ATE227783T1 - Zylindrische mikrowellenabschirmung - Google Patents

Zylindrische mikrowellenabschirmung

Info

Publication number
ATE227783T1
ATE227783T1 AT94908576T AT94908576T ATE227783T1 AT E227783 T1 ATE227783 T1 AT E227783T1 AT 94908576 T AT94908576 T AT 94908576T AT 94908576 T AT94908576 T AT 94908576T AT E227783 T1 ATE227783 T1 AT E227783T1
Authority
AT
Austria
Prior art keywords
magnetic field
shield
target structure
field zone
opposite ends
Prior art date
Application number
AT94908576T
Other languages
English (en)
Inventor
Peter A Sieck
John R Porter
Original Assignee
Boc Group Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boc Group Inc filed Critical Boc Group Inc
Application granted granted Critical
Publication of ATE227783T1 publication Critical patent/ATE227783T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3441—Dark space shields
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H01J37/32669—Particular magnets or magnet arrangements for controlling the discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3426—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
AT94908576T 1993-01-15 1994-01-07 Zylindrische mikrowellenabschirmung ATE227783T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US496493A 1993-01-15 1993-01-15
PCT/US1994/000290 WO1994016118A1 (en) 1993-01-15 1994-01-07 Cylindrical magnetron shield structure

Publications (1)

Publication Number Publication Date
ATE227783T1 true ATE227783T1 (de) 2002-11-15

Family

ID=21713429

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94908576T ATE227783T1 (de) 1993-01-15 1994-01-07 Zylindrische mikrowellenabschirmung

Country Status (11)

Country Link
US (1) US5464518A (de)
EP (2) EP1251547A1 (de)
JP (1) JPH08506855A (de)
KR (1) KR100325969B1 (de)
CN (1) CN1094759A (de)
AT (1) ATE227783T1 (de)
AU (1) AU678213B2 (de)
CA (1) CA2153795A1 (de)
CZ (1) CZ181095A3 (de)
DE (1) DE69431709T2 (de)
WO (1) WO1994016118A1 (de)

Families Citing this family (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567289A (en) * 1993-12-30 1996-10-22 Viratec Thin Films, Inc. Rotating floating magnetron dark-space shield and cone end
US5527439A (en) * 1995-01-23 1996-06-18 The Boc Group, Inc. Cylindrical magnetron shield structure
US6264812B1 (en) 1995-11-15 2001-07-24 Applied Materials, Inc. Method and apparatus for generating a plasma
US6060129A (en) * 1996-03-04 2000-05-09 Polar Materials, Inc. Method for bulk coating using a plasma process
US6254746B1 (en) 1996-05-09 2001-07-03 Applied Materials, Inc. Recessed coil for generating a plasma
US6368469B1 (en) * 1996-05-09 2002-04-09 Applied Materials, Inc. Coils for generating a plasma and for sputtering
KR100489918B1 (ko) * 1996-05-09 2005-08-04 어플라이드 머티어리얼스, 인코포레이티드 플라즈마발생및스퍼터링용코일
EP0969238A1 (de) * 1998-06-29 2000-01-05 Sinvaco N.V. Vakuumdichte Kupplung für Rohre
US6238528B1 (en) 1998-10-13 2001-05-29 Applied Materials, Inc. Plasma density modulator for improved plasma density uniformity and thickness uniformity in an ionized metal plasma source
US6409890B1 (en) 1999-07-27 2002-06-25 Applied Materials, Inc. Method and apparatus for forming a uniform layer on a workpiece during sputtering
US6409897B1 (en) 2000-09-20 2002-06-25 Poco Graphite, Inc. Rotatable sputter target
US6736943B1 (en) * 2001-03-15 2004-05-18 Cierra Photonics, Inc. Apparatus and method for vacuum coating deposition
US6736948B2 (en) 2002-01-18 2004-05-18 Von Ardenne Anlagentechnik Gmbh Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
WO2004005574A2 (en) * 2002-07-02 2004-01-15 Academy Precision Materials A Division Of Academy Corporation Rotary target and method for onsite mechanical assembly of rotary target
US6846396B2 (en) * 2002-08-08 2005-01-25 Applied Materials, Inc. Active magnetic shielding
US20040129561A1 (en) * 2003-01-07 2004-07-08 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron magnetic array mid span support
US7014741B2 (en) * 2003-02-21 2006-03-21 Von Ardenne Anlagentechnik Gmbh Cylindrical magnetron with self cleaning target
US20050051422A1 (en) * 2003-02-21 2005-03-10 Rietzel James G. Cylindrical magnetron with self cleaning target
US20050276381A1 (en) * 2003-07-02 2005-12-15 Academy Corporation Rotary target locking ring assembly
US20050224343A1 (en) * 2004-04-08 2005-10-13 Richard Newcomb Power coupling for high-power sputtering
DE502004010804D1 (de) 2004-05-05 2010-04-08 Applied Materials Gmbh & Co Kg Beschichtungsvorrichtung mit grossflächiger Anordnung von drehbaren Magnetronkathoden
US7993496B2 (en) * 2004-07-01 2011-08-09 Cardinal Cg Company Cylindrical target with oscillating magnet for magnetron sputtering
DE502004002964D1 (de) * 2004-08-10 2007-04-05 Applied Materials Gmbh & Co Kg Magnetronsputtereinrichtung, Zylinderkathode und Verfahren zur Aufbringung von dünnen Mehrkomponentenschichten auf einem Substrat
EP1628322A1 (de) * 2004-08-17 2006-02-22 Applied Films GmbH & Co. KG Haltevorrichtung für eine Blende
US20060065524A1 (en) * 2004-09-30 2006-03-30 Richard Newcomb Non-bonded rotatable targets for sputtering
GB2419894B (en) * 2004-10-22 2009-08-26 Plasma Quest Ltd Sputtering system
US20060096855A1 (en) * 2004-11-05 2006-05-11 Richard Newcomb Cathode arrangement for atomizing a rotatable target pipe
JP2008525645A (ja) * 2004-12-27 2008-07-17 日本板硝子株式会社 円筒形揺動シールドターゲットアセンブリおよびその使用方法
US20060278519A1 (en) * 2005-06-10 2006-12-14 Leszek Malaszewski Adaptable fixation for cylindrical magnetrons
US20060278524A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for modulating power signals to control sputtering
US20060278521A1 (en) * 2005-06-14 2006-12-14 Stowell Michael W System and method for controlling ion density and energy using modulated power signals
US7842355B2 (en) 2005-11-01 2010-11-30 Applied Materials, Inc. System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
US20070095281A1 (en) * 2005-11-01 2007-05-03 Stowell Michael W System and method for power function ramping of microwave liner discharge sources
US8273222B2 (en) * 2006-05-16 2012-09-25 Southwest Research Institute Apparatus and method for RF plasma enhanced magnetron sputter deposition
US20080011599A1 (en) * 2006-07-12 2008-01-17 Brabender Dennis M Sputtering apparatus including novel target mounting and/or control
DE102007009615A1 (de) 2007-02-26 2008-08-28 Leybold Optics Gmbh Anlage und Verfahren zur Vakuumbehandlung von bandförmigen Substraten
US8277617B2 (en) * 2007-08-14 2012-10-02 Southwest Research Institute Conformal magnetron sputter deposition
EP2175047B1 (de) * 2008-10-09 2017-02-08 Bobst Manchester Ltd Vorrichtung zur Plasmabehandlung von Substraten und Verfahren
US9751254B2 (en) 2008-10-09 2017-09-05 Bobst Manchester Ltd Apparatus for treating substrates
TWI486471B (zh) * 2009-05-08 2015-06-01 Hon Hai Prec Ind Co Ltd 靶座結構
CZ304905B6 (cs) 2009-11-23 2015-01-14 Shm, S.R.O. Způsob vytváření PVD vrstev s pomocí rotační cylindrické katody a zařízení k provádění tohoto způsobu
US20110203921A1 (en) * 2010-02-19 2011-08-25 Tosoh Smd, Inc. Method of bonding rotatable ceramic targets to a backing structure
US8747631B2 (en) * 2010-03-15 2014-06-10 Southwest Research Institute Apparatus and method utilizing a double glow discharge plasma for sputter cleaning
EP2553137B1 (de) * 2010-03-31 2016-10-05 Mustang Vacuum Systems, Inc. Rotierende kathodenvorrichtung zur magnetron zerstäubung und verfahren zum abscheiden von material damit
JP2014058698A (ja) * 2010-12-15 2014-04-03 Canon Anelva Corp スパッタリング装置
DE102012110284B3 (de) * 2012-10-26 2013-11-14 Von Ardenne Anlagentechnik Gmbh Sputterbeschichtungseinrichtung und Vakuumbeschichtungsanlage
KR101470610B1 (ko) * 2012-11-15 2014-12-24 (주)비엠씨 증착원 이동형 증착 장치
DE102013105634A1 (de) 2012-12-18 2014-06-18 Von Ardenne Gmbh Blende für eine Beschichtungsquelle; Beschichtungsanlage
EP3061127A1 (de) * 2013-10-24 2016-08-31 Meyer Burger (Germany) AG Multimagnetronanordnung
CN106463326B (zh) * 2014-05-09 2018-07-13 应用材料公司 用于可旋转阴极的遮蔽装置、可旋转阴极以及用于遮蔽沉积设备中的暗空间的方法
KR101950857B1 (ko) * 2015-06-05 2019-02-21 어플라이드 머티어리얼스, 인코포레이티드 스퍼터 증착 소스, 스퍼터링 장치 및 그 동작 방법
JP2017002348A (ja) * 2015-06-08 2017-01-05 株式会社アルバック スパッタリング装置用の回転式カソードユニット
KR101687302B1 (ko) * 2015-06-12 2016-12-16 주식회사 에스에프에이 스퍼터 장치
KR102407392B1 (ko) * 2015-07-03 2022-06-13 삼성디스플레이 주식회사 스퍼터링 장치 및 이를 이용한 스퍼터링 방법
EP3541762B1 (de) 2016-11-17 2022-03-02 Cardinal CG Company Statisch-dissipative beschichtungstechnologie
KR102067820B1 (ko) * 2018-07-24 2020-01-17 (주)선익시스템 가변형 아크억제수단이 마련된 증착장비
CN108990402B (zh) * 2018-08-13 2019-11-12 玉环睿升自动化技术有限公司 智能磁屏蔽装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512732A (en) * 1978-07-14 1980-01-29 Anelva Corp Sputtering apparatus for making thin magnetic film
US4422916A (en) * 1981-02-12 1983-12-27 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4356073A (en) * 1981-02-12 1982-10-26 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4407708A (en) * 1981-08-06 1983-10-04 Eaton Corporation Method for operating a magnetron sputtering apparatus
US4525264A (en) * 1981-12-07 1985-06-25 Ford Motor Company Cylindrical post magnetron sputtering system
US4410407A (en) * 1981-12-22 1983-10-18 Raytheon Company Sputtering apparatus and methods
US4417968A (en) * 1983-03-21 1983-11-29 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
US4443318A (en) * 1983-08-17 1984-04-17 Shatterproof Glass Corporation Cathodic sputtering apparatus
US4466877A (en) * 1983-10-11 1984-08-21 Shatterproof Glass Corporation Magnetron cathode sputtering apparatus
JP2693960B2 (ja) * 1988-02-24 1997-12-24 プロメトロンテクニクス株式会社 マグネトロンスパッタリングカソード装置
EP0543931A4 (en) * 1990-08-10 1993-09-08 Viratec Thin Films, Inc. Shielding for arc suppression in rotating magnetron sputtering systems
US5108574A (en) * 1991-01-29 1992-04-28 The Boc Group, Inc. Cylindrical magnetron shield structure
DE4117518C2 (de) * 1991-05-29 2000-06-21 Leybold Ag Vorrichtung zum Sputtern mit bewegtem, insbesondere rotierendem Target

Also Published As

Publication number Publication date
JPH08506855A (ja) 1996-07-23
KR960700357A (ko) 1996-01-19
CZ181095A3 (en) 1995-12-13
CN1094759A (zh) 1994-11-09
CA2153795A1 (en) 1994-07-21
WO1994016118A1 (en) 1994-07-21
KR100325969B1 (ko) 2002-08-08
AU6161694A (en) 1994-08-15
EP0681616A1 (de) 1995-11-15
AU678213B2 (en) 1997-05-22
US5464518A (en) 1995-11-07
DE69431709D1 (de) 2002-12-19
DE69431709T2 (de) 2004-08-19
EP0681616A4 (de) 1997-05-14
EP1251547A1 (de) 2002-10-23
EP0681616B1 (de) 2002-11-13

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties