ATE228416T1 - Polierkissen für halbleitersubstrat - Google Patents

Polierkissen für halbleitersubstrat

Info

Publication number
ATE228416T1
ATE228416T1 AT99933866T AT99933866T ATE228416T1 AT E228416 T1 ATE228416 T1 AT E228416T1 AT 99933866 T AT99933866 T AT 99933866T AT 99933866 T AT99933866 T AT 99933866T AT E228416 T1 ATE228416 T1 AT E228416T1
Authority
AT
Austria
Prior art keywords
polishing pad
semiconductor substrate
pad
polishing
porous substrate
Prior art date
Application number
AT99933866T
Other languages
English (en)
Inventor
Sriram P Anjur
William C Downing
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE228416T1 publication Critical patent/ATE228416T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Laminated Bodies (AREA)
  • Vibration Prevention Devices (AREA)
AT99933866T 1998-07-10 1999-07-08 Polierkissen für halbleitersubstrat ATE228416T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/113,248 US6117000A (en) 1998-07-10 1998-07-10 Polishing pad for a semiconductor substrate
PCT/US1999/015628 WO2000002707A1 (en) 1998-07-10 1999-07-08 Polishing pad for a semiconductor substrate

Publications (1)

Publication Number Publication Date
ATE228416T1 true ATE228416T1 (de) 2002-12-15

Family

ID=22348392

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99933866T ATE228416T1 (de) 1998-07-10 1999-07-08 Polierkissen für halbleitersubstrat

Country Status (14)

Country Link
US (1) US6117000A (de)
EP (1) EP1112145B1 (de)
JP (1) JP2002520173A (de)
KR (1) KR20010053451A (de)
CN (1) CN1316939A (de)
AT (1) ATE228416T1 (de)
AU (1) AU4982699A (de)
CA (1) CA2336859A1 (de)
DE (1) DE69904209T2 (de)
ES (1) ES2189446T3 (de)
ID (1) ID28011A (de)
IL (1) IL140808A0 (de)
TW (1) TW402540B (de)
WO (1) WO2000002707A1 (de)

Families Citing this family (97)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6585574B1 (en) * 1998-06-02 2003-07-01 Brian Lombardo Polishing pad with reduced moisture absorption
US6390890B1 (en) 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
US6641463B1 (en) 1999-02-06 2003-11-04 Beaver Creek Concepts Inc Finishing components and elements
TWI228522B (en) * 1999-06-04 2005-03-01 Fuji Spinning Co Ltd Urethane molded products for polishing pad and method for making same
US6712681B1 (en) * 2000-06-23 2004-03-30 International Business Machines Corporation Polishing pads with polymer filled fibrous web, and methods for fabricating and using same
US6477926B1 (en) * 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6846225B2 (en) * 2000-11-29 2005-01-25 Psiloquest, Inc. Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor
US20050266226A1 (en) * 2000-11-29 2005-12-01 Psiloquest Chemical mechanical polishing pad and method for selective metal and barrier polishing
US20030083003A1 (en) * 2001-10-29 2003-05-01 West Thomas E. Polishing pads and manufacturing methods
JP3664676B2 (ja) * 2001-10-30 2005-06-29 信越半導体株式会社 ウェーハの研磨方法及びウェーハ研磨用研磨パッド
US6685540B2 (en) 2001-11-27 2004-02-03 Cabot Microelectronics Corporation Polishing pad comprising particles with a solid core and polymeric shell
US6702866B2 (en) 2002-01-10 2004-03-09 Speedfam-Ipec Corporation Homogeneous fixed abrasive polishing pad
US20030138201A1 (en) * 2002-01-18 2003-07-24 Cabot Microelectronics Corp. Self-aligned lens formed on a single mode optical fiber using CMP and thin film deposition
US6682575B2 (en) 2002-03-05 2004-01-27 Cabot Microelectronics Corporation Methanol-containing silica-based CMP compositions
US6913517B2 (en) * 2002-05-23 2005-07-05 Cabot Microelectronics Corporation Microporous polishing pads
US20040014413A1 (en) * 2002-06-03 2004-01-22 Jsr Corporation Polishing pad and multi-layer polishing pad
US6604987B1 (en) 2002-06-06 2003-08-12 Cabot Microelectronics Corporation CMP compositions containing silver salts
US6641630B1 (en) 2002-06-06 2003-11-04 Cabot Microelectronics Corp. CMP compositions containing iodine and an iodine vapor-trapping agent
WO2003103959A1 (en) * 2002-06-07 2003-12-18 Praxair S.T. Technology, Inc. Controlled penetration subpad
US6936543B2 (en) * 2002-06-07 2005-08-30 Cabot Microelectronics Corporation CMP method utilizing amphiphilic nonionic surfactants
US6974777B2 (en) * 2002-06-07 2005-12-13 Cabot Microelectronics Corporation CMP compositions for low-k dielectric materials
US20040007690A1 (en) * 2002-07-12 2004-01-15 Cabot Microelectronics Corp. Methods for polishing fiber optic connectors
US7021993B2 (en) * 2002-07-19 2006-04-04 Cabot Microelectronics Corporation Method of polishing a substrate with a polishing system containing conducting polymer
US6811474B2 (en) 2002-07-19 2004-11-02 Cabot Microelectronics Corporation Polishing composition containing conducting polymer
US20070010169A1 (en) * 2002-09-25 2007-01-11 Ppg Industries Ohio, Inc. Polishing pad with window for planarization
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7071105B2 (en) 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
EP1594656B1 (de) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Polierartikel für elektro-chemisches-mechanisches polieren
JP4790973B2 (ja) * 2003-03-28 2011-10-12 Ｈｏｙａ株式会社 研磨パッドを使用した情報記録媒体用ガラス基板の製造方法及びその方法で得られた情報記録媒体用ガラス基板
JP2004303983A (ja) * 2003-03-31 2004-10-28 Fuji Photo Film Co Ltd 研磨パッド
JPWO2004090963A1 (ja) * 2003-04-03 2006-07-06 日立化成工業株式会社 研磨パッド、その製造方法およびそれを用いた研磨方法
JP4986099B2 (ja) * 2003-06-09 2012-07-25 花王株式会社 基板の製造方法
JP2005001018A (ja) * 2003-06-09 2005-01-06 Kao Corp 基板の製造方法
US6998166B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Polishing pad with oriented pore structure
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
EP1498222B1 (de) * 2003-07-17 2014-12-17 JSR Corporation Chemisch-mechanisches Polierkissen und Polierverfahren
US6899602B2 (en) * 2003-07-30 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Nc Porous polyurethane polishing pads
US20050032464A1 (en) * 2003-08-07 2005-02-10 Swisher Robert G. Polishing pad having edge surface treatment
US7195544B2 (en) * 2004-03-23 2007-03-27 Cabot Microelectronics Corporation CMP porous pad with component-filled pores
JP2005333121A (ja) * 2004-04-21 2005-12-02 Jsr Corp 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法
US7776758B2 (en) 2004-06-08 2010-08-17 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
US7968273B2 (en) 2004-06-08 2011-06-28 Nanosys, Inc. Methods and devices for forming nanostructure monolayers and devices including such monolayers
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US20060089095A1 (en) 2004-10-27 2006-04-27 Swisher Robert G Polyurethane urea polishing pad
US7504044B2 (en) 2004-11-05 2009-03-17 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US7531105B2 (en) * 2004-11-05 2009-05-12 Cabot Microelectronics Corporation Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
US20060096179A1 (en) * 2004-11-05 2006-05-11 Cabot Microelectronics Corporation CMP composition containing surface-modified abrasive particles
US20060154579A1 (en) * 2005-01-12 2006-07-13 Psiloquest Thermoplastic chemical mechanical polishing pad and method of manufacture
JP4540502B2 (ja) * 2005-03-01 2010-09-08 富士紡ホールディングス株式会社 保持パッド
TWI297049B (en) 2005-05-17 2008-05-21 San Fang Chemical Industry Co Artificial leather having ultramicro fiber in conjugate fiber of substrate
US20070010175A1 (en) * 2005-07-07 2007-01-11 San Fang Chemical Industry Co., Ltd. Polishing pad and method of producing same
JP4681970B2 (ja) * 2005-07-27 2011-05-11 ニッタ・ハース株式会社 研磨パッドおよび研磨機
US7494519B2 (en) * 2005-07-28 2009-02-24 3M Innovative Properties Company Abrasive agglomerate polishing method
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
US7503833B2 (en) 2006-02-16 2009-03-17 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Three-dimensional network for chemical mechanical polishing
CN100436059C (zh) * 2006-04-30 2008-11-26 宁波东海敏孚汽车部件有限公司 一种对聚烯烃类热塑性弹性体树脂材料损伤表面进行修复、抛光的方法
WO2008085813A2 (en) * 2007-01-03 2008-07-17 Nanosys, Inc, Et Al. Methods for nanopatterning and production of nanostructures
US20090136785A1 (en) * 2007-01-03 2009-05-28 Nanosys, Inc. Methods for nanopatterning and production of magnetic nanostructures
MY147729A (en) 2007-09-21 2013-01-15 Cabot Microelectronics Corp Polishing composition and method utilizing abrasive particles treated with an aminosilane
SG184772A1 (en) * 2007-09-21 2012-10-30 Cabot Microelectronics Corp Polishing composition and method utilizing abrasive particles treated with an aminosilane
KR100822054B1 (ko) * 2007-11-21 2008-04-15 실리콘밸리(주) 반도체 검사용 탐침의 연마시트
US8250695B2 (en) * 2009-10-05 2012-08-28 Applied Materials, Inc. Roller assembly for a brush cleaning device in a cleaning module
JP5671554B2 (ja) * 2009-12-30 2015-02-18 スリーエム イノベイティブ プロパティズ カンパニー 有機微粒子装填研磨パッド、並びにその製造及び使用方法
CN102009385B (zh) * 2010-11-02 2012-08-29 北京通美晶体技术有限公司 一种半导体晶片的化学机械抛光方法
US8257152B2 (en) * 2010-11-12 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Silicate composite polishing pad
JP5712906B2 (ja) 2011-11-15 2015-05-07 信越化学工業株式会社 基板の製造方法
TWI573864B (zh) 2012-03-14 2017-03-11 卡博特微電子公司 具有高移除率及低缺陷率之對氧化物及氮化物有選擇性之ｃｍｐ組成物
US8916061B2 (en) 2012-03-14 2014-12-23 Cabot Microelectronics Corporation CMP compositions selective for oxide and nitride with high removal rate and low defectivity
US9108293B2 (en) * 2012-07-30 2015-08-18 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method for chemical mechanical polishing layer pretexturing
US9144880B2 (en) * 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
CN113579992A (zh) 2014-10-17 2021-11-02 应用材料公司 使用加成制造工艺的具复合材料特性的cmp衬垫建构
JP6940495B2 (ja) 2015-10-30 2021-09-29 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 所望のゼータ電位を有する研磨用物品を形成するための装置及び方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
US10106662B2 (en) * 2016-08-04 2018-10-23 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Thermoplastic poromeric polishing pad
CN106903596B (zh) * 2017-01-23 2018-06-19 安徽禾臣新材料有限公司 Tft减薄抛光用吸附垫
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11667061B2 (en) * 2020-04-18 2023-06-06 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming leveraged poromeric polishing pad
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
CN111981954B (zh) * 2020-08-17 2021-11-16 唐林 一种超高精度显微打磨深度标尺及其制备工艺
CN112372509B (zh) * 2020-11-11 2022-02-25 西安奕斯伟硅片技术有限公司 一种将抛光垫的初始状态转变为亲水性的方法和装置
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114515994A (zh) * 2022-03-03 2022-05-20 上海江丰平芯电子科技有限公司 一种提高晶圆边缘区域研磨率的方法
CN115194642B (zh) * 2022-07-29 2023-08-11 安徽禾臣新材料有限公司 一种晶片抛光用防晶片剥离的无蜡垫及其生产工艺
CN117207055A (zh) * 2023-09-20 2023-12-12 杭州中欣晶圆半导体股份有限公司 超高平坦度dsg调整操作方法

