ATE204031T1 - Beschichtung für wärmeisolierende materialien, verfahren und verwendung davon zur herstellung von abschirmungen für isolierstoffgehäuse - Google Patents

Beschichtung für wärmeisolierende materialien, verfahren und verwendung davon zur herstellung von abschirmungen für isolierstoffgehäuse

Info

Publication number
ATE204031T1
ATE204031T1 AT97402224T AT97402224T ATE204031T1 AT E204031 T1 ATE204031 T1 AT E204031T1 AT 97402224 T AT97402224 T AT 97402224T AT 97402224 T AT97402224 T AT 97402224T AT E204031 T1 ATE204031 T1 AT E204031T1
Authority
AT
Austria
Prior art keywords
coating
insulating materials
thermal insulating
insulated housings
shields
Prior art date
Application number
AT97402224T
Other languages
English (en)
Inventor
Christophe Heau
Paul Berger
Original Assignee
Tecmachine
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tecmachine filed Critical Tecmachine
Application granted granted Critical
Publication of ATE204031T1 publication Critical patent/ATE204031T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14Metallic material, boron or silicon
    • C23C14/20Metallic material, boron or silicon on organic substrates
    • C23C14/205Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12556Organic component
    • Y10T428/12569Synthetic resin
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12896Ag-base component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12944Ni-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
  • Table Devices Or Equipment (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Insulating Bodies (AREA)
  • Paints Or Removers (AREA)
  • Thermal Insulation (AREA)
  • Moulding By Coating Moulds (AREA)
  • Insulated Conductors (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Conductive Materials (AREA)
  • Road Signs Or Road Markings (AREA)
AT97402224T 1996-09-26 1997-09-24 Beschichtung für wärmeisolierende materialien, verfahren und verwendung davon zur herstellung von abschirmungen für isolierstoffgehäuse ATE204031T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9611724A FR2753725B1 (fr) 1996-09-26 1996-09-26 Revetement de surface de materiaux isolants, son procede d'obtention et son application pour la realisation de blindages pour boitiers isolants

Publications (1)

Publication Number Publication Date
ATE204031T1 true ATE204031T1 (de) 2001-08-15

Family

ID=9496078

Family Applications (1)

Application Number Title Priority Date Filing Date
AT97402224T ATE204031T1 (de) 1996-09-26 1997-09-24 Beschichtung für wärmeisolierende materialien, verfahren und verwendung davon zur herstellung von abschirmungen für isolierstoffgehäuse

Country Status (16)

Country Link
US (1) US6042950A (de)
EP (1) EP0834600B1 (de)
JP (1) JP3290389B2 (de)
KR (1) KR100296376B1 (de)
CN (1) CN1098025C (de)
AT (1) ATE204031T1 (de)
BR (1) BR9706213A (de)
CA (1) CA2215223C (de)
DE (1) DE69706015T2 (de)
DK (1) DK0834600T3 (de)
ES (1) ES2159093T3 (de)
FR (1) FR2753725B1 (de)
GR (1) GR3037068T3 (de)
MY (1) MY116978A (de)
PT (1) PT834600E (de)
TW (1) TW360878B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483719B1 (en) * 2000-03-21 2002-11-19 Spraylat Corporation Conforming shielded form for electronic component assemblies
US7422384B2 (en) * 2004-03-17 2008-09-09 Hewlett-Packard Development, L.P. System and a method for printing small print jobs
US7261793B2 (en) * 2004-08-13 2007-08-28 Hewlett-Packard Development Company, L.P. System and method for low temperature plasma-enhanced bonding
US8124182B2 (en) 2007-06-15 2012-02-28 The Boeing Company Application of insulating coating
KR101211559B1 (ko) * 2009-12-23 2012-12-12 주식회사 삼양사 전자파 차폐 필름의 제조 방법
US9856565B2 (en) 2012-12-31 2018-01-02 Sabic Global Technologies B.V. Metallization and surface coating solution on glass filler high peformance amorphous polymer compositions
CN107018648A (zh) * 2017-06-02 2017-08-04 深圳天珑无线科技有限公司 屏蔽罩及其制备方法、电子装置
CN108695692B (zh) * 2018-06-29 2024-03-19 余姚市海泰贸易有限公司 一种高度集成抗电磁屏蔽高压配电盒
CN111465306B (zh) * 2020-04-24 2023-03-24 中国科学院苏州纳米技术与纳米仿生研究所 滤波屏蔽装置及防杂散光干扰的量子处理系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5629837A (en) * 1979-08-10 1981-03-25 Tdk Corp Magnetic recording medium and its manufacture
AU572881B2 (en) * 1983-09-09 1988-05-19 Ppg Industries Ohio, Inc. Sputtering oxidative metal film
CA2099852A1 (en) * 1992-07-07 1994-01-08 Stephen Randall Holmes-Farley Process for utilizing a metallic interlayer to enhance adhesion between a metal and a polymeric substrate
GB2270421A (en) * 1992-09-08 1994-03-09 Gen Electric Telecommunications apparatus
US5589280A (en) * 1993-02-05 1996-12-31 Southwall Technologies Inc. Metal on plastic films with adhesion-promoting layer
DE4307740C2 (de) * 1993-03-11 1994-12-22 Ttk Kunststoff Tech Gmbh Verfahren zur Herstellung von Gehäusen mit wenigstens einer metallischen Abschirmschicht
DE4443530A1 (de) * 1993-12-16 1995-06-22 Basf Magnetics Gmbh Magnetisches Aufzeichnungsmedium und Verfahren zur Herstellung desselben

Also Published As

Publication number Publication date
CN1098025C (zh) 2003-01-01
EP0834600A1 (de) 1998-04-08
KR100296376B1 (ko) 2001-08-07
MY116978A (en) 2004-04-30
FR2753725B1 (fr) 1998-11-27
ES2159093T3 (es) 2001-09-16
EP0834600B1 (de) 2001-08-08
KR19980024896A (ko) 1998-07-06
CA2215223C (fr) 2004-07-06
MX9707349A (es) 1998-08-30
GR3037068T3 (en) 2002-01-31
JPH10102239A (ja) 1998-04-21
CA2215223A1 (fr) 1998-03-26
JP3290389B2 (ja) 2002-06-10
TW360878B (en) 1999-06-11
PT834600E (pt) 2001-12-28
DE69706015T2 (de) 2001-11-29
DE69706015D1 (de) 2001-09-13
BR9706213A (pt) 1999-05-25
CN1185089A (zh) 1998-06-17
FR2753725A1 (fr) 1998-03-27
DK0834600T3 (da) 2001-10-08
US6042950A (en) 2000-03-28

Similar Documents

Publication Publication Date Title
DE69737328D1 (de) Niedertemperaturverfahren und zusammensetzungen zur herstellung elektischer leiter
ATE204031T1 (de) Beschichtung für wärmeisolierende materialien, verfahren und verwendung davon zur herstellung von abschirmungen für isolierstoffgehäuse
DE69034139D1 (de) Keramiksubstrat zur Herstellung elektrischer oder elektronischer Schaltungen
ATE316426T1 (de) Metallisierungsstrukturen für mikroelektronische anwendungen und verfahren zur herstellung dieser strukturen
DE60118164D1 (de) Oberflächenbehandeltes, elektrisch leitfähiges metallteil und verfahren zur herstellung desselben
DE59803128D1 (de) Verfahren zur Herstellung eines metallischen Verbundbands
MY111443A (en) Metal film resistor having fuse function and method for producing the same
DE3783526D1 (de) Elektro-bauelement.
EP0257487A3 (de) Funkenerosionselektrode
EP0024625A3 (en) Method of producing an electrical contact on a si substrate
ATE355619T1 (de) Verfahren zur herstellung eines wenigstens bereichsweise elektrisch leitenden akkumulatorendeckels
DE69317891D1 (de) Beschichtungsverfahren zur erzeugung von elektroleitfähigen pulvern
ES2042166T3 (es) Procedimiento de recubrimiento.
ATE78967T1 (de) Elektrisch leitende kupferschichten und verfahren zur herstellung derselben.
JPS53123080A (en) Circuit substrate and ceramic package assembly and method of producing same
ATE90831T1 (de) Verfahren zur herstellung von metallkerne enthaltenden elektrischen leiterplatten und basismaterial dafuer.
DE69028241D1 (de) Verfahren zur Herstellung von dünnen kornorientierten Elektroblechen mit geringen Eisenverlusten und hoher Flussdichte
HK1004884A1 (en) Method of forming metallic conductive patterns on insulating substrates
EP0227000A3 (de) Verfahren zur Herstellung abgeschirmter Drähte
PL240655A1 (en) Method of manufacture of electrodes with substrate made of lead or lead alloy
JPS5285362A (en) Method of producing connecting terminal of ceramic wiring substrate
AT375408B (de) Verfahren und einrichtung zur ionengestuetzten beschichtung elektrisch isolierender substrate
JPS57130495A (en) Method of producing electric part mounting substrate
RU1774415C (ru) Способ соединени изолированных микропроводов с металлическими токоподводами и между собой
ES2009355A6 (es) Procedimiento para preparar recubrimientos aplicables por tecnicas pulvimetalurgicas en piezas mecanicas.

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee