AT521734A3 - Randentlackungssystem und Verfahren zur Behandlung eines Substrats - Google Patents
Randentlackungssystem und Verfahren zur Behandlung eines Substrats Download PDFInfo
- Publication number
- AT521734A3 AT521734A3 ATA50814/2019A AT508142019A AT521734A3 AT 521734 A3 AT521734 A3 AT 521734A3 AT 508142019 A AT508142019 A AT 508142019A AT 521734 A3 AT521734 A3 AT 521734A3
- Authority
- AT
- Austria
- Prior art keywords
- substrate
- treating
- arms
- stripping system
- edge stripping
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Beschrieben ist ein Randwulstbeseitigungssystem (10) zur Behandlung eines Substrats (12), das einen Randwulstbeseitigungskopf (20) mit einem Hauptkörper (22) und zwei von dem Hauptkörper (22) hervorstehende Arme (24) umfasst. Die Arme (24) sind voneinander beabstandet und definieren dazwischen einen Aufnahmeraum (26) für die Unterbringung eines zu behandelnden Substrats (12). Die vorstehenden Arme (24) weisen jeweils eine Funktionsfläche (36) auf, die zueinander gewandt sind, und wobei die Funktionsflächen (36) jeweils mindestens einen Fluidauslass (38) aufweisen. Darüber hinaus ist ein Verfahren zur Behandlung eines Substrats (12) beschrieben.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2021701A NL2021701B1 (en) | 2018-09-25 | 2018-09-25 | Edge bead removal system and method of treating a substrate |
Publications (3)
Publication Number | Publication Date |
---|---|
AT521734A2 AT521734A2 (de) | 2020-04-15 |
AT521734A3 true AT521734A3 (de) | 2021-11-15 |
AT521734B1 AT521734B1 (de) | 2022-06-15 |
Family
ID=64427162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ATA50814/2019A AT521734B1 (de) | 2018-09-25 | 2019-09-24 | Randentlackungssystem und Verfahren zur Behandlung eines Substrats |
Country Status (8)
Country | Link |
---|---|
US (1) | US20200096867A1 (de) |
JP (1) | JP2020092252A (de) |
KR (1) | KR20200035364A (de) |
CN (1) | CN110941152A (de) |
AT (1) | AT521734B1 (de) |
DE (1) | DE102019125661A1 (de) |
NL (1) | NL2021701B1 (de) |
TW (1) | TWI824015B (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022031268A1 (en) * | 2020-08-04 | 2022-02-10 | Applied Materials, Inc. | Apparatus for removing photoresist off of photomask |
US20220269177A1 (en) * | 2021-02-23 | 2022-08-25 | Tokyo Electron Limited | Sensor technology integration into coating track |
CN117497435A (zh) * | 2022-07-21 | 2024-02-02 | 长鑫存储技术有限公司 | 半导体结构的处理方法、处理装置及处理系统 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6062288A (en) * | 1997-04-28 | 2000-05-16 | Tokyo Electron Limited | Processing apparatus |
WO2002049085A1 (en) * | 2000-12-15 | 2002-06-20 | K.C.Tech Co., Ltd. | Apparatus for cleaning the edges of wafers |
US20080081110A1 (en) * | 2006-09-30 | 2008-04-03 | Tokyo Electron Limited | Apparatus and method for removing an edge bead of a spin-coated layer |
US20090211604A1 (en) * | 2008-02-22 | 2009-08-27 | Tokyo Electron Limited | System and Method For Removing Edge-Bead Material |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6453916B1 (en) * | 2000-06-09 | 2002-09-24 | Advanced Micro Devices, Inc. | Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process |
-
2018
- 2018-09-25 NL NL2021701A patent/NL2021701B1/en active
-
2019
- 2019-09-24 DE DE102019125661.5A patent/DE102019125661A1/de active Pending
- 2019-09-24 TW TW108134465A patent/TWI824015B/zh active
- 2019-09-24 AT ATA50814/2019A patent/AT521734B1/de active
- 2019-09-25 JP JP2019174131A patent/JP2020092252A/ja active Pending
- 2019-09-25 CN CN201910912190.7A patent/CN110941152A/zh active Pending
- 2019-09-25 US US16/582,806 patent/US20200096867A1/en not_active Abandoned
- 2019-09-25 KR KR1020190118136A patent/KR20200035364A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6062288A (en) * | 1997-04-28 | 2000-05-16 | Tokyo Electron Limited | Processing apparatus |
WO2002049085A1 (en) * | 2000-12-15 | 2002-06-20 | K.C.Tech Co., Ltd. | Apparatus for cleaning the edges of wafers |
US20080081110A1 (en) * | 2006-09-30 | 2008-04-03 | Tokyo Electron Limited | Apparatus and method for removing an edge bead of a spin-coated layer |
US20090211604A1 (en) * | 2008-02-22 | 2009-08-27 | Tokyo Electron Limited | System and Method For Removing Edge-Bead Material |
Also Published As
Publication number | Publication date |
---|---|
AT521734A2 (de) | 2020-04-15 |
NL2021701B1 (en) | 2020-05-07 |
US20200096867A1 (en) | 2020-03-26 |
TWI824015B (zh) | 2023-12-01 |
JP2020092252A (ja) | 2020-06-11 |
CN110941152A (zh) | 2020-03-31 |
KR20200035364A (ko) | 2020-04-03 |
AT521734B1 (de) | 2022-06-15 |
TW202030775A (zh) | 2020-08-16 |
DE102019125661A1 (de) | 2020-03-26 |
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