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3835212A (en) * 1970-05-25 1974-09-10 Congoleum Ind Inc Method for producing resinous sheet-like products
US3763054A (en) * 1970-12-07 1973-10-02 Bayer Ag Process for the production of microporous polyurethane (urea) sheet structures permeable to water vapor
US3942903A (en) * 1973-02-27 1976-03-09 Glasrock Products, Inc. Unitary porous themoplastic writing nib
US3917761A (en) * 1973-05-15 1975-11-04 Du Pont Process of making a porous polyimide shaped article
DE2556448A1 (de) * 1975-12-15 1977-06-23 Bosch Gmbh Robert Polierkoerper zum polieren von gegenstaenden mit kristallinem gefuege
US4247498A (en) * 1976-08-30 1981-01-27 Akzona Incorporated Methods for making microporous products
US4519909A (en) * 1977-07-11 1985-05-28 Akzona Incorporated Microporous products
US4256845A (en) * 1979-02-15 1981-03-17 Glasrock Products, Inc. Porous sheets and method of manufacture
US4664683A (en) * 1984-04-25 1987-05-12 Pall Corporation Self-supporting structures containing immobilized carbon particles and method for forming same
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4828772A (en) * 1984-10-09 1989-05-09 Millipore Corporation Microporous membranes of ultrahigh molecular weight polyethylene
US4708839A (en) * 1985-12-30 1987-11-24 Amphenol Corporation Method of compressively molding articles from resin coated filler materials
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US5073344A (en) * 1987-07-17 1991-12-17 Porex Technologies Corp. Diagnostic system employing a unitary substrate to immobilize microspheres
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
JPH01193166A (ja) * 1988-01-28 1989-08-03 Showa Denko Kk 半導体ウェハ鏡面研磨用パッド
US4880843A (en) * 1988-03-28 1989-11-14 Hoechst Celanese Corporation Composition and process for making porous articles from ultra high molecular weight polyethylene
US5019311A (en) * 1989-02-23 1991-05-28 Koslow Technologies Corporation Process for the production of materials characterized by a continuous web matrix or force point bonding
JPH0398759A (ja) * 1989-09-07 1991-04-24 Nec Corp ポリシングパッド及びその製造方法
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5230579A (en) * 1991-06-19 1993-07-27 Carter-Wallace, Inc. Porous dome applicator with push/pull cap
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
US5197999A (en) * 1991-09-30 1993-03-30 National Semiconductor Corporation Polishing pad for planarization
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5216843A (en) * 1992-09-24 1993-06-08 Intel Corporation Polishing pad conditioning apparatus for wafer planarization process
US5232875A (en) * 1992-10-15 1993-08-03 Micron Technology, Inc. Method and apparatus for improving planarity of chemical-mechanical planarization operations
US5329734A (en) * 1993-04-30 1994-07-19 Motorola, Inc. Polishing pads used to chemical-mechanical polish a semiconductor substrate
US5554064A (en) * 1993-08-06 1996-09-10 Intel Corporation Orbital motion chemical-mechanical polishing apparatus and method of fabrication
US5394655A (en) * 1993-08-31 1995-03-07 Texas Instruments Incorporated Semiconductor polishing pad
US5632668A (en) * 1993-10-29 1997-05-27 Minnesota Mining And Manufacturing Company Method for the polishing and finishing of optical lenses
US5422377A (en) * 1994-04-06 1995-06-06 Sandia Corporation Microporous polymer films and methods of their production
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5562530A (en) * 1994-08-02 1996-10-08 Sematech, Inc. Pulsed-force chemical mechanical polishing
US5609719A (en) * 1994-11-03 1997-03-11 Texas Instruments Incorporated Method for performing chemical mechanical polish (CMP) of a wafer
WO1996015887A1 (en) * 1994-11-23 1996-05-30 Rodel, Inc. Polishing pads and methods for their manufacture
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US5605760A (en) * 1995-08-21 1997-02-25 Rodel, Inc. Polishing pads
US5611943A (en) * 1995-09-29 1997-03-18 Intel Corporation Method and apparatus for conditioning of chemical-mechanical polishing pads
US5921856A (en) * 1997-07-10 1999-07-13 Sp3, Inc. CVD diamond coated substrate for polishing pad conditioning head and method for making same

Also Published As

Publication number Publication date
WO2000002707A1 (en) 2000-01-20
DE69904209D1 (de) 2003-01-09
IL140808A0 (en) 2002-02-10
CA2336859A1 (en) 2000-01-20
EP1112145A1 (de) 2001-07-04
US6117000A (en) 2000-09-12
JP2002520173A (ja) 2002-07-09
AU4982699A (en) 2000-02-01
DE69904209T2 (de) 2003-03-27
TW402540B (en) 2000-08-21
ID28011A (id) 2001-05-03
KR20010053451A (ko) 2001-06-25
EP1112145B1 (de) 2002-11-27
CN1316939A (zh) 2001-10-10
ES2189446T3 (es) 2003-07-01

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