ATE202372T1 - Photoempfindliche harzzusammensetzung - Google Patents
Photoempfindliche harzzusammensetzungInfo
- Publication number
- ATE202372T1 ATE202372T1 AT96935493T AT96935493T ATE202372T1 AT E202372 T1 ATE202372 T1 AT E202372T1 AT 96935493 T AT96935493 T AT 96935493T AT 96935493 T AT96935493 T AT 96935493T AT E202372 T1 ATE202372 T1 AT E202372T1
- Authority
- AT
- Austria
- Prior art keywords
- group
- epoxy resin
- similar
- epoxy
- resin composition
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 5
- 229920000647 polyepoxide Polymers 0.000 abstract 5
- 125000003700 epoxy group Chemical group 0.000 abstract 4
- 229920003986 novolac Polymers 0.000 abstract 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 2
- 150000002903 organophosphorus compounds Chemical class 0.000 abstract 2
- 239000000047 product Substances 0.000 abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 230000003197 catalytic effect Effects 0.000 abstract 1
- 239000007795 chemical reaction product Substances 0.000 abstract 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/064—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4292—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with monocarboxylic acids
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Epoxy Resins (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Photoreceptors In Electrophotography (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28210695A JP3851366B2 (ja) | 1995-10-30 | 1995-10-30 | 感光性樹脂組成物 |
| PCT/JP1996/003173 WO1997016470A1 (en) | 1995-10-30 | 1996-10-30 | Photosensitive resin composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE202372T1 true ATE202372T1 (de) | 2001-07-15 |
Family
ID=17648209
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT96935493T ATE202372T1 (de) | 1995-10-30 | 1996-10-30 | Photoempfindliche harzzusammensetzung |
Country Status (9)
| Country | Link |
|---|---|
| EP (1) | EP0858472B1 (de) |
| JP (1) | JP3851366B2 (de) |
| AT (1) | ATE202372T1 (de) |
| AU (1) | AU705375B2 (de) |
| CA (1) | CA2234110C (de) |
| DE (1) | DE69613479T2 (de) |
| MY (1) | MY114034A (de) |
| TW (1) | TW407224B (de) |
| WO (1) | WO1997016470A1 (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1293116C (zh) * | 2000-02-14 | 2007-01-03 | 太阳油墨制造株式会社 | 形成消光涂膜用的光固化性·热固化性组合物 |
| JP5016768B2 (ja) * | 2000-03-29 | 2012-09-05 | 学校法人神奈川大学 | 活性エネルギー線硬化性樹脂、その製造方法及び光硬化性・熱硬化性樹脂組成物 |
| EP1327642A4 (de) * | 2000-09-20 | 2006-07-19 | Taiyo Ink Mfg Co Ltd | Carboxyliertes photosensitives harz, dieses enthaltende, mit alkali entwickelbare, lichthärtbare/hitzehärtbare zusammensetzung und daraus erhältlicher gehärteter artikel |
| JP4382978B2 (ja) | 2000-12-04 | 2009-12-16 | 学校法人神奈川大学 | 光硬化性・熱硬化性樹脂組成物 |
| JP4682340B2 (ja) * | 2003-07-25 | 2011-05-11 | 昭和電工株式会社 | 感光性樹脂の製造方法 |
| KR100937264B1 (ko) | 2005-08-30 | 2010-01-18 | 히다치 가세고교 가부시끼가이샤 | 감광성 수지 조성물 및 감광성 엘리먼트 |
| EP2292678B1 (de) * | 2008-06-09 | 2012-02-15 | Goo Chemical Co., Ltd. | Carboxylgruppenhaltiges harz, carboxylgruppenhaltiges harz enthaltende härtbare zusammensetzung und gehärtetes produkt der zusammensetzung |
| BR112013021411B1 (pt) | 2011-02-23 | 2020-04-14 | Alzchem Ag | endurecedores de alta latência para resinas epóxi, seus usos, composição de resina epóxi e de poliuretano compreendendo os mesmos e material compósito |
| DK2880072T3 (en) | 2012-08-02 | 2016-12-19 | Alzchem Ag | Liquid hardeners for curing the epoxy resins (II) |
| JP6143090B2 (ja) * | 2013-07-01 | 2017-06-07 | 日立化成株式会社 | 感光性樹脂組成物、これを用いた感光性フィルム、永久レジスト及び永久レジストの製造方法 |
| JP6259240B2 (ja) * | 2013-09-30 | 2018-01-10 | 昭和電工株式会社 | 感光性樹脂の製造方法及びカラーフィルターの製造方法 |
| KR102361595B1 (ko) * | 2015-03-11 | 2022-02-11 | 동우 화인켐 주식회사 | 흑색 감광성 수지 조성물 및 이로부터 제조된 액정표시장치용 블랙 매트릭스 및 컬럼 스페이서 |
| CN104788609B (zh) * | 2015-04-23 | 2017-02-22 | 济南大学 | 一种高交联单分散含有环氧基团的聚合物微球及其制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0823694B2 (ja) * | 1988-08-04 | 1996-03-06 | 富士写真フイルム株式会社 | 液状感光性樹脂組成物 |
| CA2055833C (en) * | 1990-11-20 | 2001-04-24 | Katsue Nishikawa | Preparation of unsaturated epoxy ester resin and carboxylated unsaturated epoxy ester resin and photosensitive composition comprising the same |
-
1995
- 1995-10-30 JP JP28210695A patent/JP3851366B2/ja not_active Expired - Fee Related
-
1996
- 1996-10-14 TW TW085112525A patent/TW407224B/zh not_active IP Right Cessation
- 1996-10-28 MY MYPI96004482A patent/MY114034A/en unknown
- 1996-10-30 AT AT96935493T patent/ATE202372T1/de not_active IP Right Cessation
- 1996-10-30 AU AU73383/96A patent/AU705375B2/en not_active Ceased
- 1996-10-30 DE DE69613479T patent/DE69613479T2/de not_active Expired - Fee Related
- 1996-10-30 WO PCT/JP1996/003173 patent/WO1997016470A1/en not_active Ceased
- 1996-10-30 CA CA002234110A patent/CA2234110C/en not_active Expired - Fee Related
- 1996-10-30 EP EP96935493A patent/EP0858472B1/de not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA2234110A1 (en) | 1997-05-09 |
| EP0858472A1 (de) | 1998-08-19 |
| WO1997016470A1 (en) | 1997-05-09 |
| CA2234110C (en) | 2004-01-06 |
| DE69613479D1 (de) | 2001-07-26 |
| AU705375B2 (en) | 1999-05-20 |
| MY114034A (en) | 2002-07-31 |
| AU7338396A (en) | 1997-05-22 |
| JP3851366B2 (ja) | 2006-11-29 |
| DE69613479T2 (de) | 2002-04-25 |
| EP0858472B1 (de) | 2001-06-20 |
| TW407224B (en) | 2000-10-01 |
| JPH09136942A (ja) | 1997-05-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |