AT316894B - Halbleitervorrichtung und Verfahren zur Herstellung derselben - Google Patents
Halbleitervorrichtung und Verfahren zur Herstellung derselbenInfo
- Publication number
- AT316894B AT316894B AT1103969A AT1103969A AT316894B AT 316894 B AT316894 B AT 316894B AT 1103969 A AT1103969 A AT 1103969A AT 1103969 A AT1103969 A AT 1103969A AT 316894 B AT316894 B AT 316894B
- Authority
- AT
- Austria
- Prior art keywords
- manufacturing
- same
- semiconductor device
- semiconductor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/0061—Electrical connection means
- G01L19/0084—Electrical connection means to the outside of the housing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/147—Details about the mounting of the sensor to support or covering means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
- G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
- G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
- G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R21/00—Variable-resistance transducers
- H04R21/02—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
- H04R7/22—Clamping rim of diaphragm or cone against seating
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Signal Processing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Pressure Sensors (AREA)
- Measuring Fluid Pressure (AREA)
- Recrystallisation Techniques (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NL6817089A NL162254B (nl) | 1968-11-29 | 1968-11-29 | Halfgeleiderinrichting voor het omzetten van mechanische spanningen in elektrische signalen en werkwijze voor het vervaardigen daarvan. |
Publications (1)
Publication Number | Publication Date |
---|---|
AT316894B true AT316894B (de) | 1974-07-25 |
Family
ID=19805282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT1103969A AT316894B (de) | 1968-11-29 | 1969-11-26 | Halbleitervorrichtung und Verfahren zur Herstellung derselben |
Country Status (10)
Country | Link |
---|---|
AT (1) | AT316894B (pt) |
BE (1) | BE742331A (pt) |
BR (1) | BR6914557D0 (pt) |
CH (1) | CH518006A (pt) |
DE (1) | DE1959527C3 (pt) |
ES (2) | ES373779A1 (pt) |
FR (1) | FR2024961A1 (pt) |
GB (1) | GB1295650A (pt) |
NL (1) | NL162254B (pt) |
SE (2) | SE384437B (pt) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0006740A1 (en) * | 1978-06-28 | 1980-01-09 | Gould Inc. | Improvements in strain gauges |
EP0338180A1 (en) * | 1988-04-21 | 1989-10-25 | MAGNETI MARELLI S.p.A. | An electrical force and/or deformation sensor, particularly for use as a pressure sensor |
EP0340022A1 (en) * | 1988-04-29 | 1989-11-02 | Schlumberger Industries, Inc. | Mechanical sensor for high temperature environments |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4071838A (en) | 1976-02-09 | 1978-01-31 | Diax Corporation | Solid state force transducer and method of making same |
DE2841312C2 (de) * | 1978-09-22 | 1985-06-05 | Robert Bosch Gmbh, 7000 Stuttgart | Monolithischer Halbleiter-Drucksensor und Verfahren zu dessen Herstellung |
JPS5550668A (en) * | 1978-10-06 | 1980-04-12 | Hitachi Ltd | Semiconductor pressure converter |
IT1212404B (it) * | 1979-02-22 | 1989-11-22 | Rca Corp | Metodo comportante un singolo attacco per la formazione di un mesa presentante una parete a piu'gradini. |
JP2719448B2 (ja) * | 1991-01-24 | 1998-02-25 | 三菱電機株式会社 | 半導体圧力検出装置 |
WO2006023753A2 (en) * | 2004-08-20 | 2006-03-02 | Semitool, Inc. | System for thinning a semiconductor workpiece |
CN113555346B (zh) * | 2020-08-21 | 2023-05-23 | 友达光电股份有限公司 | 电路基板以及电路基板的应变量的测量方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3270554A (en) * | 1961-01-04 | 1966-09-06 | Bell Telephone Labor Inc | Diffused layer transducers |
US3277698A (en) * | 1963-11-15 | 1966-10-11 | Bell Telephone Labor Inc | Stress sensing semiconductive devices |
NL153947B (nl) * | 1967-02-25 | 1977-07-15 | Philips Nv | Werkwijze voor het vervaardigen van halfgeleiderinrichtingen, waarbij een selectief elektrolytisch etsproces wordt toegepast en halfgeleiderinrichting verkregen met toepassing van de werkwijze. |
BE711537A (pt) * | 1968-03-01 | 1968-09-02 |
-
1968
- 1968-11-29 NL NL6817089A patent/NL162254B/xx not_active IP Right Cessation
-
1969
- 1969-11-21 ES ES373779A patent/ES373779A1/es not_active Expired
- 1969-11-26 AT AT1103969A patent/AT316894B/de not_active IP Right Cessation
- 1969-11-26 GB GB1295650D patent/GB1295650A/en not_active Expired
- 1969-11-26 CH CH1758969A patent/CH518006A/de not_active IP Right Cessation
- 1969-11-26 BR BR21455769A patent/BR6914557D0/pt unknown
- 1969-11-26 SE SE223173A patent/SE384437B/xx unknown
- 1969-11-26 SE SE1625669A patent/SE363700B/xx unknown
- 1969-11-27 DE DE19691959527 patent/DE1959527C3/de not_active Expired
- 1969-11-27 BE BE742331D patent/BE742331A/xx not_active IP Right Cessation
- 1969-12-01 FR FR6941355A patent/FR2024961A1/fr not_active Withdrawn
-
1972
- 1972-03-16 ES ES400839A patent/ES400839A1/es not_active Expired
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0006740A1 (en) * | 1978-06-28 | 1980-01-09 | Gould Inc. | Improvements in strain gauges |
EP0338180A1 (en) * | 1988-04-21 | 1989-10-25 | MAGNETI MARELLI S.p.A. | An electrical force and/or deformation sensor, particularly for use as a pressure sensor |
EP0340022A1 (en) * | 1988-04-29 | 1989-11-02 | Schlumberger Industries, Inc. | Mechanical sensor for high temperature environments |
Also Published As
Publication number | Publication date |
---|---|
GB1295650A (pt) | 1972-11-08 |
ES400839A1 (es) | 1975-02-01 |
NL6817089A (pt) | 1970-06-02 |
SE384437B (sv) | 1976-05-03 |
BE742331A (pt) | 1970-05-27 |
CH518006A (de) | 1972-01-15 |
DE1959527B2 (de) | 1981-03-19 |
DE1959527A1 (de) | 1970-06-11 |
NL162254B (nl) | 1979-11-15 |
BR6914557D0 (pt) | 1973-01-02 |
FR2024961A1 (pt) | 1970-09-04 |
DE1959527C3 (de) | 1981-12-10 |
SE363700B (pt) | 1974-01-28 |
ES373779A1 (es) | 1972-05-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ELJ | Ceased due to non-payment of the annual fee |