ATE156749T1 - Verfahren und zusammensetzung zum beschichten einer kupferfolie mit einer chrom-zink-anti- anlauf-beschichtung - Google Patents
Verfahren und zusammensetzung zum beschichten einer kupferfolie mit einer chrom-zink-anti- anlauf-beschichtungInfo
- Publication number
- ATE156749T1 ATE156749T1 AT90916601T AT90916601T ATE156749T1 AT E156749 T1 ATE156749 T1 AT E156749T1 AT 90916601 T AT90916601 T AT 90916601T AT 90916601 T AT90916601 T AT 90916601T AT E156749 T1 ATE156749 T1 AT E156749T1
- Authority
- AT
- Austria
- Prior art keywords
- coating
- copper
- tarnish
- ions
- chromium
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Manufacturing & Machinery (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Paints Or Removers (AREA)
- Chemical Treatment Of Metals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US42147589A | 1989-10-13 | 1989-10-13 | |
US45984690A | 1990-01-02 | 1990-01-02 | |
US07/585,832 US5022968A (en) | 1990-09-20 | 1990-09-20 | Method and composition for depositing a chromium-zinc anti-tarnish coating on copper foil |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE156749T1 true ATE156749T1 (de) | 1997-08-15 |
Family
ID=27411315
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT90916601T ATE156749T1 (de) | 1989-10-13 | 1990-09-27 | Verfahren und zusammensetzung zum beschichten einer kupferfolie mit einer chrom-zink-anti- anlauf-beschichtung |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP0458916B1 (de) |
AT (1) | ATE156749T1 (de) |
AU (1) | AU6715490A (de) |
DE (1) | DE69031270T2 (de) |
MY (1) | MY114175A (de) |
WO (1) | WO1991005658A1 (de) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3106484A (en) * | 1961-01-04 | 1963-10-08 | Cowles Chem Co | Metal treating |
JPS587077B2 (ja) * | 1979-12-19 | 1983-02-08 | 日本鉱業株式会社 | 印刷回路用銅箔およびその製造方法 |
US4387006A (en) * | 1981-07-08 | 1983-06-07 | Fukuda Metal Foil & Powder Co., Ltd. | Method of treating the surface of the copper foil used in printed wire boards |
DD264717A1 (de) * | 1987-10-26 | 1989-02-08 | Lokomotivbau Elektrotech | Verfahren zur katodischen behandlung von kupferfolien |
-
1990
- 1990-09-27 AT AT90916601T patent/ATE156749T1/de not_active IP Right Cessation
- 1990-09-27 DE DE69031270T patent/DE69031270T2/de not_active Expired - Lifetime
- 1990-09-27 EP EP90916601A patent/EP0458916B1/de not_active Expired - Lifetime
- 1990-09-27 AU AU67154/90A patent/AU6715490A/en not_active Abandoned
- 1990-09-27 WO PCT/US1990/005441 patent/WO1991005658A1/en active IP Right Grant
- 1990-10-04 MY MYPI95001491A patent/MY114175A/en unknown
Also Published As
Publication number | Publication date |
---|---|
EP0458916B1 (de) | 1997-08-13 |
DE69031270T2 (de) | 1998-03-19 |
EP0458916A1 (de) | 1991-12-04 |
DE69031270D1 (de) | 1997-09-18 |
AU6715490A (en) | 1991-05-16 |
EP0458916A4 (de) | 1994-02-09 |
WO1991005658A1 (en) | 1991-05-02 |
MY114175A (en) | 2002-08-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |