AT317337B - Verfahren zur Herstellung von mindestens einer strukturierten metallischen Schicht auf einem Grundkörper - Google Patents

Verfahren zur Herstellung von mindestens einer strukturierten metallischen Schicht auf einem Grundkörper

Info

Publication number
AT317337B
AT317337B AT852171A AT852171A AT317337B AT 317337 B AT317337 B AT 317337B AT 852171 A AT852171 A AT 852171A AT 852171 A AT852171 A AT 852171A AT 317337 B AT317337 B AT 317337B
Authority
AT
Austria
Prior art keywords
producing
base body
metallic layer
structured metallic
structured
Prior art date
Application number
AT852171A
Other languages
German (de)
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AT317337B publication Critical patent/AT317337B/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H10W70/05—
    • H10W70/66—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H10W72/07236—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
  • Chemically Coating (AREA)
AT852171A 1971-01-19 1971-10-01 Verfahren zur Herstellung von mindestens einer strukturierten metallischen Schicht auf einem Grundkörper AT317337B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2102421A DE2102421C3 (de) 1971-01-19 1971-01-19 Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper

Publications (1)

Publication Number Publication Date
AT317337B true AT317337B (de) 1974-08-26

Family

ID=5796328

Family Applications (1)

Application Number Title Priority Date Filing Date
AT852171A AT317337B (de) 1971-01-19 1971-10-01 Verfahren zur Herstellung von mindestens einer strukturierten metallischen Schicht auf einem Grundkörper

Country Status (10)

Country Link
US (1) US3829316A (enExample)
JP (1) JPS5535468B1 (enExample)
AT (1) AT317337B (enExample)
CA (1) CA985606A (enExample)
CH (1) CH576003A5 (enExample)
DE (1) DE2102421C3 (enExample)
FR (1) FR2122450B1 (enExample)
GB (1) GB1327670A (enExample)
IT (1) IT946536B (enExample)
NL (1) NL7200742A (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293963A (en) * 1976-02-03 1977-08-08 Nippon Electric Co Method of producing thick film wiring circuit substrate
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
US4352714A (en) * 1980-09-29 1982-10-05 Union Carbide Corporation Method for making a metal-to-ceramic insulator seal for electrochemical cells
DE3235702C2 (de) * 1982-09-27 1985-01-17 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung von Filmträgern für Halbleiterchips
DE3235675A1 (de) * 1982-09-27 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von halbleiterchip-filmtraegern
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
US5345529A (en) * 1993-07-06 1994-09-06 At&T Bell Laboratories Method for assembly of an optical fiber connective device
JPH0714597U (ja) * 1993-08-17 1995-03-10 ワデン工業株式会社 発熱体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1121668A (en) * 1965-12-07 1968-07-31 Hermsdorf Keramik Veb Method for the production of etch-resist masks on substrates

Also Published As

Publication number Publication date
IT946536B (it) 1973-05-21
JPS5535468B1 (enExample) 1980-09-13
DE2102421B2 (de) 1979-01-11
US3829316A (en) 1974-08-13
FR2122450A1 (enExample) 1972-09-01
DE2102421A1 (de) 1973-06-14
NL7200742A (enExample) 1972-07-21
DE2102421C3 (de) 1979-09-06
CA985606A (en) 1976-03-16
CH576003A5 (enExample) 1976-05-31
FR2122450B1 (enExample) 1975-06-13
GB1327670A (en) 1973-08-22

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee