AT520249A5 - Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels - Google Patents
Verfahren zur Herstellung eines leitenden MehrfachsubstratstapelsInfo
- Publication number
- AT520249A5 AT520249A5 ATA9277/2015A AT92772015A AT520249A5 AT 520249 A5 AT520249 A5 AT 520249A5 AT 92772015 A AT92772015 A AT 92772015A AT 520249 A5 AT520249 A5 AT 520249A5
- Authority
- AT
- Austria
- Prior art keywords
- producing
- semiconductor substrate
- substrate
- substrate stack
- conductive multi
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/40—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules comprising photovoltaic cells in a mechanically stacked configuration
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P10/00—Bonding of wafers, substrates or parts of devices
- H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
- H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
- H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
- H10F19/902—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells
- H10F19/906—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers for series or parallel connection of photovoltaic cells characterised by the materials of the structures
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Photovoltaic Devices (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Laminated Bodies (AREA)
Abstract
Die vorliegende Erfindung betrifft ein Verfahren zur Herstellung eines Mehrfachsubstratstapels aus einem, insbesondere wellenlängensensitiven, Halbleitersubstrat (2) und mindestens einem weiteren, insbesondere wellenlängensensitiven, Halbleitersubstrat (2', 2") mit folgenden Schritten: Aufbringung einer zumindest abschnittsweise elektrisch leitfähigen dielektrischen Schicht (3, 3 ') auf mindestens eine Substratoberfläche (2o, 2o', 2o", 2u, 2u', 2u") mindestens eines der Halbleitersubstrate (2, 2', 2") und Kontaktierung des Halbleitersubstrats (2) mit dem weiteren Halbleitersubstrat (2', 2' ') und Ausbildung einer elektrisch leitfähigen Verbindung zwischen den Halbleitersubstraten (2, 2', 2 ").
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014112430.8A DE102014112430A1 (de) | 2014-08-29 | 2014-08-29 | Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels |
| PCT/EP2015/064975 WO2016030053A1 (de) | 2014-08-29 | 2015-07-01 | Verfahren zur herstellung eines leitenden mehrfachsubstratstapels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AT520249A5 true AT520249A5 (de) | 2019-02-15 |
| AT520249B1 AT520249B1 (de) | 2022-09-15 |
Family
ID=53540732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ATA9277/2015A AT520249B1 (de) | 2014-08-29 | 2015-07-01 | Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US10243094B2 (de) |
| JP (1) | JP2017529696A (de) |
| CN (1) | CN106796932A (de) |
| AT (1) | AT520249B1 (de) |
| DE (1) | DE102014112430A1 (de) |
| WO (1) | WO2016030053A1 (de) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014112430A1 (de) | 2014-08-29 | 2016-03-03 | Ev Group E. Thallner Gmbh | Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels |
| WO2019180854A1 (ja) * | 2018-03-20 | 2019-09-26 | 株式会社 東芝 | 多接合型太陽電池モジュール及び太陽光発電システム |
| CN113330557A (zh) | 2019-01-14 | 2021-08-31 | 伊文萨思粘合技术公司 | 键合结构 |
| CN112349801B (zh) * | 2020-10-16 | 2023-12-01 | 泰州隆基乐叶光伏科技有限公司 | 叠层电池的中间串联层及生产方法、叠层电池 |
| FR3121544B1 (fr) * | 2021-03-31 | 2023-11-24 | St Microelectronics Crolles 2 Sas | Structure d'isolation thermique et électrique |
| US20240332231A1 (en) * | 2023-03-31 | 2024-10-03 | Adeia Semiconductor Bonding Technologies Inc. | Direct hybrid bonding in topographic packages |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008108990A1 (en) * | 2007-03-06 | 2008-09-12 | Sunlight Photonics Inc. | Spectrally adaptive multijunction photovoltaic thin film device and method of producing same |
| WO2009121604A2 (en) * | 2008-04-04 | 2009-10-08 | Universität Stuttgart | Photovoltaic solar cell and method of production thereof |
| US20120152340A1 (en) * | 2009-08-27 | 2012-06-21 | Mitsubishi Heavy Industries, Ltd. | Multi-junction photovoltaic device, integrated multi-junction photovoltaic device, and processes for producing same |
| WO2012115602A1 (en) * | 2011-02-21 | 2012-08-30 | Bedjukh Oleksandr | Photovoltaic converter (variants) and solar battery based thereon |
| WO2014015912A1 (de) * | 2012-07-26 | 2014-01-30 | Ev Group E. Thallner Gmbh | Verfahren zum bonden von substraten |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4338480A (en) * | 1980-12-29 | 1982-07-06 | Varian Associates, Inc. | Stacked multijunction photovoltaic converters |
| FR2690278A1 (fr) * | 1992-04-15 | 1993-10-22 | Picogiga Sa | Composant photovoltaïque multispectral à empilement de cellules, et procédé de réalisation. |
| KR20040070297A (ko) * | 2002-01-02 | 2004-08-06 | 레베오 인코포레이티드 | 광전지 및 그 제조 방법 |
| US7122734B2 (en) * | 2002-10-23 | 2006-10-17 | The Boeing Company | Isoelectronic surfactant suppression of threading dislocations in metamorphic epitaxial layers |
| US20070107773A1 (en) * | 2005-11-17 | 2007-05-17 | Palo Alto Research Center Incorporated | Bifacial cell with extruded gridline metallization |
| JP5025184B2 (ja) * | 2006-07-28 | 2012-09-12 | 京セラ株式会社 | 太陽電池素子及びこれを用いた太陽電池モジュール、並びに、これらの製造方法 |
| JP4737116B2 (ja) | 2007-02-28 | 2011-07-27 | 株式会社日立製作所 | 接合方法 |
| TWI335059B (en) | 2007-07-31 | 2010-12-21 | Siliconware Precision Industries Co Ltd | Multi-chip stack structure having silicon channel and method for fabricating the same |
| WO2009086161A1 (en) * | 2007-12-20 | 2009-07-09 | Cima Nanotech Israel Ltd. | Transparent conductive coating with filler material |
| KR100909562B1 (ko) | 2007-12-21 | 2009-07-27 | 주식회사 동부하이텍 | 반도체 소자 및 그 제조방법 |
| US8097955B2 (en) * | 2008-10-15 | 2012-01-17 | Qimonda Ag | Interconnect structures and methods |
| JP2010118473A (ja) * | 2008-11-12 | 2010-05-27 | PVG Solutions株式会社 | 太陽電池セルおよびその製造方法 |
| CN102460722B (zh) * | 2009-06-05 | 2015-04-01 | 株式会社半导体能源研究所 | 光电转换装置及其制造方法 |
| WO2010140522A1 (en) * | 2009-06-05 | 2010-12-09 | Semiconductor Energy Laboratory Co., Ltd. | Photoelectric conversion device and manufacturing method thereof |
| EP2454761A1 (de) * | 2009-07-17 | 2012-05-23 | Soitec | Bondingverfahren mit einer bondingschicht auf zink-, silikon- und sauerstoffbasis und entsprechende strukturen |
| TW201145493A (en) * | 2010-06-01 | 2011-12-16 | Chipmos Technologies Inc | Silicon wafer structure and multi-chip stack structure |
| US20130240027A1 (en) * | 2010-06-07 | 2013-09-19 | Solarno, Inc. | Multijunction hybrid solar cell with parallel connection and nanomaterial charge collecting interlayers |
| US20130206219A1 (en) * | 2010-08-06 | 2013-08-15 | Juanita N. Kurtin | Cooperative photovoltaic networks and photovoltaic cell adaptations for use therein |
| EP3447789B1 (de) | 2011-01-25 | 2021-04-14 | EV Group E. Thallner GmbH | Verfahren zum permanenten bonden von wafern |
| EP2695183A1 (de) | 2011-04-08 | 2014-02-12 | Ev Group E. Thallner GmbH | Verfahren zum permanenten bonden von wafern |
| CN103460342B (zh) | 2011-04-08 | 2016-12-07 | Ev 集团 E·索尔纳有限责任公司 | 晶片的永久粘合方法 |
| WO2012136266A1 (de) | 2011-04-08 | 2012-10-11 | Ev Group E. Thallner Gmbh | Verfahren zum permanenten bonden von wafern |
| JP5936968B2 (ja) * | 2011-09-22 | 2016-06-22 | 株式会社東芝 | 半導体装置とその製造方法 |
| US10608136B2 (en) * | 2011-10-17 | 2020-03-31 | National Institute Of Advanced Industrial Science And Technology | Method of bonding semiconductor elements and junction structure |
| JP5372272B1 (ja) * | 2012-05-24 | 2013-12-18 | 有限会社 ナプラ | 積層基板 |
| CN104488065B (zh) | 2012-07-24 | 2017-09-05 | Ev 集团 E·索尔纳有限责任公司 | 永久结合晶圆的方法及装置 |
| US10158032B2 (en) * | 2012-10-12 | 2018-12-18 | Heraeus Deutschland GmbH & Co. KG | Solar cells produced from high Ohmic wafers and halogen containing paste |
| DE102014112430A1 (de) | 2014-08-29 | 2016-03-03 | Ev Group E. Thallner Gmbh | Verfahren zur Herstellung eines leitenden Mehrfachsubstratstapels |
-
2014
- 2014-08-29 DE DE102014112430.8A patent/DE102014112430A1/de not_active Withdrawn
-
2015
- 2015-07-01 JP JP2017509716A patent/JP2017529696A/ja active Pending
- 2015-07-01 AT ATA9277/2015A patent/AT520249B1/de active
- 2015-07-01 US US15/505,280 patent/US10243094B2/en active Active
- 2015-07-01 WO PCT/EP2015/064975 patent/WO2016030053A1/de not_active Ceased
- 2015-07-01 CN CN201580045190.1A patent/CN106796932A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008108990A1 (en) * | 2007-03-06 | 2008-09-12 | Sunlight Photonics Inc. | Spectrally adaptive multijunction photovoltaic thin film device and method of producing same |
| WO2009121604A2 (en) * | 2008-04-04 | 2009-10-08 | Universität Stuttgart | Photovoltaic solar cell and method of production thereof |
| US20120152340A1 (en) * | 2009-08-27 | 2012-06-21 | Mitsubishi Heavy Industries, Ltd. | Multi-junction photovoltaic device, integrated multi-junction photovoltaic device, and processes for producing same |
| WO2012115602A1 (en) * | 2011-02-21 | 2012-08-30 | Bedjukh Oleksandr | Photovoltaic converter (variants) and solar battery based thereon |
| WO2014015912A1 (de) * | 2012-07-26 | 2014-01-30 | Ev Group E. Thallner Gmbh | Verfahren zum bonden von substraten |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017529696A (ja) | 2017-10-05 |
| AT520249B1 (de) | 2022-09-15 |
| DE102014112430A1 (de) | 2016-03-03 |
| US10243094B2 (en) | 2019-03-26 |
| US20170256663A1 (en) | 2017-09-07 |
| WO2016030053A1 (de) | 2016-03-03 |
| CN106796932A (zh) | 2017-05-31 |
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