JP2020092252A - エッジビード除去システム及び基板処理方法 - Google Patents
エッジビード除去システム及び基板処理方法 Download PDFInfo
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- JP2020092252A JP2020092252A JP2019174131A JP2019174131A JP2020092252A JP 2020092252 A JP2020092252 A JP 2020092252A JP 2019174131 A JP2019174131 A JP 2019174131A JP 2019174131 A JP2019174131 A JP 2019174131A JP 2020092252 A JP2020092252 A JP 2020092252A
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- Prior art keywords
- edge bead
- bead removal
- substrate
- edge
- removal system
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011324 bead Substances 0.000 title claims abstract description 183
- 239000000758 substrate Substances 0.000 title claims abstract description 146
- 238000003672 processing method Methods 0.000 title abstract 2
- 239000012530 fluid Substances 0.000 claims abstract description 74
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 52
- 239000002904 solvent Substances 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 27
- 229910052757 nitrogen Inorganic materials 0.000 claims description 26
- 230000004308 accommodation Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 description 33
- 229920002120 photoresistant polymer Polymers 0.000 description 29
- 235000012431 wafers Nutrition 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 238000004528 spin coating Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Coating Apparatus (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Materials For Photolithography (AREA)
Abstract
Description
−エッジビード除去ヘッドの2つのアームの間の収容空間を提供するエッジビード除去ヘッドを有する、前記エッジビード除去システムを用意し、
−処理される基板を用意し、
−基板がエッジビード除去ヘッドの2つのアームの間の収容空間に収容されるように、エッジビード除去ヘッドと基板とを位置決めする、
ことを含む、方法を提供する。
Claims (13)
- 基板(12)を処理するためのエッジビード除去システム(10)であって、本体(22)及び前記本体(22)から突出する2つのアーム(24)を有するエッジビード除去ヘッド(20)を備え、前記2つのアーム(24)は、互いに間隔を置いて配置されて、処理される基板(12)を収容するための収容空間(26)を画定し、前記2つのアーム(24)はそれぞれ、互いに対向する機能面(36)を有し、前記機能面(36)はそれぞれ、少なくとも1つの流体出口(38)を有する、エッジビード除去システム(10)。
- 前記少なくとも1つの流体出口(38)には、ノズルに割り当てられている、請求項1に記載のエッジビード除去システム(10)。
- 前記少なくとも1つの流体出口(38)は、前記エッジビード除去ヘッド(20)に埋め込まれた窒素ライン(42)に接続されている、請求項1又は2に記載のエッジビード除去システム(10)。
- 前記少なくとも1つの流体出口(38)は、前記エッジビード除去ヘッド(20)に埋め込まれた溶媒ライン(46)に接続されている、請求項1〜3のいずれか1つに記載のエッジビード除去システム(10)。
- 各機能面(36)は、少なくとも2つの流体出口(38)を有する、請求項1〜4のいずれか1つに記載のエッジビード除去システム(10)。
- 前記少なくとも1つの流体出口(38)が、各機能面(36)に対して傾斜している、請求項1〜5のいずれか1つに記載のエッジビード除去システム(10)。
- 前記本体(22)は、前記収容空間(26)に割り当てられた排水口(52)を備え、前記排水口(52)は、真空源(54)に接続されている、請求項1〜6のいずれか1つに記載のエッジビード除去システム(10)。
- 前記エッジビード除去ヘッド(20)は、処理される前記基板(12)のエッジを検知するように構成されたエッジセンサ(56)を備えている、請求項1〜7のいずれか1つに記載のエッジビード除去システム(10)。
- 前記エッジビード除去システム(10)は、前記エッジビード除去ヘッド(20)に接続された線形駆動部(58)を備えている、請求項1〜8のいずれか1つに記載のエッジビード除去システム(10)。
- 前記エッジビード除去システム(10)は、処理される前記基板(12)を保持するための処理表面(18)を備えたエッジビード除去チャック(16)を備え、前記処理表面(18)は、最大280mmの直径を有する、請求項1〜9のいずれか1つに記載のエッジビード除去システム(10)。
- 前記エッジビード除去ヘッド(20)は、前記2つのアーム(24)間の距離を調整して前記収容空間(26)の容積を調整可能に構成された距離調整ユニットを備える、請求項1〜10のいずれか1つに記載のエッジビード除去システム(10)。
- 前記エッジビード除去システム(10)は、前記基板(12)のエッジに対する前記少なくとも1つの流体出口(38)の水平距離を一定に維持するために、前記エッジビード除去ヘッド(20)を水平方向に移動させるように構成されている、請求項1〜11のいずれか1つに記載のエッジビード除去システム(10)。
- 基板(12)を処理する方法であって、
−前記エッジビード除去ヘッド(20)の2つのアーム(24)の間の収容空間(26)を提供するエッジビード除去ヘッド(20)を有する、請求項1〜10のいずれか1つに記載のエッジビード除去システム(10)を用意し、
−処理される基板(12)を用意し、
−前記基板(12)が前記エッジビード除去ヘッド(20)の2つのアーム(24)の間の前記収容空間(26)に収容されるように、前記エッジビード除去ヘッド(20)と前記基板(12)とを位置決めする、
ことを含む、方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL2021701 | 2018-09-25 | ||
NL2021701A NL2021701B1 (en) | 2018-09-25 | 2018-09-25 | Edge bead removal system and method of treating a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2020092252A true JP2020092252A (ja) | 2020-06-11 |
Family
ID=64427162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019174131A Pending JP2020092252A (ja) | 2018-09-25 | 2019-09-25 | エッジビード除去システム及び基板処理方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20200096867A1 (ja) |
JP (1) | JP2020092252A (ja) |
KR (1) | KR20200035364A (ja) |
CN (1) | CN110941152A (ja) |
AT (1) | AT521734B1 (ja) |
DE (1) | DE102019125661A1 (ja) |
NL (1) | NL2021701B1 (ja) |
TW (1) | TWI824015B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2022031268A1 (en) * | 2020-08-04 | 2022-02-10 | Applied Materials, Inc. | Apparatus for removing photoresist off of photomask |
US20220269177A1 (en) * | 2021-02-23 | 2022-08-25 | Tokyo Electron Limited | Sensor technology integration into coating track |
CN117497435A (zh) * | 2022-07-21 | 2024-02-02 | 长鑫存储技术有限公司 | 半导体结构的处理方法、处理装置及处理系统 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW419716B (en) * | 1997-04-28 | 2001-01-21 | Tokyo Electron Ltd | Processing apparatus |
US6453916B1 (en) * | 2000-06-09 | 2002-09-24 | Advanced Micro Devices, Inc. | Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process |
KR100436361B1 (ko) * | 2000-12-15 | 2004-06-18 | (주)케이.씨.텍 | 기판 가장자리를 세정하기 위한 장치 |
US7673582B2 (en) * | 2006-09-30 | 2010-03-09 | Tokyo Electron Limited | Apparatus and method for removing an edge bead of a spin-coated layer |
US20090211604A1 (en) * | 2008-02-22 | 2009-08-27 | Tokyo Electron Limited | System and Method For Removing Edge-Bead Material |
-
2018
- 2018-09-25 NL NL2021701A patent/NL2021701B1/en active
-
2019
- 2019-09-24 TW TW108134465A patent/TWI824015B/zh active
- 2019-09-24 AT ATA50814/2019A patent/AT521734B1/de active
- 2019-09-24 DE DE102019125661.5A patent/DE102019125661A1/de active Pending
- 2019-09-25 KR KR1020190118136A patent/KR20200035364A/ko not_active Application Discontinuation
- 2019-09-25 JP JP2019174131A patent/JP2020092252A/ja active Pending
- 2019-09-25 US US16/582,806 patent/US20200096867A1/en not_active Abandoned
- 2019-09-25 CN CN201910912190.7A patent/CN110941152A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20200096867A1 (en) | 2020-03-26 |
TW202030775A (zh) | 2020-08-16 |
CN110941152A (zh) | 2020-03-31 |
AT521734A2 (de) | 2020-04-15 |
DE102019125661A1 (de) | 2020-03-26 |
AT521734A3 (de) | 2021-11-15 |
AT521734B1 (de) | 2022-06-15 |
NL2021701B1 (en) | 2020-05-07 |
KR20200035364A (ko) | 2020-04-03 |
TWI824015B (zh) | 2023-12-01 |
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