N70/8828—Tellurides, e.g. GeSbTe
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
- G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
- G11C13/0004—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising amorphous/crystalline phase transition cells
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Thermistors And Varistors (AREA)
- Discharge Heating (AREA)
- Developing Agents For Electrophotography (AREA)
- Formation Of Insulating Films (AREA)
- Inorganic Insulating Materials (AREA)
- Waveguide Switches, Polarizers, And Phase Shifters (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02079220 | 2002-10-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE335289T1 true ATE335289T1 (de) | 2006-08-15 |
Family
ID=32088028
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT03807898T ATE335289T1 (de) | 2002-10-11 | 2003-08-25 | Elektrische einrichtung mit einem phasenänderungsmaterial |
Country Status (10)
Country | Link |
---|---|
US (1) | US20060163554A1 (de) |
EP (1) | EP1554763B1 (de) |
JP (1) | JP2006502578A (de) |
KR (1) | KR20050053750A (de) |
CN (1) | CN100521276C (de) |
AT (1) | ATE335289T1 (de) |
AU (1) | AU2003259447A1 (de) |
DE (1) | DE60307306T2 (de) |
TW (1) | TWI311825B (de) |
WO (1) | WO2004034482A2 (de) |
Families Citing this family (90)
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US7709334B2 (en) | 2005-12-09 | 2010-05-04 | Macronix International Co., Ltd. | Stacked non-volatile memory device and methods for fabricating the same |
KR101100422B1 (ko) * | 2005-01-27 | 2011-12-30 | 삼성전자주식회사 | 저항 디램 소자 및 그 동작 방법 |
US7348590B2 (en) * | 2005-02-10 | 2008-03-25 | Infineon Technologies Ag | Phase change memory cell with high read margin at low power operation |
US7361925B2 (en) * | 2005-02-10 | 2008-04-22 | Infineon Technologies Ag | Integrated circuit having a memory including a low-k dielectric material for thermal isolation |
DE102005014645B4 (de) | 2005-03-31 | 2007-07-26 | Infineon Technologies Ag | Anschlusselektrode für Phasen-Wechsel-Material, zugehöriges Phasen-Wechsel-Speicherelement sowie zugehöriges Herstellungsverfahren |
KR100707190B1 (ko) | 2005-05-07 | 2007-04-13 | 삼성전자주식회사 | 나노 와이어를 포함하는 상변환 메모리 소자 및 그 제조방법 |
US7601995B2 (en) * | 2005-10-27 | 2009-10-13 | Infineon Technologies Ag | Integrated circuit having resistive memory cells |
US7635855B2 (en) | 2005-11-15 | 2009-12-22 | Macronix International Co., Ltd. | I-shaped phase change memory cell |
US7786460B2 (en) | 2005-11-15 | 2010-08-31 | Macronix International Co., Ltd. | Phase change memory device and manufacturing method |
US7449710B2 (en) | 2005-11-21 | 2008-11-11 | Macronix International Co., Ltd. | Vacuum jacket for phase change memory element |
US7688619B2 (en) | 2005-11-28 | 2010-03-30 | Macronix International Co., Ltd. | Phase change memory cell and manufacturing method |
US7459717B2 (en) | 2005-11-28 | 2008-12-02 | Macronix International Co., Ltd. | Phase change memory cell and manufacturing method |
US7531825B2 (en) | 2005-12-27 | 2009-05-12 | Macronix International Co., Ltd. | Method for forming self-aligned thermal isolation cell for a variable resistance memory array |
US8062833B2 (en) | 2005-12-30 | 2011-11-22 | Macronix International Co., Ltd. | Chalcogenide layer etching method |
US7560337B2 (en) | 2006-01-09 | 2009-07-14 | Macronix International Co., Ltd. | Programmable resistive RAM and manufacturing method |
US7741636B2 (en) | 2006-01-09 | 2010-06-22 | Macronix International Co., Ltd. | Programmable resistive RAM and manufacturing method |
JP4991155B2 (ja) * | 2006-01-19 | 2012-08-01 | 株式会社東芝 | 半導体記憶装置 |
WO2007099595A1 (ja) * | 2006-02-28 | 2007-09-07 | Renesas Technology Corp. | 半導体装置およびその製造方法 |
US7791059B2 (en) | 2006-03-24 | 2010-09-07 | Nxp B.V. | Electric device with phase change resistor |
JP4623520B2 (ja) * | 2006-04-10 | 2011-02-02 | 株式会社神戸製鋼所 | 多孔質膜の製造方法及びその方法によって製造された多孔質膜 |
US7608848B2 (en) * | 2006-05-09 | 2009-10-27 | Macronix International Co., Ltd. | Bridge resistance random access memory device with a singular contact structure |
JP4865433B2 (ja) * | 2006-07-12 | 2012-02-01 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US7785920B2 (en) | 2006-07-12 | 2010-08-31 | Macronix International Co., Ltd. | Method for making a pillar-type phase change memory element |
US20080019257A1 (en) * | 2006-07-18 | 2008-01-24 | Jan Boris Philipp | Integrated circuit with resistivity changing material having a step-like programming characteristitic |
US7453081B2 (en) * | 2006-07-20 | 2008-11-18 | Qimonda North America Corp. | Phase change memory cell including nanocomposite insulator |
US7504653B2 (en) | 2006-10-04 | 2009-03-17 | Macronix International Co., Ltd. | Memory cell device with circumferentially-extending memory element |
US20080089642A1 (en) * | 2006-10-12 | 2008-04-17 | Annette Claire Grot | Photonic crystal sensor for small volume sensing |
US7863655B2 (en) | 2006-10-24 | 2011-01-04 | Macronix International Co., Ltd. | Phase change memory cells with dual access devices |
US7476587B2 (en) | 2006-12-06 | 2009-01-13 | Macronix International Co., Ltd. | Method for making a self-converged memory material element for memory cell |
US7903447B2 (en) | 2006-12-13 | 2011-03-08 | Macronix International Co., Ltd. | Method, apparatus and computer program product for read before programming process on programmable resistive memory cell |
US7718989B2 (en) | 2006-12-28 | 2010-05-18 | Macronix International Co., Ltd. | Resistor random access memory cell device |
KR100801084B1 (ko) * | 2007-01-08 | 2008-02-05 | 삼성전자주식회사 | 저항체를 이용한 비휘발성 메모리 장치 및 그 제조 방법 |
US7619237B2 (en) * | 2007-02-21 | 2009-11-17 | Macronix International Co., Ltd. | Programmable resistive memory cell with self-forming gap |
US7956344B2 (en) | 2007-02-27 | 2011-06-07 | Macronix International Co., Ltd. | Memory cell with memory element contacting ring-shaped upper end of bottom electrode |
US7786461B2 (en) | 2007-04-03 | 2010-08-31 | Macronix International Co., Ltd. | Memory structure with reduced-size memory element between memory material portions |
US7569844B2 (en) * | 2007-04-17 | 2009-08-04 | Macronix International Co., Ltd. | Memory cell sidewall contacting side electrode |
US7729161B2 (en) | 2007-08-02 | 2010-06-01 | Macronix International Co., Ltd. | Phase change memory with dual word lines and source lines and method of operating same |
US7919766B2 (en) * | 2007-10-22 | 2011-04-05 | Macronix International Co., Ltd. | Method for making self aligning pillar memory cell device |
ATE527702T1 (de) * | 2008-01-16 | 2011-10-15 | Nxp Bv | Mehrschichtige struktur mit einer phasenwechselmaterialschicht und verfahren zu ihrer herstellung |
KR20090097362A (ko) * | 2008-03-11 | 2009-09-16 | 삼성전자주식회사 | 저항 메모리 소자 및 그 형성 방법 |
US8030634B2 (en) * | 2008-03-31 | 2011-10-04 | Macronix International Co., Ltd. | Memory array with diode driver and method for fabricating the same |
US7825398B2 (en) | 2008-04-07 | 2010-11-02 | Macronix International Co., Ltd. | Memory cell having improved mechanical stability |
US7791057B2 (en) | 2008-04-22 | 2010-09-07 | Macronix International Co., Ltd. | Memory cell having a buried phase change region and method for fabricating the same |
US8077505B2 (en) | 2008-05-07 | 2011-12-13 | Macronix International Co., Ltd. | Bipolar switching of phase change device |
US7701750B2 (en) * | 2008-05-08 | 2010-04-20 | Macronix International Co., Ltd. | Phase change device having two or more substantial amorphous regions in high resistance state |
US8415651B2 (en) | 2008-06-12 | 2013-04-09 | Macronix International Co., Ltd. | Phase change memory cell having top and bottom sidewall contacts |
US8586960B2 (en) * | 2008-06-19 | 2013-11-19 | International Business Machines Corporation | Integrated circuit including vertical diode |
US8134857B2 (en) | 2008-06-27 | 2012-03-13 | Macronix International Co., Ltd. | Methods for high speed reading operation of phase change memory and device employing same |
KR100962019B1 (ko) * | 2008-06-30 | 2010-06-08 | 주식회사 하이닉스반도체 | 보호막을 포함하는 상변화 메모리 소자 및 그 제조방법 |
US7932506B2 (en) | 2008-07-22 | 2011-04-26 | Macronix International Co., Ltd. | Fully self-aligned pore-type memory cell having diode access device |
US7903457B2 (en) | 2008-08-19 | 2011-03-08 | Macronix International Co., Ltd. | Multiple phase change materials in an integrated circuit for system on a chip application |
US7719913B2 (en) | 2008-09-12 | 2010-05-18 | Macronix International Co., Ltd. | Sensing circuit for PCRAM applications |
IT1391864B1 (it) * | 2008-09-30 | 2012-01-27 | St Microelectronics Rousset | Cella di memoria resistiva e metodo per la fabbricazione di una cella di memoria resistiva |
US8324605B2 (en) | 2008-10-02 | 2012-12-04 | Macronix International Co., Ltd. | Dielectric mesh isolated phase change structure for phase change memory |
US7897954B2 (en) | 2008-10-10 | 2011-03-01 | Macronix International Co., Ltd. | Dielectric-sandwiched pillar memory device |
US8036014B2 (en) | 2008-11-06 | 2011-10-11 | Macronix International Co., Ltd. | Phase change memory program method without over-reset |
US7869270B2 (en) | 2008-12-29 | 2011-01-11 | Macronix International Co., Ltd. | Set algorithm for phase change memory cell |
US8089137B2 (en) | 2009-01-07 | 2012-01-03 | Macronix International Co., Ltd. | Integrated circuit memory with single crystal silicon on silicide driver and manufacturing method |
US8107283B2 (en) | 2009-01-12 | 2012-01-31 | Macronix International Co., Ltd. | Method for setting PCRAM devices |
US8030635B2 (en) | 2009-01-13 | 2011-10-04 | Macronix International Co., Ltd. | Polysilicon plug bipolar transistor for phase change memory |
US8064247B2 (en) | 2009-01-14 | 2011-11-22 | Macronix International Co., Ltd. | Rewritable memory device based on segregation/re-absorption |
US8933536B2 (en) | 2009-01-22 | 2015-01-13 | Macronix International Co., Ltd. | Polysilicon pillar bipolar transistor with self-aligned memory element |
US8084760B2 (en) * | 2009-04-20 | 2011-12-27 | Macronix International Co., Ltd. | Ring-shaped electrode and manufacturing method for same |
US8173987B2 (en) | 2009-04-27 | 2012-05-08 | Macronix International Co., Ltd. | Integrated circuit 3D phase change memory array and manufacturing method |
US8097871B2 (en) | 2009-04-30 | 2012-01-17 | Macronix International Co., Ltd. | Low operational current phase change memory structures |
US7933139B2 (en) | 2009-05-15 | 2011-04-26 | Macronix International Co., Ltd. | One-transistor, one-resistor, one-capacitor phase change memory |
US7968876B2 (en) | 2009-05-22 | 2011-06-28 | Macronix International Co., Ltd. | Phase change memory cell having vertical channel access transistor |
US8350316B2 (en) * | 2009-05-22 | 2013-01-08 | Macronix International Co., Ltd. | Phase change memory cells having vertical channel access transistor and memory plane |
US8809829B2 (en) | 2009-06-15 | 2014-08-19 | Macronix International Co., Ltd. | Phase change memory having stabilized microstructure and manufacturing method |
US8406033B2 (en) | 2009-06-22 | 2013-03-26 | Macronix International Co., Ltd. | Memory device and method for sensing and fixing margin cells |
US8238149B2 (en) | 2009-06-25 | 2012-08-07 | Macronix International Co., Ltd. | Methods and apparatus for reducing defect bits in phase change memory |
US8363463B2 (en) | 2009-06-25 | 2013-01-29 | Macronix International Co., Ltd. | Phase change memory having one or more non-constant doping profiles |
US8198619B2 (en) | 2009-07-15 | 2012-06-12 | Macronix International Co., Ltd. | Phase change memory cell structure |
US7894254B2 (en) | 2009-07-15 | 2011-02-22 | Macronix International Co., Ltd. | Refresh circuitry for phase change memory |
US8110822B2 (en) | 2009-07-15 | 2012-02-07 | Macronix International Co., Ltd. | Thermal protect PCRAM structure and methods for making |
US8064248B2 (en) | 2009-09-17 | 2011-11-22 | Macronix International Co., Ltd. | 2T2R-1T1R mix mode phase change memory array |
US8178387B2 (en) | 2009-10-23 | 2012-05-15 | Macronix International Co., Ltd. | Methods for reducing recrystallization time for a phase change material |
US8729521B2 (en) | 2010-05-12 | 2014-05-20 | Macronix International Co., Ltd. | Self aligned fin-type programmable memory cell |
US8310864B2 (en) | 2010-06-15 | 2012-11-13 | Macronix International Co., Ltd. | Self-aligned bit line under word line memory array |
US8395935B2 (en) | 2010-10-06 | 2013-03-12 | Macronix International Co., Ltd. | Cross-point self-aligned reduced cell size phase change memory |
US8497705B2 (en) | 2010-11-09 | 2013-07-30 | Macronix International Co., Ltd. | Phase change device for interconnection of programmable logic device |
US8467238B2 (en) | 2010-11-15 | 2013-06-18 | Macronix International Co., Ltd. | Dynamic pulse operation for phase change memory |
JP5340252B2 (ja) * | 2010-11-17 | 2013-11-13 | キヤノン株式会社 | 反射防止膜及びその製造方法 |
KR101199262B1 (ko) * | 2011-03-21 | 2012-11-12 | 한국과학기술연구원 | 저항 변화를 이용한 비휘발성 기억소자 및 그 제조방법 |
US9559113B2 (en) | 2014-05-01 | 2017-01-31 | Macronix International Co., Ltd. | SSL/GSL gate oxide in 3D vertical channel NAND |
US9672906B2 (en) | 2015-06-19 | 2017-06-06 | Macronix International Co., Ltd. | Phase change memory with inter-granular switching |
US10483322B2 (en) * | 2017-06-08 | 2019-11-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Memory device and method for fabricating the same |
US10147876B1 (en) * | 2017-08-31 | 2018-12-04 | Sandisk Technologies Llc | Phase change memory electrode with multiple thermal interfaces |
CN112133825A (zh) * | 2020-09-03 | 2020-12-25 | 中国科学院上海微系统与信息技术研究所 | 一种高稳定性相变存储单元及其制备方法 |
US11980110B2 (en) | 2021-09-20 | 2024-05-07 | International Business Machines Corporation | Insulated phase change memory using porous dielectrics |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5825046A (en) * | 1996-10-28 | 1998-10-20 | Energy Conversion Devices, Inc. | Composite memory material comprising a mixture of phase-change memory material and dielectric material |
US6087674A (en) * | 1996-10-28 | 2000-07-11 | Energy Conversion Devices, Inc. | Memory element with memory material comprising phase-change material and dielectric material |
US6141241A (en) * | 1998-06-23 | 2000-10-31 | Energy Conversion Devices, Inc. | Universal memory element with systems employing same and apparatus and method for reading, writing and programming same |
AU2379900A (en) * | 1998-12-23 | 2000-07-31 | Battelle Memorial Institute | Mesoporous silica film from a solution containing a surfactant and methods of making same |
AU2002222968A1 (en) * | 2000-07-13 | 2002-01-30 | The Regents Of The Universty Of California | Silica zeolite low-k dielectric thin films |
US6339544B1 (en) * | 2000-09-29 | 2002-01-15 | Intel Corporation | Method to enhance performance of thermal resistor device |
US6670285B2 (en) * | 2001-03-14 | 2003-12-30 | International Business Machines Corporation | Nitrogen-containing polymers as porogens in the preparation of highly porous, low dielectric constant materials |
EP1318552A1 (de) * | 2001-12-05 | 2003-06-11 | STMicroelectronics S.r.l. | Kleinflächige Kontaktzone, hocheffizientes Phasenwechsel-Speicherelement und dessen Verfahren zur Herstellung |
JP3948292B2 (ja) * | 2002-02-01 | 2007-07-25 | 株式会社日立製作所 | 半導体記憶装置及びその製造方法 |
-
2003
- 2003-08-25 EP EP03807898A patent/EP1554763B1/de not_active Expired - Lifetime
- 2003-08-25 US US10/530,449 patent/US20060163554A1/en not_active Abandoned
- 2003-08-25 WO PCT/IB2003/003865 patent/WO2004034482A2/en active IP Right Grant
- 2003-08-25 JP JP2004542691A patent/JP2006502578A/ja not_active Withdrawn
- 2003-08-25 DE DE60307306T patent/DE60307306T2/de not_active Expired - Lifetime
- 2003-08-25 AU AU2003259447A patent/AU2003259447A1/en not_active Abandoned
- 2003-08-25 CN CNB038239639A patent/CN100521276C/zh not_active Expired - Fee Related
- 2003-08-25 AT AT03807898T patent/ATE335289T1/de not_active IP Right Cessation
- 2003-08-25 KR KR1020057006241A patent/KR20050053750A/ko active IP Right Grant
- 2003-10-08 TW TW092127969A patent/TWI311825B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1554763A2 (de) | 2005-07-20 |
CN100521276C (zh) | 2009-07-29 |
TW200409391A (en) | 2004-06-01 |
CN1689172A (zh) | 2005-10-26 |
TWI311825B (en) | 2009-07-01 |
KR20050053750A (ko) | 2005-06-08 |
WO2004034482A3 (en) | 2004-08-26 |
DE60307306T2 (de) | 2007-10-11 |
JP2006502578A (ja) | 2006-01-19 |
US20060163554A1 (en) | 2006-07-27 |
WO2004034482A2 (en) | 2004-04-22 |
DE60307306D1 (de) | 2006-09-14 |
AU2003259447A1 (en) | 2004-05-04 |
EP1554763B1 (de) | 2006-08-02 |
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