AR217039A1 - Composicion fotopolimerizable - Google Patents
Composicion fotopolimerizableInfo
- Publication number
- AR217039A1 AR217039A1 AR258934A AR25893475A AR217039A1 AR 217039 A1 AR217039 A1 AR 217039A1 AR 258934 A AR258934 A AR 258934A AR 25893475 A AR25893475 A AR 25893475A AR 217039 A1 AR217039 A1 AR 217039A1
- Authority
- AR
- Argentina
- Prior art keywords
- photopolymerizable composition
- photopolymerizable
- composition
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
- C08F20/30—Esters containing oxygen in addition to the carboxy oxygen containing aromatic rings in the alcohol moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/10—Epoxy resins modified by unsaturated compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/443—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylhalogenides or other halogenoethylenic compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
- H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
- Y10T29/49812—Temporary protective coating, impregnation, or cast layer
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Polymerisation Methods In General (AREA)
- Paints Or Removers (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US05/473,180 US4003877A (en) | 1974-05-24 | 1974-05-24 | Photopolymerizable screen printing inks for permanent coatings prepared from aryloxyalkyl compositions |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR217039A1 true AR217039A1 (es) | 1980-02-29 |
Family
ID=23878521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AR258934A AR217039A1 (es) | 1974-05-24 | 1975-05-23 | Composicion fotopolimerizable |
Country Status (24)
Families Citing this family (69)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5296690A (en) * | 1976-02-10 | 1977-08-13 | Dainippon Ink & Chem Inc | Rapidly curable photo-setting resin composition |
| US4234676A (en) * | 1978-01-23 | 1980-11-18 | W. R. Grace & Co. | Polythiol effect curable polymeric composition |
| EP0002040B1 (de) * | 1977-11-21 | 1981-12-30 | Ciba-Geigy Ag | Verfahren zur Herstellung von Lötstoppmasken auf gedruckten Schaltungen mit Druckkontaktierungsbohrungen |
| US4169732A (en) * | 1978-01-09 | 1979-10-02 | International Business Machines Corporation | Photosensitive coating composition and use thereof |
| US4381951A (en) * | 1978-01-25 | 1983-05-03 | Western Electric Co. Inc. | Method of removing contaminants from a surface |
| US4322457A (en) * | 1978-01-25 | 1982-03-30 | Western Electric Co., Inc. | Method of selectively depositing a metal on a surface |
| JPS54105774A (en) * | 1978-02-08 | 1979-08-20 | Hitachi Ltd | Method of forming pattern on thin film hybrid integrated circuit |
| JPS5953164B2 (ja) * | 1978-04-13 | 1984-12-24 | 日本文化精工株式会社 | 印刷とメツキとによるプラスチツク製品の加飾方法 |
| JPS54158661A (en) * | 1978-06-01 | 1979-12-14 | Tokyo Purinto Kougiyou Kk | Printed circuit board |
| GB2030584B (en) * | 1978-10-03 | 1983-03-23 | Lankro Chem Ltd | Photopolymerisable solder resist compositions |
| NO159729C (no) * | 1978-11-01 | 1989-02-01 | Coates Brothers & Co | Fremgangsmaate for fremstilling av et moenster av loddemetall paa et lag elektrisk ledende metall baaret av et ikke-ledende underlag. |
| US4486466A (en) * | 1979-01-12 | 1984-12-04 | Kollmorgen Technologies Corporation | High resolution screen printable resists |
| US4240945A (en) * | 1979-01-31 | 1980-12-23 | Albert Gabrick | Solder mask composition |
| US4345371A (en) * | 1979-03-14 | 1982-08-24 | Sony Corporation | Method and apparatus for manufacturing hybrid integrated circuits |
| JPS55127097A (en) * | 1979-03-20 | 1980-10-01 | Matsushita Electric Ind Co Ltd | Photocurable resin composition and solder resist |
| GB2050946B (en) * | 1979-05-30 | 1983-02-16 | Tdk Electronics Co Ltd | Hot melt screen printing machine and process for producing a screen printing plate |
| US4376815A (en) * | 1979-10-22 | 1983-03-15 | Oddi Michael J | Method of applying photoresist by screening in the formation of printed circuits |
| US4390615A (en) * | 1979-11-05 | 1983-06-28 | Courtney Robert W | Coating compositions |
| US4416974A (en) * | 1979-12-05 | 1983-11-22 | Hercules Incorporated | Radiation curable ceramic pigment composition |
| US4306012A (en) * | 1979-12-05 | 1981-12-15 | Hercules Incorporated | Process of radiation and heat treatment of printing medium |
| US4252888A (en) * | 1980-02-26 | 1981-02-24 | Minnesota Mining And Manufacturing Company | Solder mask composition |
| JPS6045665B2 (ja) * | 1980-04-21 | 1985-10-11 | 日立化成工業株式会社 | 実装回路板用防湿絶縁塗料組成物 |
| JPS573875A (en) * | 1980-06-11 | 1982-01-09 | Tamura Kaken Kk | Photopolymerizable ink composition |
| US4490457A (en) * | 1980-11-28 | 1984-12-25 | Honeywell Inc. | Cold/dry substrate treatment technique which improves photolithographic limits of resolution and exposure tolerance |
| JPS5888741A (ja) * | 1981-11-20 | 1983-05-26 | Hitachi Chem Co Ltd | 感光性樹脂組成物及び感光性樹脂組成物積層体 |
| JPS58177492A (ja) * | 1982-04-12 | 1983-10-18 | Tadao Mutou | プラスチツク成形品に部分的な金属メツキを施す方法 |
| US4522914A (en) * | 1982-10-22 | 1985-06-11 | Wabash College | Imaging method of making a raised line facsimile of a photographic image |
| JPS59204036A (ja) * | 1983-05-06 | 1984-11-19 | Dainippon Ink & Chem Inc | レジストパタ−ンの形成法 |
| US4533445A (en) * | 1983-07-06 | 1985-08-06 | Shipley Company Inc. | U.V. Curable composition |
| US4775611A (en) * | 1983-11-10 | 1988-10-04 | Sullivan Donald F | Additive printed circuit boards with flat surface and indented primary wiring conductors |
| US4640719A (en) * | 1985-07-01 | 1987-02-03 | Petroleum Fermentations N.V. | Method for printed circuit board and/or printed wiring board cleaning |
| AT389793B (de) * | 1986-03-25 | 1990-01-25 | Philips Nv | Leiterplatte fuer gedruckte schaltungen und verfahren zur herstellung solcher leiterplatten |
| US4690833A (en) * | 1986-03-28 | 1987-09-01 | International Business Machines Corporation | Providing circuit lines on a substrate |
| US4826705A (en) * | 1986-07-02 | 1989-05-02 | Loctite Corporation | Radiation curable temporary solder mask |
| JPH0688012B2 (ja) * | 1986-07-02 | 1994-11-09 | ロクタイト．コーポレーション | 放射線硬化性マスキング組成物 |
| JPS6462375A (en) * | 1987-09-02 | 1989-03-08 | Arakawa Chem Ind | Liquid photosolder resist ink composition of alkali development type |
| GB2214191B (en) * | 1988-01-12 | 1990-10-31 | Sicpa Holding Sa | Reversibly photochromic printing inks |
| EP0346522A3 (en) * | 1988-06-16 | 1991-04-03 | Nippon CMK Corp. | Printed wiring board |
| US5667934A (en) * | 1990-10-09 | 1997-09-16 | International Business Machines Corporation | Thermally stable photoimaging composition |
| US5206116A (en) * | 1991-03-04 | 1993-04-27 | Shipley Company Inc. | Light-sensitive composition for use as a soldermask and process |
| DE4316087A1 (de) * | 1993-05-13 | 1994-11-17 | Morton Int Inc | Verfahren zum bildmäßigen Metallisieren von strukturierten Leiterplatten |
| US5458921A (en) | 1994-10-11 | 1995-10-17 | Morton International, Inc. | Solvent system for forming films of photoimageable compositions |
| US5545440A (en) * | 1994-12-05 | 1996-08-13 | At&T Global Information Solutions Company (Aka Ncr Corporation) | Method and apparatus for polymer coating of substrates |
| US5802713A (en) * | 1995-01-20 | 1998-09-08 | Fairchild Space And Defense Corportion | Circuit board manufacturing method |
| US5939238A (en) * | 1998-06-02 | 1999-08-17 | Morton International, Inc. | Photoimageable composition having improved photoinitiator system |
| US5952153A (en) * | 1997-12-01 | 1999-09-14 | Morton International, Inc. | Photoimageable composition having improved flexibility, adhesion and stripping characteristics |
| US5939239A (en) * | 1997-12-01 | 1999-08-17 | Nichigo-Morton Co., Ltd. | Photoimageable compositions containing photopolymerizable urethane oligomers and dibenzoate plasticizers |
| US5952154A (en) * | 1998-05-29 | 1999-09-14 | Morton International, Inc. | Photoimageable composition having improved flexibility |
| DE19842276A1 (de) * | 1998-09-16 | 2000-03-30 | Bosch Gmbh Robert | Paste zum Verschweißen von Keramiken mit Metallen und Verfahren zur Herstellung einer Schweißverbindung |
| JP2000118113A (ja) * | 1998-10-15 | 2000-04-25 | Riso Kagaku Corp | 孔版印刷方法及び装置 |
| US20030119955A1 (en) * | 2001-02-08 | 2003-06-26 | Mbt Holding Ag | Polymeric structural support membrane |
| EP1390427B1 (en) * | 2001-02-08 | 2005-06-08 | Construction Research & Technology GmbH | Polymeric excavation structural support membrane |
| US6855480B2 (en) | 2001-04-19 | 2005-02-15 | Shipley Company, L.L.C. | Photoresist composition |
| TW511423B (en) * | 2001-09-25 | 2002-11-21 | Benq Corp | Soft circuit board for recognition and the manufacturing method thereof |
| US20060154180A1 (en) | 2005-01-07 | 2006-07-13 | Kannurpatti Anandkumar R | Imaging element for use as a recording element and process of using the imaging element |
| DE602006006028D1 (de) | 2005-02-04 | 2009-05-14 | Denki Kagaku Kogyo Kk | Harzzusammensetzungen, daraus gewonnener gehärteter artikel sowie folie |
| US7579134B2 (en) * | 2005-03-15 | 2009-08-25 | E. I. Dupont De Nemours And Company | Polyimide composite coverlays and methods and compositions relating thereto |
| US7618766B2 (en) * | 2005-12-21 | 2009-11-17 | E. I. Du Pont De Nemours And Company | Flame retardant photoimagable coverlay compositions and methods relating thereto |
| US7527915B2 (en) * | 2006-07-19 | 2009-05-05 | E. I. Du Pont De Nemours And Company | Flame retardant multi-layer photoimagable coverlay compositions and methods relating thereto |
| JP5560185B2 (ja) | 2008-03-03 | 2014-07-23 | 旭化成ケミカルズ株式会社 | 難燃性樹脂組成物 |
| TWI353808B (en) * | 2008-04-28 | 2011-12-01 | Ind Tech Res Inst | Method for fabricating conductive pattern on flexi |
| JP5318222B2 (ja) * | 2008-11-25 | 2013-10-16 | ロード コーポレイション | 光硬化性材料でダイ表面を保護する方法 |
| US9093448B2 (en) | 2008-11-25 | 2015-07-28 | Lord Corporation | Methods for protecting a die surface with photocurable materials |
| US20130029046A1 (en) * | 2010-04-09 | 2013-01-31 | Basf Se | Printing ink containing a divinyl ester |
| US8344172B2 (en) * | 2011-03-25 | 2013-01-01 | Stepan Company | Preparation of antiplasticizers for thermoplastic polyesters |
| CN104011921B (zh) | 2011-12-28 | 2016-03-09 | 旭化成电子材料株式会社 | 氧化还原液流二次电池和氧化还原液流二次电池用电解质膜 |
| GB201223064D0 (en) * | 2012-12-20 | 2013-02-06 | Rainbow Technology Systems Ltd | Curable coatings for photoimaging |
| US20160230014A1 (en) * | 2013-09-13 | 2016-08-11 | Basf Se | Scratch-resistant radiation-cured coatings |
| DE102014106230A1 (de) * | 2014-05-05 | 2015-11-05 | Preh Gmbh | Galvanisierverfahren für Inselstrukturen |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3066112A (en) * | 1959-01-30 | 1962-11-27 | Rafael L Bowen | Dental filling material comprising vinyl silane treated fused silica and a binder consisting of the reaction product of bis phenol and glycidyl acrylate |
| US3539533A (en) * | 1968-06-14 | 1970-11-10 | Johnson & Johnson | Dental filling material |
| US3661576A (en) * | 1970-02-09 | 1972-05-09 | Brady Co W H | Photopolymerizable compositions and articles |
| US3772062A (en) * | 1971-11-16 | 1973-11-13 | Inmont Corp | Ultra-violet curable coating compositions |
| JPS5414605B2 (US06605200-20030812-C00035.png) * | 1972-07-05 | 1979-06-08 | ||
| JPS5625441B2 (US06605200-20030812-C00035.png) * | 1972-09-04 | 1981-06-12 | ||
| JPS535712B2 (US06605200-20030812-C00035.png) * | 1973-01-24 | 1978-03-01 | ||
| DE2349979A1 (de) * | 1973-10-04 | 1975-04-17 | Bayer Ag | Uv-licht-haertende massen hoher reaktivitaet |
-
1974
- 1974-05-24 US US05/473,180 patent/US4003877A/en not_active Expired - Lifetime
-
1975
- 1975-05-12 ZA ZA00753049A patent/ZA753049B/xx unknown
- 1975-05-14 GB GB20460/75A patent/GB1507842A/en not_active Expired
- 1975-05-14 IN IN963/CAL/75A patent/IN142791B/en unknown
- 1975-05-18 IL IL47310A patent/IL47310A/xx unknown
- 1975-05-20 FI FI751475A patent/FI59112C/fi not_active IP Right Cessation
- 1975-05-21 IT IT49715/75A patent/IT1035820B/it active
- 1975-05-21 ES ES437825A patent/ES437825A1/es not_active Expired
- 1975-05-22 DD DD186195A patent/DD120662A5/xx unknown
- 1975-05-22 SE SE7505838A patent/SE431879B/xx unknown
- 1975-05-22 DD DD191378A patent/DD124390A5/xx unknown
- 1975-05-23 BG BG030068A patent/BG26402A3/xx unknown
- 1975-05-23 NO NO751830A patent/NO146676C/no unknown
- 1975-05-23 NL NLAANVRAGE7506080,A patent/NL173178B/xx not_active Application Discontinuation
- 1975-05-23 CA CA227,687A patent/CA1049691A/en not_active Expired
- 1975-05-23 AR AR258934A patent/AR217039A1/es active
- 1975-05-23 BE BE156665A patent/BE829437A/xx not_active IP Right Cessation
- 1975-05-23 BR BR4189/75A patent/BR7503276A/pt unknown
- 1975-05-23 DK DK227875A patent/DK154919C/da not_active IP Right Cessation
- 1975-05-23 RO RO7582318A patent/RO67457A/ro unknown
- 1975-05-23 CH CH756624A patent/CH608825A5/xx not_active IP Right Cessation
- 1975-05-23 FR FR7516148A patent/FR2274652A1/fr active Granted
- 1975-05-23 DE DE2522811A patent/DE2522811C2/de not_active Expired
- 1975-05-24 JP JP50062416A patent/JPS515388A/ja active Pending
- 1975-05-26 AT AT400775A patent/AT339928B/de not_active IP Right Cessation
-
1976
- 1976-06-01 US US05/691,922 patent/US4064287A/en not_active Expired - Lifetime
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