ATE213374T1 - Vorrichtung zur strahlungsbildaufnahme - Google Patents

Vorrichtung zur strahlungsbildaufnahme

Info

Publication number
ATE213374T1
ATE213374T1 AT98965690T AT98965690T ATE213374T1 AT E213374 T1 ATE213374 T1 AT E213374T1 AT 98965690 T AT98965690 T AT 98965690T AT 98965690 T AT98965690 T AT 98965690T AT E213374 T1 ATE213374 T1 AT E213374T1
Authority
AT
Austria
Prior art keywords
cell
array
image
cells
imaging
Prior art date
Application number
AT98965690T
Other languages
German (de)
English (en)
Inventor
Konstantinos E Spartiotis
Jouni Iiari Pyyhtia
Markku Tapio Eraluoto
Original Assignee
Simage Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Simage Oy filed Critical Simage Oy
Application granted granted Critical
Publication of ATE213374T1 publication Critical patent/ATE213374T1/de

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/443Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by reading pixels from selected 2D regions of the array, e.g. for windowing or digital zooming
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/30Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from X-rays
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/779Circuitry for scanning or addressing the pixel array
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/7795Circuitry for generating timing or clock signals

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
  • Measurement Of Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
AT98965690T 1997-12-18 1998-11-16 Vorrichtung zur strahlungsbildaufnahme ATE213374T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9726768A GB2332800B (en) 1997-12-18 1997-12-18 Device for imaging radiation
PCT/EP1998/007523 WO1999033258A1 (en) 1997-12-18 1998-11-16 Device for imaging radiation

Publications (1)

Publication Number Publication Date
ATE213374T1 true ATE213374T1 (de) 2002-02-15

Family

ID=10823837

Family Applications (1)

Application Number Title Priority Date Filing Date
AT98965690T ATE213374T1 (de) 1997-12-18 1998-11-16 Vorrichtung zur strahlungsbildaufnahme

Country Status (9)

Country Link
US (1) US6255638B1 (enExample)
EP (1) EP1040649B1 (enExample)
JP (1) JP4531251B2 (enExample)
AT (1) ATE213374T1 (enExample)
AU (1) AU2153999A (enExample)
DE (1) DE69803881T2 (enExample)
GB (2) GB2332800B (enExample)
IL (1) IL136705A0 (enExample)
WO (1) WO1999033258A1 (enExample)

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JP4009761B2 (ja) * 1997-03-31 2007-11-21 株式会社ニコン 固体撮像素子
GB2332585B (en) * 1997-12-18 2000-09-27 Simage Oy Device for imaging radiation
US6665010B1 (en) * 1998-07-21 2003-12-16 Intel Corporation Controlling integration times of pixel sensors
US6977685B1 (en) * 1999-02-26 2005-12-20 Massachusetts Institute Of Technology Single-chip imager system with programmable dynamic range
US6677996B1 (en) * 1999-04-21 2004-01-13 Pictos Technologies, Inc. Real time camera exposure control
DE19947536A1 (de) * 1999-10-02 2001-04-05 Philips Corp Intellectual Pty Verfahren zum Auslesen der Sensorelemente eines Sensors sowie Sensor
WO2001039558A1 (en) * 1999-11-23 2001-05-31 Koninklijke Philips Electronics N.V. X-ray examination apparatus with exposure control
JP4746808B2 (ja) * 1999-11-23 2011-08-10 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 露光制御付きx線診断装置
US7071980B2 (en) * 2000-07-27 2006-07-04 Canon Kabushiki Kaisha Image sensing apparatus
US6400798B1 (en) * 2000-08-01 2002-06-04 Ge Medical Systems Global Technology Company, Llc Simple means for measuring the offset induced by photo-conductive FETs in a solid state X-ray detector
EP1267567A1 (en) * 2001-06-14 2002-12-18 CSEM Centre Suisse d'Electronique et de Microtechnique High speed optoelectronic active-pixel sensor and method for detecting electromagnetic radiation
US6794627B2 (en) * 2001-10-24 2004-09-21 Foveon, Inc. Aggregation of active pixel sensor signals
DE10160527A1 (de) * 2001-12-10 2003-06-26 Siemens Ag Sensoranordnung mit Auslesemitteln zur Differenzbildung
GB0202506D0 (en) * 2002-02-02 2002-03-20 Qinetiq Ltd Reconfigurable detector array
EP1335587A1 (en) * 2002-02-08 2003-08-13 STMicroelectronics S.r.l. A method for down-scaling a digital image and a digital camera for processing images of different resolutions
DE10245715A1 (de) * 2002-10-01 2004-04-15 Philips Intellectual Property & Standards Gmbh Verfahren und Vorrichtung zur Erzeugung von Teilabbildungen
US7223981B1 (en) 2002-12-04 2007-05-29 Aguila Technologies Inc. Gamma ray detector modules
US7408195B2 (en) * 2003-09-04 2008-08-05 Cypress Semiconductor Corporation (Belgium) Bvba Semiconductor pixel arrays with reduced sensitivity to defects
US7317190B2 (en) * 2004-09-24 2008-01-08 General Electric Company Radiation absorbing x-ray detector panel support
US7866163B2 (en) * 2004-10-04 2011-01-11 General Electric Company Radiographic detector docking station with dynamic environmental control
US7046764B1 (en) 2004-10-04 2006-05-16 General Electric Company X-ray detector having an accelerometer
US7189972B2 (en) * 2004-10-04 2007-03-13 General Electric Company X-ray detector with impact absorbing cover
US7242430B2 (en) * 2004-11-03 2007-07-10 Taiwan Semiconductor Manufacturing Co., Ltd. High dynamic range image sensor cell
US7342998B2 (en) * 2004-11-18 2008-03-11 General Electric Company X-ray detector quick-connect connection system
US7381964B1 (en) 2004-11-24 2008-06-03 General Electric Company Method and system of x-ray data calibration
US7581885B2 (en) * 2004-11-24 2009-09-01 General Electric Company Method and system of aligning x-ray detector for data acquisition
JP4277216B2 (ja) * 2005-01-13 2009-06-10 ソニー株式会社 撮像装置及び撮像結果の処理方法
DE102005047539A1 (de) * 2005-09-30 2007-04-05 Siemens Ag Bildverarbeitungsverfahren zur Fensterung und/oder Dosisregelung für medizinische Diagnostikeinrichtungen
FR2922071A1 (fr) * 2007-10-03 2009-04-10 Commissariat Energie Atomique Dispositif microelectronique matriciel dote de pixels avec precharge des colonnes de la matrice
US9201150B2 (en) * 2008-02-25 2015-12-01 Koninklijke Philips N.V. Suppression of direct detection events in X-ray detectors
US8723827B2 (en) 2009-07-28 2014-05-13 Cypress Semiconductor Corporation Predictive touch surface scanning
GB2574619B (en) * 2018-06-12 2022-10-12 Res & Innovation Uk Image sensor

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
FR2548498B1 (fr) * 1983-06-28 1985-10-18 Thomson Csf Procede de correction du niveau en sortie d'un dispositif a transfert de charge et dispositif pour sa mise en oeuvre
JPH0744627B2 (ja) 1987-12-21 1995-05-15 株式会社日立製作所 イメージセンサ駆動方法
US5262871A (en) 1989-11-13 1993-11-16 Rutgers, The State University Multiple resolution image sensor
US5581301A (en) * 1990-10-03 1996-12-03 Canon Kabushiki Kaisha Image processing apparatus with adjustable low-pass optical filter characteristics
JPH04199968A (ja) 1990-11-29 1992-07-21 Toshiba Corp 固体撮像装置
US5245191A (en) * 1992-04-14 1993-09-14 The Board Of Regents Of The University Of Arizona Semiconductor sensor for gamma-ray tomographic imaging system
WO1994030004A1 (en) * 1993-06-16 1994-12-22 Cambridge Imaging Limited Improved imaging system
GB2289983B (en) * 1994-06-01 1996-10-16 Simage Oy Imaging devices,systems and methods
GB2289979A (en) 1994-06-01 1995-12-06 Simage Oy Imaging devices systems and methods
JP3668305B2 (ja) * 1995-12-05 2005-07-06 オリンパス株式会社 固体撮像装置
JP4173197B2 (ja) * 1995-12-18 2008-10-29 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 補正ユニットを有する画像センサマトリックスを含むx線検査装置
JP3897389B2 (ja) * 1996-02-22 2007-03-22 キヤノン株式会社 光電変換装置の駆動方法及び光電変換装置
JP3791708B2 (ja) * 1996-05-20 2006-06-28 オリンパス株式会社 固体撮像装置
GB2319394B (en) * 1996-12-27 1998-10-28 Simage Oy Bump-bonded semiconductor imaging device
US5973311A (en) * 1997-02-12 1999-10-26 Imation Corp Pixel array with high and low resolution mode

Also Published As

Publication number Publication date
EP1040649B1 (en) 2002-02-13
IL136705A0 (en) 2001-06-14
GB2332800A (en) 1999-06-30
US6255638B1 (en) 2001-07-03
JP4531251B2 (ja) 2010-08-25
GB2332586A (en) 1999-06-23
GB2332586B (en) 2000-09-06
GB2332586A9 (en)
DE69803881D1 (de) 2002-03-21
JP2001527341A (ja) 2001-12-25
AU2153999A (en) 1999-07-12
WO1999033258A1 (en) 1999-07-01
DE69803881T2 (de) 2002-08-14
GB9823403D0 (en) 1998-12-23
GB2332800B (en) 2000-09-27
EP1040649A1 (en) 2000-10-04
GB9726768D0 (en) 1998-02-18

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee