AT304680B - Mit Kupfer kaschierte Kunststoff-Trägerplatte zur Herstellung von gedruckten Schaltungen - Google Patents
Mit Kupfer kaschierte Kunststoff-Trägerplatte zur Herstellung von gedruckten SchaltungenInfo
- Publication number
- AT304680B AT304680B AT60071A AT60071A AT304680B AT 304680 B AT304680 B AT 304680B AT 60071 A AT60071 A AT 60071A AT 60071 A AT60071 A AT 60071A AT 304680 B AT304680 B AT 304680B
- Authority
- AT
- Austria
- Prior art keywords
- copper
- production
- carrier plate
- printed circuits
- plastic carrier
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title 1
- 229910052802 copper Inorganic materials 0.000 title 1
- 239000010949 copper Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0585—Second resist used as mask for selective stripping of first resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Metallurgy (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702008886 DE2008886B2 (de) | 1970-02-26 | 1970-02-26 | Kunststoff-traegerplatte zur herstellung von gedruckten schaltungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AT304680B true AT304680B (de) | 1973-01-25 |
Family
ID=5763360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT60071A AT304680B (de) | 1970-02-26 | 1971-01-25 | Mit Kupfer kaschierte Kunststoff-Trägerplatte zur Herstellung von gedruckten Schaltungen |
Country Status (11)
| Country | Link |
|---|---|
| AT (1) | AT304680B (de) |
| AU (1) | AU2575271A (de) |
| BE (1) | BE762480A (de) |
| CH (1) | CH513567A (de) |
| DE (1) | DE2008886B2 (de) |
| ES (1) | ES195455Y (de) |
| FR (1) | FR2081053B1 (de) |
| GB (1) | GB1335612A (de) |
| LU (1) | LU62650A1 (de) |
| NL (1) | NL7102229A (de) |
| ZA (1) | ZA711265B (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3113855A1 (de) * | 1981-04-06 | 1982-10-21 | Fritz Wittig Herstellung gedruckter Schaltungen, 8000 München | Verfahren zur herstellung von leiterplatten |
| CA2079417C (en) | 1991-10-28 | 2003-01-07 | Lilip Lau | Expandable stents and method of making same |
| DE10106399C1 (de) * | 2001-02-12 | 2002-09-05 | Siemens Ag | Verfahren zur Herstellung von Schaltungsträgern mit groben Leiterstrukturen und mindestens einem Bereich mit feinen Leiterstrukturen |
| US7947207B2 (en) | 2005-04-12 | 2011-05-24 | Abbott Cardiovascular Systems Inc. | Method for retaining a vascular stent on a catheter |
-
1970
- 1970-02-26 DE DE19702008886 patent/DE2008886B2/de active Pending
-
1971
- 1971-01-25 AT AT60071A patent/AT304680B/de not_active IP Right Cessation
- 1971-01-26 CH CH114071A patent/CH513567A/de not_active IP Right Cessation
- 1971-02-03 BE BE762480A patent/BE762480A/xx unknown
- 1971-02-19 NL NL7102229A patent/NL7102229A/xx unknown
- 1971-02-22 AU AU25752/71A patent/AU2575271A/en not_active Expired
- 1971-02-23 FR FR717107040A patent/FR2081053B1/fr not_active Expired
- 1971-02-24 LU LU62650D patent/LU62650A1/xx unknown
- 1971-02-25 ES ES1971195455U patent/ES195455Y/es not_active Expired
- 1971-02-26 ZA ZA711265A patent/ZA711265B/xx unknown
- 1971-04-19 GB GB2221671A patent/GB1335612A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2008886A1 (de) | 1971-09-09 |
| CH513567A (de) | 1971-09-30 |
| FR2081053A1 (de) | 1971-11-26 |
| ES195455U (es) | 1975-02-16 |
| LU62650A1 (de) | 1971-08-18 |
| DE2008886B2 (de) | 1972-05-10 |
| AU2575271A (en) | 1972-08-24 |
| NL7102229A (de) | 1971-08-30 |
| BE762480A (fr) | 1971-07-16 |
| ES195455Y (es) | 1975-07-16 |
| FR2081053B1 (de) | 1973-06-08 |
| ZA711265B (en) | 1971-11-24 |
| GB1335612A (en) | 1973-10-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee |