ATE244923T1 - Mehrschichtinduktor mit hoher eigenresonanzfrequenz und verfahren zur herstellung - Google Patents
Mehrschichtinduktor mit hoher eigenresonanzfrequenz und verfahren zur herstellungInfo
- Publication number
- ATE244923T1 ATE244923T1 AT98948061T AT98948061T ATE244923T1 AT E244923 T1 ATE244923 T1 AT E244923T1 AT 98948061 T AT98948061 T AT 98948061T AT 98948061 T AT98948061 T AT 98948061T AT E244923 T1 ATE244923 T1 AT E244923T1
- Authority
- AT
- Austria
- Prior art keywords
- conductive
- termination
- coils
- conductor
- coil
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004020 conductor Substances 0.000 abstract 5
- 239000003989 dielectric material Substances 0.000 abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Coils Of Transformers For General Uses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/915,875 US5880662A (en) | 1997-08-21 | 1997-08-21 | High self resonant frequency multilayer inductor and method for making same |
PCT/US1998/017148 WO1999009568A1 (en) | 1997-08-21 | 1998-08-19 | High self resonant frequency multilayer inductor and method for making same |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE244923T1 true ATE244923T1 (de) | 2003-07-15 |
Family
ID=25436367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT98948061T ATE244923T1 (de) | 1997-08-21 | 1998-08-19 | Mehrschichtinduktor mit hoher eigenresonanzfrequenz und verfahren zur herstellung |
Country Status (11)
Country | Link |
---|---|
US (1) | US5880662A (de) |
EP (1) | EP1005699B1 (de) |
JP (1) | JP2001516144A (de) |
KR (1) | KR100420568B1 (de) |
CN (1) | CN1171253C (de) |
AT (1) | ATE244923T1 (de) |
AU (1) | AU9471498A (de) |
CA (1) | CA2300954C (de) |
DE (1) | DE69816305T2 (de) |
HK (1) | HK1024979A1 (de) |
WO (1) | WO1999009568A1 (de) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3438859B2 (ja) * | 1996-11-21 | 2003-08-18 | ティーディーケイ株式会社 | 積層型電子部品とその製造方法 |
JP3307307B2 (ja) * | 1997-12-19 | 2002-07-24 | 株式会社村田製作所 | 多層型高周波電子部品 |
KR20000040049A (ko) * | 1998-12-17 | 2000-07-05 | 김춘호 | 적층형 칩 인덕터 |
US6420953B1 (en) | 2000-05-19 | 2002-07-16 | Pulse Engineering. Inc. | Multi-layer, multi-functioning printed circuit board |
US6628531B2 (en) | 2000-12-11 | 2003-09-30 | Pulse Engineering, Inc. | Multi-layer and user-configurable micro-printed circuit board |
US6587025B2 (en) | 2001-01-31 | 2003-07-01 | Vishay Dale Electronics, Inc. | Side-by-side coil inductor |
JP2002246231A (ja) * | 2001-02-14 | 2002-08-30 | Murata Mfg Co Ltd | 積層型インダクタ |
US20030024111A1 (en) * | 2001-08-02 | 2003-02-06 | Aem, Inc. | Dot penetration method for inter-layer connections of electronic components |
US20060091534A1 (en) | 2002-12-13 | 2006-05-04 | Matsushita Electric Industrial Co., Ltd. | Chip part manufacturing method and chip parts |
US20060077029A1 (en) * | 2004-10-07 | 2006-04-13 | Freescale Semiconductor, Inc. | Apparatus and method for constructions of stacked inductive components |
US7355264B2 (en) * | 2006-09-13 | 2008-04-08 | Sychip Inc. | Integrated passive devices with high Q inductors |
CN101521087B (zh) * | 2008-11-17 | 2012-12-05 | 深圳振华富电子有限公司 | 一种电感器及其制造方法 |
DE102012201847A1 (de) * | 2012-02-08 | 2013-08-08 | Würth Elektronik eiSos Gmbh & Co. KG | Elektronisches Bauelement |
US20130214890A1 (en) | 2012-02-20 | 2013-08-22 | Futurewei Technologies, Inc. | High Current, Low Equivalent Series Resistance Printed Circuit Board Coil for Power Transfer Application |
TWI566653B (zh) * | 2014-11-14 | 2017-01-11 | 乾坤科技股份有限公司 | 無基板電子元件及其製造方法 |
JP6686979B2 (ja) * | 2017-06-26 | 2020-04-22 | 株式会社村田製作所 | 積層インダクタ |
KR102442385B1 (ko) * | 2017-07-05 | 2022-09-14 | 삼성전기주식회사 | 박막형 인덕터 |
WO2019173579A1 (en) * | 2018-03-07 | 2019-09-12 | University Of Tennessee Research Foundation | Series self-resonant coil structure for conducting wireless power transfer |
RU2719768C1 (ru) * | 2019-09-25 | 2020-04-23 | Самсунг Электроникс Ко., Лтд. | Многослойная катушка индуктивности |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3833972A (en) * | 1969-09-11 | 1974-09-10 | G Brumlik | Self-adhering fastening filament |
US3833872A (en) * | 1972-06-13 | 1974-09-03 | I Marcus | Microminiature monolithic ferroceramic transformer |
JPH02172207A (ja) * | 1988-12-23 | 1990-07-03 | Murata Mfg Co Ltd | 積層型インダクター |
US5126707A (en) * | 1989-12-25 | 1992-06-30 | Takeshi Ikeda | Laminated lc element and method for manufacturing the same |
JP3073035B2 (ja) * | 1991-02-21 | 2000-08-07 | 毅 池田 | Lcノイズフィルタ |
US5349743A (en) * | 1991-05-02 | 1994-09-27 | At&T Bell Laboratories | Method of making a multilayer monolithic magnet component |
US5302932A (en) * | 1992-05-12 | 1994-04-12 | Dale Electronics, Inc. | Monolythic multilayer chip inductor and method for making same |
CA2158784A1 (en) * | 1994-11-09 | 1996-05-10 | Jeffrey T. Adelman | Electronic thick film component termination and method of making the same |
JP3438859B2 (ja) * | 1996-11-21 | 2003-08-18 | ティーディーケイ株式会社 | 積層型電子部品とその製造方法 |
-
1997
- 1997-08-21 US US08/915,875 patent/US5880662A/en not_active Expired - Fee Related
-
1998
- 1998-08-19 JP JP2000510147A patent/JP2001516144A/ja active Pending
- 1998-08-19 AU AU94714/98A patent/AU9471498A/en not_active Abandoned
- 1998-08-19 CA CA002300954A patent/CA2300954C/en not_active Expired - Fee Related
- 1998-08-19 WO PCT/US1998/017148 patent/WO1999009568A1/en active IP Right Grant
- 1998-08-19 KR KR10-2000-7001755A patent/KR100420568B1/ko not_active IP Right Cessation
- 1998-08-19 CN CNB988098547A patent/CN1171253C/zh not_active Expired - Fee Related
- 1998-08-19 AT AT98948061T patent/ATE244923T1/de not_active IP Right Cessation
- 1998-08-19 DE DE69816305T patent/DE69816305T2/de not_active Expired - Fee Related
- 1998-08-19 EP EP98948061A patent/EP1005699B1/de not_active Expired - Lifetime
-
2000
- 2000-07-07 HK HK00104177A patent/HK1024979A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN1171253C (zh) | 2004-10-13 |
KR20010023132A (ko) | 2001-03-26 |
DE69816305T2 (de) | 2004-05-27 |
EP1005699A1 (de) | 2000-06-07 |
DE69816305D1 (de) | 2003-08-14 |
KR100420568B1 (ko) | 2004-03-02 |
JP2001516144A (ja) | 2001-09-25 |
WO1999009568A1 (en) | 1999-02-25 |
HK1024979A1 (en) | 2000-10-27 |
CA2300954A1 (en) | 1999-02-25 |
EP1005699B1 (de) | 2003-07-09 |
AU9471498A (en) | 1999-03-08 |
US5880662A (en) | 1999-03-09 |
CN1273676A (zh) | 2000-11-15 |
CA2300954C (en) | 2006-03-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |