AT520249A5 - Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels - Google Patents

Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels

Info

Publication number
AT520249A5
AT520249A5 ATA9277/2015A AT92772015A AT520249A5 AT 520249 A5 AT520249 A5 AT 520249A5 AT 92772015 A AT92772015 A AT 92772015A AT 520249 A5 AT520249 A5 AT 520249A5
Authority
AT
Austria
Prior art keywords
producing
semiconductor substrate
substrate
substrate stack
conductive multi
Prior art date
Application number
ATA9277/2015A
Other languages
English (en)
Other versions
AT520249B1 (de
Inventor
Thorsten Matthias
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of AT520249A5 publication Critical patent/AT520249A5/de
Application granted granted Critical
Publication of AT520249B1 publication Critical patent/AT520249B1/de

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/40Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising photovoltaic cells in a mechanically stacked configuration
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • H10F77/211Electrodes for devices having potential barriers for photovoltaic cells
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00Bonding of wafers, substrates or parts of devices
    • H10P10/12Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H10F19/902Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
    • H10F19/906Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Sustainable Development (AREA)
  • Sustainable Energy (AREA)
  • Laminated Bodies (AREA)

Abstract

Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung eines Mehrfachsubstratstapels aus einem, insbesondere wellenlängensensitiven, Halbleitersubstrat (2) und mindestens einem weiteren, insbesondere wellenlängensensitiven, Halbleitersubstrat (2', 2") mit folgenden Schritten: Aufbringung einer zumindest abschnittsweise elektrisch leitfähigen dielektrischen Schicht (3, 3 ') auf mindestens eine Substratoberfläche (2o, 2o', 2o", 2u, 2u', 2u") mindestens eines der Halbleitersubstrate (2, 2', 2") und Kontaktierung des Halbleitersubstrats (2) mit dem weiteren Halbleitersubstrat (2', 2' ') und Ausbildung einer elektrisch leitfähigen Verbindung zwischen den Halbleitersubstraten (2, 2', 2 ").
ATA9277/2015A 2014-08-29 2015-07-01 Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels AT520249B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014112430.8A DE102014112430A1 (de) 2014-08-29 2014-08-29 Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels
PCT/EP2015/064975 WO2016030053A1 (de) 2014-08-29 2015-07-01 Verfahren zur herstellung eines leitenden mehrfachsubstratstapels

Publications (2)

Publication Number Publication Date
AT520249A5 true AT520249A5 (de) 2019-02-15
AT520249B1 AT520249B1 (de) 2022-09-15

Family

ID=53540732

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9277/2015A AT520249B1 (de) 2014-08-29 2015-07-01 Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels

Country Status (6)

Country Link
US (1) US10243094B2 (de)
JP (1) JP2017529696A (de)
CN (1) CN106796932A (de)
AT (1) AT520249B1 (de)
DE (1) DE102014112430A1 (de)
WO (1) WO2016030053A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014112430A1 (de) 2014-08-29 2016-03-03 Ev Group E. Thallner Gmbh Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels
WO2019180854A1 (ja) * 2018-03-20 2019-09-26 株式会社 東芝 多接合型太陽電池モジュール及び太陽光発電システム
CN113330557A (zh) 2019-01-14 2021-08-31 伊文萨思粘合技术公司 键合结构
CN112349801B (zh) * 2020-10-16 2023-12-01 泰州隆基乐叶光伏科技有限公司 叠层电池的中间串联层及生产方法、叠层电池
FR3121544B1 (fr) * 2021-03-31 2023-11-24 St Microelectronics Crolles 2 Sas Structure d'isolation thermique et électrique
US20240332231A1 (en) * 2023-03-31 2024-10-03 Adeia Semiconductor Bonding Technologies Inc. Direct hybrid bonding in topographic packages

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008108990A1 (en) * 2007-03-06 2008-09-12 Sunlight Photonics Inc. Spectrally adaptive multijunction photovoltaic thin film device and method of producing same
WO2009121604A2 (en) * 2008-04-04 2009-10-08 Universität Stuttgart Photovoltaic solar cell and method of production thereof
US20120152340A1 (en) * 2009-08-27 2012-06-21 Mitsubishi Heavy Industries, Ltd. Multi-junction photovoltaic device, integrated multi-junction photovoltaic device, and processes for producing same
WO2012115602A1 (en) * 2011-02-21 2012-08-30 Bedjukh Oleksandr Photovoltaic converter (variants) and solar battery based thereon
WO2014015912A1 (de) * 2012-07-26 2014-01-30 Ev Group E. Thallner Gmbh Verfahren zum bonden von substraten

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4338480A (en) * 1980-12-29 1982-07-06 Varian Associates, Inc. Stacked multijunction photovoltaic converters
FR2690278A1 (fr) * 1992-04-15 1993-10-22 Picogiga Sa Composant photovoltaïque multispectral à empilement de cellules, et procédé de réalisation.
KR20040070297A (ko) * 2002-01-02 2004-08-06 레베오 인코포레이티드 광전지 및 그 제조 방법
US7122734B2 (en) * 2002-10-23 2006-10-17 The Boeing Company Isoelectronic surfactant suppression of threading dislocations in metamorphic epitaxial layers
US20070107773A1 (en) * 2005-11-17 2007-05-17 Palo Alto Research Center Incorporated Bifacial cell with extruded gridline metallization
JP5025184B2 (ja) * 2006-07-28 2012-09-12 京セラ株式会社 太陽電池素子及びこれを用いた太陽電池モジュール、並びに、これらの製造方法
JP4737116B2 (ja) 2007-02-28 2011-07-27 株式会社日立製作所 接合方法
TWI335059B (en) 2007-07-31 2010-12-21 Siliconware Precision Industries Co Ltd Multi-chip stack structure having silicon channel and method for fabricating the same
WO2009086161A1 (en) * 2007-12-20 2009-07-09 Cima Nanotech Israel Ltd. Transparent conductive coating with filler material
KR100909562B1 (ko) 2007-12-21 2009-07-27 주식회사 동부하이텍 반도체 소자 및 그 제조방법
US8097955B2 (en) * 2008-10-15 2012-01-17 Qimonda Ag Interconnect structures and methods
JP2010118473A (ja) * 2008-11-12 2010-05-27 PVG Solutions株式会社 太陽電池セルおよびその製造方法
CN102460722B (zh) * 2009-06-05 2015-04-01 株式会社半导体能源研究所 光电转换装置及其制造方法
WO2010140522A1 (en) * 2009-06-05 2010-12-09 Semiconductor Energy Laboratory Co., Ltd. Photoelectric conversion device and manufacturing method thereof
EP2454761A1 (de) * 2009-07-17 2012-05-23 Soitec Bondingverfahren mit einer bondingschicht auf zink-, silikon- und sauerstoffbasis und entsprechende strukturen
TW201145493A (en) * 2010-06-01 2011-12-16 Chipmos Technologies Inc Silicon wafer structure and multi-chip stack structure
US20130240027A1 (en) * 2010-06-07 2013-09-19 Solarno, Inc. Multijunction hybrid solar cell with parallel connection and nanomaterial charge collecting interlayers
US20130206219A1 (en) * 2010-08-06 2013-08-15 Juanita N. Kurtin Cooperative photovoltaic networks and photovoltaic cell adaptations for use therein
EP3447789B1 (de) 2011-01-25 2021-04-14 EV Group E. Thallner GmbH Verfahren zum permanenten bonden von wafern
EP2695183A1 (de) 2011-04-08 2014-02-12 Ev Group E. Thallner GmbH Verfahren zum permanenten bonden von wafern
CN103460342B (zh) 2011-04-08 2016-12-07 Ev 集团 E·索尔纳有限责任公司 晶片的永久粘合方法
WO2012136266A1 (de) 2011-04-08 2012-10-11 Ev Group E. Thallner Gmbh Verfahren zum permanenten bonden von wafern
JP5936968B2 (ja) * 2011-09-22 2016-06-22 株式会社東芝 半導体装置とその製造方法
US10608136B2 (en) * 2011-10-17 2020-03-31 National Institute Of Advanced Industrial Science And Technology Method of bonding semiconductor elements and junction structure
JP5372272B1 (ja) * 2012-05-24 2013-12-18 有限会社 ナプラ 積層基板
CN104488065B (zh) 2012-07-24 2017-09-05 Ev 集团 E·索尔纳有限责任公司 永久结合晶圆的方法及装置
US10158032B2 (en) * 2012-10-12 2018-12-18 Heraeus Deutschland GmbH & Co. KG Solar cells produced from high Ohmic wafers and halogen containing paste
DE102014112430A1 (de) 2014-08-29 2016-03-03 Ev Group E. Thallner Gmbh Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008108990A1 (en) * 2007-03-06 2008-09-12 Sunlight Photonics Inc. Spectrally adaptive multijunction photovoltaic thin film device and method of producing same
WO2009121604A2 (en) * 2008-04-04 2009-10-08 Universität Stuttgart Photovoltaic solar cell and method of production thereof
US20120152340A1 (en) * 2009-08-27 2012-06-21 Mitsubishi Heavy Industries, Ltd. Multi-junction photovoltaic device, integrated multi-junction photovoltaic device, and processes for producing same
WO2012115602A1 (en) * 2011-02-21 2012-08-30 Bedjukh Oleksandr Photovoltaic converter (variants) and solar battery based thereon
WO2014015912A1 (de) * 2012-07-26 2014-01-30 Ev Group E. Thallner Gmbh Verfahren zum bonden von substraten

Also Published As

Publication number Publication date
JP2017529696A (ja) 2017-10-05
AT520249B1 (de) 2022-09-15
DE102014112430A1 (de) 2016-03-03
US10243094B2 (en) 2019-03-26
US20170256663A1 (en) 2017-09-07
WO2016030053A1 (de) 2016-03-03
CN106796932A (zh) 2017-05-31

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