AT293812B - Verfahren zum Ätzen von Kupfer und Kupferlegierungen, insbesondere von kupferkaschierten Schichtpreßstoffen - Google Patents

Verfahren zum Ätzen von Kupfer und Kupferlegierungen, insbesondere von kupferkaschierten Schichtpreßstoffen

Info

Publication number
AT293812B
AT293812B AT892569A AT892569A AT293812B AT 293812 B AT293812 B AT 293812B AT 892569 A AT892569 A AT 892569A AT 892569 A AT892569 A AT 892569A AT 293812 B AT293812 B AT 293812B
Authority
AT
Austria
Prior art keywords
copper
etching
clad laminates
alloys
copper alloys
Prior art date
Application number
AT892569A
Other languages
English (en)
Inventor
Alfred Dr Rehm
Winfried Eggert
Original Assignee
Saba Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19681807414 external-priority patent/DE1807414C3/de
Application filed by Saba Gmbh filed Critical Saba Gmbh
Application granted granted Critical
Publication of AT293812B publication Critical patent/AT293812B/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/46—Regeneration of etching compositions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
AT892569A 1968-11-07 1969-09-19 Verfahren zum Ätzen von Kupfer und Kupferlegierungen, insbesondere von kupferkaschierten Schichtpreßstoffen AT293812B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681807414 DE1807414C3 (de) 1968-11-07 Verfahren zum Ätzen von Kupfer und Kupferlegierungen, insbesondere von kupferkaschierten Schichtpreßstoffen

Publications (1)

Publication Number Publication Date
AT293812B true AT293812B (de) 1971-10-25

Family

ID=5712562

Family Applications (1)

Application Number Title Priority Date Filing Date
AT892569A AT293812B (de) 1968-11-07 1969-09-19 Verfahren zum Ätzen von Kupfer und Kupferlegierungen, insbesondere von kupferkaschierten Schichtpreßstoffen

Country Status (10)

Country Link
US (1) US3880685A (de)
JP (1) JPS5013223B1 (de)
AT (1) AT293812B (de)
BE (1) BE740609A (de)
CH (1) CH505213A (de)
ES (1) ES372831A1 (de)
FR (1) FR2022757A1 (de)
GB (1) GB1244415A (de)
LU (1) LU59712A1 (de)
NL (1) NL167477C (de)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951711A (en) * 1974-10-24 1976-04-20 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3964956A (en) * 1974-10-24 1976-06-22 General Dynamics Corporation System for maintaining uniform copper etching efficiency
US3962005A (en) * 1975-06-30 1976-06-08 Zenith Radio Corporation Method for etching shadow mask and regenerating etchant
US4190481A (en) * 1977-12-30 1980-02-26 Chemcut Corporation Apparatus for ion control of solutions
DE3035864A1 (de) * 1980-09-23 1982-05-06 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur regenerierung salzsaurer kupferchlorid-aetzloesungen
EP0178347B1 (de) * 1984-10-19 1988-09-07 Ibm Deutschland Gmbh Verfahren zum automatischen Regenerieren von Kupferchlorid-Ätzlösungen
DE3539874A1 (de) * 1985-11-11 1987-05-14 Hoellmueller Maschbau H Anlage zum aetzen von zumindest teilweise aus metall, vorzugsweise kupfer, bestehendem aetzgut
US5013395A (en) * 1987-08-28 1991-05-07 International Business Machines Corporation Continuous regeneration of acid solution
US5246023A (en) * 1990-04-24 1993-09-21 Electronic Controls Design, Inc. Method and apparatus to clean and cleanliness test printed circuit boards
US5227010A (en) * 1991-04-03 1993-07-13 International Business Machines Corporation Regeneration of ferric chloride etchants
US5259979A (en) * 1993-01-13 1993-11-09 Oliver Sales Company Process for regeneration of cleaning compounds
JP3074366B2 (ja) * 1993-02-22 2000-08-07 東京エレクトロン株式会社 処理装置
TW256929B (de) * 1993-12-29 1995-09-11 Hirama Rika Kenkyusho Kk
US5534078A (en) * 1994-01-27 1996-07-09 Breunsbach; Rex Method for cleaning electronic assemblies
JPH09199467A (ja) * 1996-01-17 1997-07-31 Mitsubishi Electric Corp 洗浄装置及びその方法
JP3093975B2 (ja) * 1996-07-02 2000-10-03 株式会社平間理化研究所 レジスト剥離液管理装置
KR100652044B1 (ko) * 2001-12-18 2006-11-30 엘지.필립스 엘시디 주식회사 스트립 장치
US6746547B2 (en) 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
SE531697C2 (sv) * 2007-07-11 2009-07-07 Sigma Engineering Ab Etsnings- och återvinningsförfarande
US20100059084A1 (en) * 2008-09-10 2010-03-11 Austin American Technology Corporation Cleaning and testing ionic cleanliness of electronic assemblies
CN109811343B (zh) * 2019-03-19 2020-11-17 惠州市瑞翔丰科技有限公司 不含氨氮的环保蚀刻液及蚀刻方法
CN113046746B (zh) * 2021-03-12 2023-03-10 合肥颀材科技有限公司 一种cof卷带精准蚀刻管控方法
CN118272811A (zh) * 2024-06-03 2024-07-02 新恒汇电子股份有限公司 降低蚀刻侧蚀量的防侧蚀剂及其使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL199874A (de) * 1954-08-26
US2927871A (en) * 1956-03-26 1960-03-08 Bethlehem Steel Corp Control of pickling baths
US2977199A (en) * 1956-12-31 1961-03-28 Ind Rayon Corp Method for the continuous testing of flowing materials
US2908557A (en) * 1957-01-07 1959-10-13 Rca Corp Method of etching copper
US3000385A (en) * 1957-10-30 1961-09-19 Wean Engineering Co Inc Pickling apparatus
US3074277A (en) * 1958-03-20 1963-01-22 Inland Steel Co Method and apparatus for automatic control of acid concentration in pickling system
US3312189A (en) * 1963-12-24 1967-04-04 Hooker Chemical Corp Automatic solution control system

Also Published As

Publication number Publication date
BE740609A (de) 1970-04-01
US3880685A (en) 1975-04-29
JPS5013223B1 (de) 1975-05-17
DE1807414B2 (de) 1971-03-18
GB1244415A (en) 1971-09-02
CH505213A (de) 1971-03-31
NL167477B (nl) 1981-07-16
DE1807414A1 (de) 1970-06-18
NL6916811A (de) 1970-05-11
FR2022757A1 (de) 1970-08-07
LU59712A1 (de) 1970-01-12
NL167477C (nl) 1981-12-16
ES372831A1 (es) 1971-11-01

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Legal Events

Date Code Title Description
EIH Change in the person of patent owner
ELA Expired due to lapse of time