ATE218790T1 - Umweltfreundlich hergestellte leiterplatte und zugehörige vorrichtung - Google Patents
Umweltfreundlich hergestellte leiterplatte und zugehörige vorrichtungInfo
- Publication number
- ATE218790T1 ATE218790T1 AT95943682T AT95943682T ATE218790T1 AT E218790 T1 ATE218790 T1 AT E218790T1 AT 95943682 T AT95943682 T AT 95943682T AT 95943682 T AT95943682 T AT 95943682T AT E218790 T1 ATE218790 T1 AT E218790T1
- Authority
- AT
- Austria
- Prior art keywords
- conductive
- circuits
- dynamic pressure
- pressure cushion
- circuit board
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/045—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by making a conductive layer having a relief pattern, followed by abrading of the raised portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
- H05K7/1447—External wirings; Wiring ducts; Laying cables
- H05K7/1451—External wirings; Wiring ducts; Laying cables with connections between circuit boards or units
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/036—Multilayers with layers of different types
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0715—Shielding provided by an outer layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/025—Abrading, e.g. grinding or sand blasting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/063—Lamination of preperforated insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
- Tires In General (AREA)
- Saccharide Compounds (AREA)
- Solid-Sorbent Or Filter-Aiding Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/358,855 US5528001A (en) | 1992-02-14 | 1994-12-19 | Circuit of electrically conductive paths on a dielectric with a grid of isolated conductive features that are electrically insulated from the paths |
PCT/US1995/015809 WO1996019912A1 (en) | 1994-12-19 | 1995-12-07 | An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE218790T1 true ATE218790T1 (de) | 2002-06-15 |
Family
ID=23411321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT95943682T ATE218790T1 (de) | 1994-12-19 | 1995-12-07 | Umweltfreundlich hergestellte leiterplatte und zugehörige vorrichtung |
Country Status (6)
Country | Link |
---|---|
US (2) | US5528001A (de) |
EP (1) | EP0806127B1 (de) |
JP (1) | JPH10511606A (de) |
AT (1) | ATE218790T1 (de) |
DE (1) | DE69526974T2 (de) |
WO (1) | WO1996019912A1 (de) |
Families Citing this family (66)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6182359B1 (en) * | 1997-01-31 | 2001-02-06 | Lear Automotive Dearborn, Inc. | Manufacturing process for printed circuits |
US6168100B1 (en) | 1997-10-23 | 2001-01-02 | Toyota Jidosha Kabushiki Kaisha | Method for producing embossed metallic flakelets |
US5966982A (en) * | 1998-03-11 | 1999-10-19 | Framatome Connectors Usa, Inc. | Dimpling Die set |
JP4151136B2 (ja) * | 1998-06-15 | 2008-09-17 | 松下電器産業株式会社 | 基板および半導体装置とその製造方法 |
JP3420076B2 (ja) * | 1998-08-31 | 2003-06-23 | 新光電気工業株式会社 | フリップチップ実装基板の製造方法及びフリップチップ実装基板及びフリップチップ実装構造 |
JP2000332369A (ja) * | 1999-05-25 | 2000-11-30 | Mitsui Mining & Smelting Co Ltd | プリント回路板及びその製造方法 |
US6250129B1 (en) * | 1999-07-30 | 2001-06-26 | Federal-Mogul World Wide, Inc. | Apparatus and method for re-shaping brake cores |
US6755069B1 (en) * | 1999-10-05 | 2004-06-29 | Texas Instruments Incorporated | Method and tooling for z-axis offset of lead frames |
US6338383B1 (en) | 1999-12-22 | 2002-01-15 | Visteon Global Technologies, Inc. | Heat exchanger and method of making same |
DE10000090A1 (de) * | 2000-01-04 | 2001-08-30 | Elfo Ag Sachseln Sachseln | Verfahren zum Herstellen einer mehrlagigen Planarspule |
US6632343B1 (en) * | 2000-08-30 | 2003-10-14 | Micron Technology, Inc. | Method and apparatus for electrolytic plating of surface metals |
EP1211694B1 (de) * | 2000-12-01 | 2006-09-20 | Seiko Instruments Inc. | Vorrichtung und Verfahren zur Herstellung einer optischen Apertur |
US7371975B2 (en) * | 2002-12-18 | 2008-05-13 | Intel Corporation | Electronic packages and components thereof formed by substrate-imprinting |
US7637008B2 (en) * | 2002-12-18 | 2009-12-29 | Intel Corporation | Methods for manufacturing imprinted substrates |
US20040126547A1 (en) * | 2002-12-31 | 2004-07-01 | Coomer Boyd L. | Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
JP2004296886A (ja) * | 2003-03-27 | 2004-10-21 | Shinko Electric Ind Co Ltd | リードフレームのダウンセット加工装置およびダウンセット加工方法、ならびにリードフレーム |
SE526725C2 (sv) * | 2003-09-17 | 2005-11-01 | Acreo Ab | Förfarande och anordning för tillverkning av elektriska komponenter |
US7265299B2 (en) * | 2004-03-04 | 2007-09-04 | Au Optronics Corporation | Method for reducing voltage drop across metal lines of electroluminescence display devices |
DE102007055275A1 (de) * | 2007-11-20 | 2009-05-28 | Hahn-Schickard-Gesellschaft für angewandte Forschung e.V. | Flexibles Schaltungssubstrat für elektrische Schaltungen und Verfahren zur Herstellung desselben |
WO2011139619A1 (en) | 2010-04-26 | 2011-11-10 | Hsio Technologies, Llc | Semiconductor device package adapter |
WO2014011232A1 (en) | 2012-07-12 | 2014-01-16 | Hsio Technologies, Llc | Semiconductor socket with direct selective metalization |
US9276336B2 (en) | 2009-05-28 | 2016-03-01 | Hsio Technologies, Llc | Metalized pad to electrical contact interface |
US8955215B2 (en) | 2009-05-28 | 2015-02-17 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
US9318862B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Method of making an electronic interconnect |
US8618649B2 (en) | 2009-06-02 | 2013-12-31 | Hsio Technologies, Llc | Compliant printed circuit semiconductor package |
US9930775B2 (en) | 2009-06-02 | 2018-03-27 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US8955216B2 (en) | 2009-06-02 | 2015-02-17 | Hsio Technologies, Llc | Method of making a compliant printed circuit peripheral lead semiconductor package |
WO2010147934A1 (en) | 2009-06-16 | 2010-12-23 | Hsio Technologies, Llc | Semiconductor die terminal |
WO2013036565A1 (en) | 2011-09-08 | 2013-03-14 | Hsio Technologies, Llc | Direct metalization of electrical circuit structures |
US8987886B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Copper pillar full metal via electrical circuit structure |
US9277654B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Composite polymer-metal electrical contacts |
US8525346B2 (en) | 2009-06-02 | 2013-09-03 | Hsio Technologies, Llc | Compliant conductive nano-particle electrical interconnect |
US9232654B2 (en) | 2009-06-02 | 2016-01-05 | Hsio Technologies, Llc | High performance electrical circuit structure |
US8610265B2 (en) | 2009-06-02 | 2013-12-17 | Hsio Technologies, Llc | Compliant core peripheral lead semiconductor test socket |
US9276339B2 (en) | 2009-06-02 | 2016-03-01 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
US9414500B2 (en) | 2009-06-02 | 2016-08-09 | Hsio Technologies, Llc | Compliant printed flexible circuit |
US9184527B2 (en) | 2009-06-02 | 2015-11-10 | Hsio Technologies, Llc | Electrical connector insulator housing |
US8912812B2 (en) | 2009-06-02 | 2014-12-16 | Hsio Technologies, Llc | Compliant printed circuit wafer probe diagnostic tool |
WO2010141313A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit socket diagnostic tool |
US8988093B2 (en) | 2009-06-02 | 2015-03-24 | Hsio Technologies, Llc | Bumped semiconductor wafer or die level electrical interconnect |
WO2010141297A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit wafer level semiconductor package |
US9196980B2 (en) | 2009-06-02 | 2015-11-24 | Hsio Technologies, Llc | High performance surface mount electrical interconnect with external biased normal force loading |
WO2012074963A1 (en) | 2010-12-01 | 2012-06-07 | Hsio Technologies, Llc | High performance surface mount electrical interconnect |
WO2010141311A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit area array semiconductor device package |
WO2010141318A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Compliant printed circuit peripheral lead semiconductor test socket |
WO2010141303A1 (en) | 2009-06-02 | 2010-12-09 | Hsio Technologies, Llc | Resilient conductive electrical interconnect |
US9613841B2 (en) | 2009-06-02 | 2017-04-04 | Hsio Technologies, Llc | Area array semiconductor device package interconnect structure with optional package-to-package or flexible circuit to package connection |
WO2014011226A1 (en) | 2012-07-10 | 2014-01-16 | Hsio Technologies, Llc | Hybrid printed circuit assembly with low density main core and embedded high density circuit regions |
US9320133B2 (en) | 2009-06-02 | 2016-04-19 | Hsio Technologies, Llc | Electrical interconnect IC device socket |
US8803539B2 (en) | 2009-06-03 | 2014-08-12 | Hsio Technologies, Llc | Compliant wafer level probe assembly |
WO2010147782A1 (en) | 2009-06-16 | 2010-12-23 | Hsio Technologies, Llc | Simulated wirebond semiconductor package |
US9320144B2 (en) | 2009-06-17 | 2016-04-19 | Hsio Technologies, Llc | Method of forming a semiconductor socket |
US8984748B2 (en) | 2009-06-29 | 2015-03-24 | Hsio Technologies, Llc | Singulated semiconductor device separable electrical interconnect |
US8981809B2 (en) | 2009-06-29 | 2015-03-17 | Hsio Technologies, Llc | Compliant printed circuit semiconductor tester interface |
US9350093B2 (en) | 2010-06-03 | 2016-05-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US8758067B2 (en) | 2010-06-03 | 2014-06-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US9689897B2 (en) | 2010-06-03 | 2017-06-27 | Hsio Technologies, Llc | Performance enhanced semiconductor socket |
US10159154B2 (en) | 2010-06-03 | 2018-12-18 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer circuit structure |
CN101888770B (zh) * | 2010-07-07 | 2015-08-12 | 中兴通讯股份有限公司 | 一种柔性导电材料基板及其实现方法 |
DE102012200343A1 (de) * | 2012-01-11 | 2013-07-11 | E.G.O. Elektro-Gerätebau GmbH | Bauteilträger, elektrischer Leiter und Verfahren zur Herstellung eines Bauteilträgers sowie eines elektrischen Leiters |
US9089071B2 (en) * | 2012-06-28 | 2015-07-21 | International Business Machines Corporation | Implementing enhanced low loss, thin, high performance flexible circuits |
US9761520B2 (en) | 2012-07-10 | 2017-09-12 | Hsio Technologies, Llc | Method of making an electrical connector having electrodeposited terminals |
US10667410B2 (en) | 2013-07-11 | 2020-05-26 | Hsio Technologies, Llc | Method of making a fusion bonded circuit structure |
US10506722B2 (en) | 2013-07-11 | 2019-12-10 | Hsio Technologies, Llc | Fusion bonded liquid crystal polymer electrical circuit structure |
DE102013020555A1 (de) * | 2013-12-09 | 2015-06-11 | Giesecke & Devrient Gmbh | Verfahren zum Herstellen eines Modulstreifens |
US9559447B2 (en) | 2015-03-18 | 2017-01-31 | Hsio Technologies, Llc | Mechanical contact retention within an electrical connector |
Family Cites Families (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2427144A (en) * | 1936-11-23 | 1947-09-09 | Jansen Franciscus Jo Wilhelmus | Mechanical connection for electrical circuits |
US2638660A (en) * | 1945-04-03 | 1953-05-19 | Philips Lab Inc | Electrical insulator |
US2535674A (en) * | 1946-05-11 | 1950-12-26 | Albert W Franklin | Die for cutting electrical units |
US2716268A (en) * | 1952-10-16 | 1955-08-30 | Erie Resistor Corp | Method of making printed circuits |
US2757443A (en) * | 1953-01-21 | 1956-08-07 | Erie Resistor Corp | Method of making printed circuits |
US2837619A (en) * | 1954-08-30 | 1958-06-03 | Stein Samuel | Strain sensitive element and method of manufacture |
US2861911A (en) * | 1954-12-20 | 1958-11-25 | Molded Fiber Glass Body Compan | Electrically conductive body and method of making same |
US2912745A (en) * | 1955-08-25 | 1959-11-17 | Erie Resistor Corp | Method of making a printed circuit |
US2912746A (en) * | 1955-10-10 | 1959-11-17 | Erie Resistor Corp | Method of making printed circuit panels |
US2912748A (en) * | 1956-05-28 | 1959-11-17 | Erie Resistor Corp | Method of making printed circuit panels |
US3037265A (en) * | 1957-12-30 | 1962-06-05 | Ibm | Method for making printed circuits |
US3148098A (en) * | 1960-11-03 | 1964-09-08 | Day Company | Method of producing electrical components |
US3301730A (en) * | 1961-04-03 | 1967-01-31 | Rogers Corp | Method of making a printed circuit |
US3158421A (en) * | 1961-12-04 | 1964-11-24 | Gen Dynamics Corp | Electrical connector for a printed circuit board and cable |
US3147054A (en) * | 1962-06-14 | 1964-09-01 | Rca Corp | Test point extender for circuit boards |
US3410743A (en) * | 1964-09-28 | 1968-11-12 | Gen Motors Corp | Method of making printed circuits |
US3423260A (en) * | 1966-03-21 | 1969-01-21 | Bunker Ramo | Method of making a thin film circuit having a resistor-conductor pattern |
US3434208A (en) * | 1966-12-16 | 1969-03-25 | William H Toomey | Circuit assembly process |
US3523802A (en) * | 1967-01-31 | 1970-08-11 | Mayer & Co Inc O | Liquid smoke composition and method of making same |
US3488890A (en) * | 1967-03-09 | 1970-01-13 | Western Electric Co | Method of and apparatus for adjusting film resistors to a desired resistance value |
US3612745A (en) * | 1970-07-08 | 1971-10-12 | Sierracin Corp | Flexural bus bar assembly |
US3875542A (en) * | 1971-02-10 | 1975-04-01 | Tektronix Inc | High frequency fuse |
US3889363A (en) * | 1971-02-16 | 1975-06-17 | Richard P Davis | Method of making printed circuit boards |
DE2136386A1 (de) * | 1971-07-21 | 1973-02-01 | Wagner Schaltungstechnik | Elektrische schmelzsicherung und verfahren zu ihrer herstellung |
US4089734A (en) * | 1974-09-16 | 1978-05-16 | Raytheon Company | Integrated circuit fusing technique |
US4075420A (en) * | 1975-08-28 | 1978-02-21 | Burroughs Corporation | Cover layer for flexible circuits |
US4357750A (en) * | 1976-06-21 | 1982-11-09 | Advanced Circuit Technology Inc. | Jumper cable |
US4080027A (en) * | 1976-07-30 | 1978-03-21 | Gte Sylvania Incorporated | Electrical contact and connector |
US4020548A (en) * | 1976-08-25 | 1977-05-03 | Western Electric Company, Inc. | Forming and stripping of conductors |
US4091125A (en) * | 1976-11-08 | 1978-05-23 | Delgadillo Joseph A | Circuit board and method for producing same |
US4306925A (en) * | 1977-01-11 | 1981-12-22 | Pactel Corporation | Method of manufacturing high density printed circuit |
US4246563A (en) * | 1977-05-28 | 1981-01-20 | Aktieselkabet Laur. Knudsen Nordisk Electricitets | Electric safety fuse |
US4272753A (en) * | 1978-08-16 | 1981-06-09 | Harris Corporation | Integrated circuit fuse |
US4406062A (en) * | 1979-11-05 | 1983-09-27 | Thomas & Betts Corporation | Method of forming a multichannel connector |
US4325771A (en) * | 1980-03-19 | 1982-04-20 | Gte Products Corporation | Method of making a die-stamped circuit board assembly for photoflash devices |
US4532152A (en) * | 1982-03-05 | 1985-07-30 | Elarde Vito D | Fabrication of a printed circuit board with metal-filled channels |
US4604799A (en) * | 1982-09-03 | 1986-08-12 | John Fluke Mfg. Co., Inc. | Method of making molded circuit board |
US4775611A (en) * | 1983-11-10 | 1988-10-04 | Sullivan Donald F | Additive printed circuit boards with flat surface and indented primary wiring conductors |
US4528259A (en) * | 1983-11-10 | 1985-07-09 | Sullivan Donald F | Printed wiring boards with solder mask over bare copper wires having large area thickened circuit pad connections |
US4655518A (en) * | 1984-08-17 | 1987-04-07 | Teradyne, Inc. | Backplane connector |
US4651417A (en) * | 1984-10-23 | 1987-03-24 | New West Technology Corporation | Method for forming printed circuit board |
US4721550A (en) * | 1986-05-05 | 1988-01-26 | New West Technology Corporation | Process for producing printed circuit board having improved adhesion |
US4840702A (en) * | 1987-12-29 | 1989-06-20 | Action Technologies, Inc. | Apparatus and method for plasma treating of circuit boards |
CH680483A5 (de) * | 1989-10-20 | 1992-08-31 | Kobe Properties Ltd | |
JP2806580B2 (ja) * | 1989-12-15 | 1998-09-30 | 日本電気株式会社 | 表面実装コネクタ |
US5168741A (en) * | 1990-11-20 | 1992-12-08 | Braunheim Stephen T | Method for forming a leading edge cover for jet engine blades |
US5097101A (en) * | 1991-02-05 | 1992-03-17 | Tektronix, Inc. | Method of forming a conductive contact bump on a flexible substrate and a flexible substrate |
US5161403A (en) * | 1991-06-25 | 1992-11-10 | Digital Equipment Corporation | Method and apparatus for forming coplanar contact projections on flexible circuits |
US5343616B1 (en) * | 1992-02-14 | 1998-12-29 | Rock Ltd | Method of making high density self-aligning conductive networks and contact clusters |
-
1994
- 1994-12-19 US US08/358,855 patent/US5528001A/en not_active Expired - Fee Related
-
1995
- 1995-12-07 AT AT95943682T patent/ATE218790T1/de active
- 1995-12-07 DE DE69526974T patent/DE69526974T2/de not_active Expired - Fee Related
- 1995-12-07 EP EP95943682A patent/EP0806127B1/de not_active Expired - Lifetime
- 1995-12-07 JP JP8519834A patent/JPH10511606A/ja not_active Ceased
- 1995-12-07 WO PCT/US1995/015809 patent/WO1996019912A1/en active IP Right Grant
-
1996
- 1996-03-25 US US08/622,243 patent/US5819579A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0806127A4 (de) | 1999-04-21 |
EP0806127A1 (de) | 1997-11-12 |
DE69526974T2 (de) | 2003-01-09 |
WO1996019912A1 (en) | 1996-06-27 |
US5528001A (en) | 1996-06-18 |
JPH10511606A (ja) | 1998-11-10 |
US5819579A (en) | 1998-10-13 |
DE69526974D1 (de) | 2002-07-11 |
EP0806127B1 (de) | 2002-06-05 |
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