FR2122450A1 - - Google Patents

Info

Publication number
FR2122450A1
FR2122450A1 FR7201383A FR7201383A FR2122450A1 FR 2122450 A1 FR2122450 A1 FR 2122450A1 FR 7201383 A FR7201383 A FR 7201383A FR 7201383 A FR7201383 A FR 7201383A FR 2122450 A1 FR2122450 A1 FR 2122450A1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7201383A
Other languages
French (fr)
Other versions
FR2122450B1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of FR2122450A1 publication Critical patent/FR2122450A1/fr
Application granted granted Critical
Publication of FR2122450B1 publication Critical patent/FR2122450B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H10W70/05—
    • H10W70/66—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H10W72/07236—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Ceramic Products (AREA)
  • Chemically Coating (AREA)
FR7201383A 1971-01-19 1972-01-17 Expired FR2122450B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2102421A DE2102421C3 (de) 1971-01-19 1971-01-19 Verfahren zur Herstellung einer strukturierten metallischen Schicht auf einem keramischen Grundkörper

Publications (2)

Publication Number Publication Date
FR2122450A1 true FR2122450A1 (enExample) 1972-09-01
FR2122450B1 FR2122450B1 (enExample) 1975-06-13

Family

ID=5796328

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7201383A Expired FR2122450B1 (enExample) 1971-01-19 1972-01-17

Country Status (10)

Country Link
US (1) US3829316A (enExample)
JP (1) JPS5535468B1 (enExample)
AT (1) AT317337B (enExample)
CA (1) CA985606A (enExample)
CH (1) CH576003A5 (enExample)
DE (1) DE2102421C3 (enExample)
FR (1) FR2122450B1 (enExample)
GB (1) GB1327670A (enExample)
IT (1) IT946536B (enExample)
NL (1) NL7200742A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0107071A3 (de) * 1982-09-27 1985-08-14 Siemens Aktiengesellschaft Verfahren zur Herstellung von Halbleiterchip-Filmträgern
EP0111644A3 (de) * 1982-09-27 1985-08-21 Siemens Aktiengesellschaft Verfahren zur Herstellung von Halbleiterchips-Filmträgern
EP0246744A3 (en) * 1986-05-20 1989-06-14 Kabushiki Kaisha Toshiba Ic card and method of manufacturing the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5293963A (en) * 1976-02-03 1977-08-08 Nippon Electric Co Method of producing thick film wiring circuit substrate
US4376815A (en) * 1979-10-22 1983-03-15 Oddi Michael J Method of applying photoresist by screening in the formation of printed circuits
US4352714A (en) * 1980-09-29 1982-10-05 Union Carbide Corporation Method for making a metal-to-ceramic insulator seal for electrochemical cells
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
US5416872A (en) * 1993-07-06 1995-05-16 At&T Corp. Arrangement for interconnecting an optical fiber an optoelectronic component
US5345529A (en) * 1993-07-06 1994-09-06 At&T Bell Laboratories Method for assembly of an optical fiber connective device
JPH0714597U (ja) * 1993-08-17 1995-03-10 ワデン工業株式会社 発熱体

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1121668A (en) * 1965-12-07 1968-07-31 Hermsdorf Keramik Veb Method for the production of etch-resist masks on substrates

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1121668A (en) * 1965-12-07 1968-07-31 Hermsdorf Keramik Veb Method for the production of etch-resist masks on substrates

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0107071A3 (de) * 1982-09-27 1985-08-14 Siemens Aktiengesellschaft Verfahren zur Herstellung von Halbleiterchip-Filmträgern
EP0111644A3 (de) * 1982-09-27 1985-08-21 Siemens Aktiengesellschaft Verfahren zur Herstellung von Halbleiterchips-Filmträgern
EP0246744A3 (en) * 1986-05-20 1989-06-14 Kabushiki Kaisha Toshiba Ic card and method of manufacturing the same
US4997791A (en) * 1986-05-20 1991-03-05 Kabushiki Kaisha Toshiba IC card and method of manufacturing the same

Also Published As

Publication number Publication date
AT317337B (de) 1974-08-26
IT946536B (it) 1973-05-21
JPS5535468B1 (enExample) 1980-09-13
DE2102421B2 (de) 1979-01-11
US3829316A (en) 1974-08-13
DE2102421A1 (de) 1973-06-14
NL7200742A (enExample) 1972-07-21
DE2102421C3 (de) 1979-09-06
CA985606A (en) 1976-03-16
CH576003A5 (enExample) 1976-05-31
FR2122450B1 (enExample) 1975-06-13
GB1327670A (en) 1973-08-22

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Legal Events

Date Code Title Description
ST Notification of lapse