TW201206698A - Glass laminate, display device panel with supporting body, display device panel, display device, method for producing glass laminate, method for producing display device panel with supporting body, and method for producing display device panel - Google Patents

Abstract

Disclosed is a glass laminate which comprises: a thin plate glass substrate that has a first main surface and a second main surface; a supporting glass substrate that has a first main surface and a second main surface and is arranged such that the first main surface faces the first main surface of the thin plate glass substrate; a resin layer that is formed between the thin plate glass substrate and the supporting glass substrate so as to be fixed to the first main surface of the supporting glass substrate and removably adhered to the first main surface of the thin plate glass substrate; and an outer frame layer that contains a glass-based sealing material and is formed by being fired on the outside of the peripheral portion of the resin layer.

Description

[Technical Field] The present invention relates to a glass laminate, a panel for a display device with a support, a panel for a display device, a display device, and the like. [Prior Art] A display device such as a liquid crystal display (LCD) or an organic EL display device (OLED (Organic Electro Luminescence Display)), particularly a portable camera such as a digital camera or a mobile phone In the field of display devices, the weight reduction and thinning of display devices have become important issues. In order to solve the problem, it is preferable to further reduce the thickness of the glass substrate used in the display device. As a method of thinning the thickness of the sheet, a method for forming a panel for a display device by forming a member for a display device on the surface of a glass substrate, and then etching the outer surfaces of the panel for the display device by chemical etching is generally performed. The thickness of the panel for the display device is reduced. In the method of thinning the substrate by chemical etching, for example, when the thickness of one glass substrate is thinned from 0.7 mm to 0.2 mm or 〇1 mm, the original glass substrate is etched by the etching solution. Most of the material is cut off, so it is not good in terms of productivity or raw material usage. In this regard, when a glass substrate with a relatively thin plate thickness is used, it is manufactured.

In the case of a Transistor's thin film transistor array substrate or a color light-emitting sheet substrate, the strength of the glass substrate at the time of manufacture is insufficient, and the amount of deflection is also increased. This creates problems that cannot be handled by existing manufacturing lines. 151653.doc 201206698 Further, in the substrate thinning method according to the chemical rice carving, a member for a display device is formed on the surface of the glass substrate, and then a chemical etching treatment or the like is performed to thin the glass substrate, thereby forming a display on the surface of the glass substrate. In the process of disintegrating the member, there is a problem that the minute flaw formed on the surface of the glass substrate is marked, that is, the problem of the corrosion pit is generated. Therefore, in order to solve such a problem, there has been proposed a method in which a glass substrate having a small thickness (hereinafter referred to as a "thin glass substrate") is bonded to another glass substrate (hereinafter referred to as a "support glass substrate"). In this state, a specific process for manufacturing a display device is performed, and then the thin glass substrate and the supporting glass substrate are peeled off. For example, Patent Document 1 describes a thin-plate glass laminate in which a thin glass substrate and a supporting glass substrate are laminated via a polyoxynitride resin layer having easy peelability and non-adhesive properties. Further, in the 'Patent Document 记载, it is described that the thin glass substrate and the supporting glass substrate are peeled off, and the force for pulling the thin glass substrate from the support glass substrate in the vertical direction can be imparted, and the edge of the razor can be used to be equal to the end portion. The stripping of the notch or the injection of air into the laminated interface makes it easier to peel off the contents. [Problems to be Solved by the Invention] However, the process of forming a member for a display device such as a TFT array on a thin glass substrate is It is heat treated. 151653.doc 201206698 For example, in the glass laminate described in the patent document, the following 凊 shape is formed. The right heat treatment temperature is, for example, more than 4 〇 (the high temperature of about rc is the end of the polysulfide layer) The portion in contact with the outside air is oxidized and deteriorated. In this case, the peeling property with the thin glass substrate is lost and the glass substrate is peeled off. Further, the polyoxymethylene resin layer is whitened by oxidation. Therefore, it is an object of the present invention to provide a glass laminate which is difficult to oxidize even when a high-temperature heat treatment is performed. Technical Solution to Problem The present inventors have solved the above problems. As a result of intensive research, it has been found that a resin layer containing a glass-based sealing material and having a frame layer formed by firing on the outer side of the peripheral portion of the resin layer is used, and the resin layer is treated even at a high temperature. It is difficult to oxidize, thereby completing the present invention. That is, the present invention provides the following (1) to 〇7). (1) A glass laminate comprising: a thin glass substrate having a first main surface and a second main surface; and a glass substrate having a first main surface and a second main surface, and the third surface The main surface is disposed to face the first main surface of the thin glass substrate; the resin layer is formed between the thin glass substrate and the supporting glass substrate, and the i-th main is fixed to the supporting glass substrate, relative to The second main surface of the thin glass substrate has releasability and is in close contact with the first main surface; and the outer frame layer 'containing a glass-based sealing material' is fired on the outer side of the peripheral portion of the resin layer. form. (A) The glass laminate according to (1) above, wherein the outer frame layer is formed by irradiation and firing by a laser 151653.doc 201206698. (3) The glass laminate according to (2) above, wherein the glass-based sealing material has a melting temperature of 400 ° C or more and 750 ° C or less. (4) The glass laminate according to any one of the above (1), wherein the outer frame layer has a sectional area S of 3 X 1 〇·6 mm 2 S S S 5 mm 2 . (5) The glass laminate according to any one of the above (1), wherein the resin layer is selected from the group consisting of an acrylic resin, a polyolefin resin, a polyurethane resin, and a polyoxyl resin. At least one of the constituent resins. (6) The glass laminate according to any one of (1) to (5), wherein the thickness of the thin glass substrate is 0.3 mm or less, and the thickness of the supporting glass substrate is 0.4 mm or more. (7) A panel for a display device with a support, comprising: the glass laminate according to any one of (1) to (6) above; and a member for a display device formed on the glass laminate The second main surface of the thin glass substrate is provided. (8) A panel for a display device which is obtained by a panel for a display device having a branch body as described in the above (7). (9) A display device comprising the face plate for a display device as in the above (8). (10) A method for producing a glass laminate, which is the method for producing a glass laminate according to any one of the above (1) to (6), comprising the step of: the first main member of the supporting glass substrate The resin layer is formed on the surface, and the resin layer is fixed on the first main surface; and the glass system is coated on the outer side of the peripheral portion of the resin layer fixed on the first main surface of the supporting glass substrate. • 6 - 201206698 sealing material: the peeling surface of the resin layer fixed on the main surface of the supporting glass substrate is in close contact with the first main surface of the thin glass substrate; and is applied to the resin layer The glass-based sealing material on the outer side of the peripheral portion is fired to form the outer frame layer. (11) A method for producing a glass laminate, which is the method for producing a glass laminate according to any one of the above (1) to (6), comprising the step of: forming a first main surface of the supporting glass substrate Coating the glass-based sealing material on the peripheral portion; baking the glass-based sealing material applied to the peripheral edge portion of the i-th main surface of the supporting glass substrate to form the outer frame layer; and forming the outer frame layer on the support Forming the resin layer on an inner region of the outer frame layer on the first main surface of the glass, fixing the resin layer on the first main surface; and fixing the above-mentioned main surface of the support glass substrate The peeling surface of the resin layer is in close contact with the first main surface of the thin glass substrate. (12) A method for producing a glass laminate, which is the method for producing a glass laminate according to any one of the above (1) to (6), comprising the step of: the first main member of the supporting glass substrate Applying the glass-based sealing material to a peripheral portion of the surface; forming the resin layer on an inner region of the glass-based sealing material applied to the first main surface of the supporting glass substrate, and fixing the resin layer to the resin layer a first main surface; the glass enamel sealing material coated on the first main surface of the supporting glass substrate is fired to form the outer frame layer; and is fixed to the first main surface of the supporting glass substrate The peelable surface of the resin layer is in close contact with the first main surface of the thin glass substrate. (13) A method for producing a glass laminate, which is a method for producing a glass laminate according to any one of the above-mentioned items, and comprising the steps of: supporting a glass substrate as described in J5I653.doc 201206698 The resin layer is formed on the first main surface, and the resin layer is fixed to the first main surface; the peelable surface of the resin layer is in close contact with the first main surface of the thin glass substrate; and the peripheral portion of the resin layer The glass-based sealing material is applied to the outside; and the glass-based sealing material applied to the outer side of the peripheral portion of the resin layer is fired to form the outer frame layer. (14) The method for producing a glass laminate according to the above (13), wherein the outer frame layer is formed by irradiating the glass-based sealing material with a laser. (15) A method for producing a panel for a display device with a support, comprising: a method for producing a glass laminate according to any one of the above (10) to (14); and the obtained glass laminate The second main surface of the thin glass substrate forms a step for forming a member for a display device. (16) A method of manufacturing a panel for a display device, comprising: a method of manufacturing a panel for a display device with a support as described in the above (15); and a panel for a display device with a support attached thereto A peeling step of peeling off the thin glass substrate from the supporting glass substrate. (17) The method of manufacturing a panel for a display device according to the above (16), wherein the peeling step is a step of peeling off the thin glass substrate from the supporting glass substrate after at least a part of the outer frame layer is physically broken. EFFECTS OF THE INVENTION According to the present invention, it is possible to provide a glass laminate which is hard to be oxidized even at a high temperature heat treatment. [Embodiment] 151653.doc 201206698 <Glass Laminate> The glass laminate of the present invention comprises: a thin glass substrate having a first main surface and a second main surface; and a supporting glass substrate having a first main layer The surface is disposed on the second main surface, and the first main surface is disposed to face the first main surface of the thin glass substrate; and the resin layer is formed between the thin glass substrate and the branch glass substrate The first main surface of the supporting glass substrate has releasability with respect to the first main surface of the thin glass substrate, and is in close contact with the first main surface; the outer frame layer contains a glass-based sealing material, The outer side of the peripheral portion of the resin layer is formed by firing. Hereinafter, the form of the glass laminate for carrying out the invention will be described with reference to the drawings. In addition, the following "glass laminated body" is sometimes referred to simply as a factory laminate. Fig. 1 is a schematic front view showing an embodiment (Configuration Example J) of a glass laminate according to the present invention. Figure 2 is a partial cross-sectional view taken along line A-A' of Figure 1. In the laminated body 10, the resin layer 14 is formed on the first main surface of the supporting glass substrate 18, and the outer frame layer 16 is formed on the outer side of the peripheral portion of the resin layer 14. In the laminated body 10, the thin glass substrate 12 and the supporting glass substrate 18 are sandwiched by the resin layer 14 and laminated. The outer frame layer 16 is formed on the outer side of the peripheral portion of the resin layer 14. At this time, the thin glass substrate 12 and the supporting glass substrate 18 are formed. It is roughly the same shape. Further, when the laminated body i 〇 is observed from the front side (for example, as shown in Fig. 1), the outer edge of the thin glass substrate 12 and the outer edge of the supporting glass substrate 18 are laminated so as to appear to coincide. Therefore, the illustration of the thin glass substrate 12 shown in Fig. 2 is omitted in Fig. 1. Hereinafter, the glass laminated body including such a structure is also referred to as "state 丨". 151653.doc -9- 201206698 Furthermore, the 'normal' glass substrate is chamfered after cutting after maintaining its end face strength. Therefore, the end faces of the thin glass substrate 12 and the supporting glass substrate 18 in the figure are formed in an arc shape. Here, the outer side of the peripheral portion of the resin layer is the first main surface of the supporting glass substrate, that is, the case where the glass laminated body is viewed from the front side (for example, in the first aspect and the second and third aspects described later) (for example, In the case of the case shown in Fig. 1, it means a region which is more outer than the outer edge of the resin layer, and further supports a region near the outer edge of the glass substrate. Further, in the aspects 4 and 5 which will be described later, the outer side of the peripheral portion of the resin layer means a region on the end surface of the resin layer which is outside the outer edge of the resin layer. Fig. 3 is a partial cross-sectional view showing a modification 1 of a configuration example. In the laminated body 20 shown in FIG. 3, the thin glass substrate 22 and the supporting glass substrate are "layered with the resin layer 24 interposed therebetween, and the outer frame layer 26 is formed on the outer side of the peripheral portion of the resin layer 24. At this time, with the thin glass substrate 22 is larger than the supporting glass substrate 28. Hereinafter, the glass laminated body including such a configuration is also referred to as "the aspect 2". Fig. 4 is a partial cross-sectional view showing a modification 2 of the structure different from Fig. 3. In the laminated body 30, the thin glass substrate 32 and the supporting glass substrate are "layered with the resin layer 34 interposed therebetween, and the outer frame layer 36 is formed on the outer side of the peripheral portion of the resin layer 34. In this case, the support is compared with the thin glass substrate 32. The glass substrate is smaller. Hereinafter, the glass laminate including such a structure is also referred to as "Stage 3". Further, in the aspects 1 to 3, the width W of the outer side of the peripheral portion of the resin layer on which the outer frame layer is formed is preferably 0.5 to 1 mm from the outer edge of the second main surface of the supporting glass substrate, and more preferably Preferably, it is 5 to 5 mm, more preferably 5 to 1 cm, 151653.doc _ 201206698 and further preferably 0.5-5 mm. If the supporting glass substrate is large, the width 琛 can also be large. Fig. 5 is a partial cross-sectional view showing a modification 3 of the structure different from Fig. 2. In the above-described aspects 1 to 3, a resin layer is formed on the support glass substrate of a predetermined size, and a thin-plate glass substrate having a different size is laminated. On the other hand, in the third modification shown in Fig. 5, after the end portion of the laminated body which has been laminated in advance is cut, an outer frame layer is formed on the outer side of the peripheral portion of the resin layer. Hereinafter, the glass laminate including such a configuration is also referred to as "the aspect 4". In the laminated body 40 of the fourth aspect, the thin glass substrate 42 and the supporting glass substrate 48 are laminated with the resin layer 44 interposed therebetween, and the outer frame layer 46 is formed on the outer side of the peripheral portion of the resin layer 44. The strength of the end face of the glass substrate 48 supported by the thin-frame glass substrate formed with the outer frame layer 46' is somewhat ensured. The figure is a partial cross-sectional view of a modification 4 including a structure different from that of Fig. 5. In the same manner as in the above-described aspect 4, after the end portion of the laminated layer is cut, the outer frame & is formed on the outer side of the peripheral portion of the resin layer, but before the outer frame layer is formed, the thin glass substrate is The glass substrate is supported for chamfering. Hereinafter, the glass laminate including such a structure is also referred to as "the aspect 5". In the laminated body 50 of the aspect 5, the thin glass substrate 52 and the branch glass substrate 58 are laminated with the resin layer 54 interposed therebetween, and the outer frame layer 56 is formed on the outer side of the peripheral edge portion of the resin layer M. In the above aspects 1 to 5, the resin layers are fixed to the glass substrate of the branch building! The main surface is peeled off from the i-th main surface of the thin glass substrate, and Φ is connected to the first main surface of the thin glass substrate. Further, in any of the above aspects 1 to 5, the resin layer is in contact with the outside air by the outer frame layer 151653.doc -11 · 201206698 T. Therefore, the glass laminate of the aspect 1 to 5 is difficult to generate gas upon heat treatment. That is, since the outer frame layer is present, the gas generated by the resin layer does not diverge to the outside. Moreover, even if the heat treatment temperature is a relatively high temperature (more than 40 (about TC)), the resin layer between the thin glass substrate and the glass substrate of the branch is hard to be oxidized and is hard to deteriorate. This is due to the outer frame. The layer is in contact with the end surface of the resin layer and the outer layer of the resin layer. The thickness, shape, size, physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like are not particularly limited, and may be, for example, the same as those of the conventional LCD and OLED LED display devices. The thickness of the glass substrate is not particularly limited as described above, and is preferably 0.3 Å or less, more preferably 〇.2 Å or less. More preferably, it is preferably 0.07 mm or more, and more preferably 〇1 mm or more. The shape of the thin glass substrate is not particularly limited as described above, and is preferably rectangular. Here, the "rectangular shape" is substantially rectangular, and includes cutting off the corner of the peripheral portion (cut angle). The size of the thin glass substrate is not particularly limited as described above. For example, in the case of a rectangular shape, it is preferably 100 to 2000 mm x 100 mm to 2 mm, more preferably 500 to 1 mm x 500 to 1000 mm. In addition, regarding the thickness and size of the thin glass substrate, the thickness is set to be an average value of the value of 9 points in the plane measured by a laser focus shift meter of 151653.doc •12·201206698, and the size is set to use a steel ruler respectively. The value of the short side and the long side is measured. The thickness and size of the glass substrate to be described later are also the same. As a thin glass substrate having such a thickness and size, the laminated body of the present invention can easily peel off the thin glass substrate from the supporting glass substrate. The physical properties of the thin glass substrate are not particularly limited as described above, and the heat shrinkage ratio of the thin glass substrate is preferably small due to the type of display device to be manufactured. Specifically, the linear expansion coefficient as an index of thermal shrinkage. Preferably, it is 5 〇〇 xi 〇 - Yc or less, more preferably 300 x l (r7rc or less is more preferably 20 〇 xl 〇 -7 / ° CW, and further preferably 1 〇〇χ 1 〇 -7 Γ (: α and then Good for 45XHTVC This is because the high-definition display device cannot be produced when the heat shrinkage rate is large. The linear expansion coefficient is based on the claw R3102-1995. The composition of the thin glass substrate is not particularly limited as described above, for example, Use a glass containing a metal oxide (such as limestone glass), no glass, etc.: a glass of various composition. * Because the heat shrinkage rate is small, there is no alkali 隹. (Supporting the glass substrate) Supporting the thickness of the glass substrate, The physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like of the shape main n are not particularly limited. The thickness of the glass substrate of the branch is not particularly limited by the thickness of the conventional manufacturing line as described above.权佳为 Specifically, the thickness of the plate is preferably 〇4, and the width is 0.4 mm or more, for example, mm, more preferably 〇5~〇8... live horse 0.4~li 8mm, and further preferably U~〇. 7mme 151653.doc 13-201206698 For example, when the designer manufactures a glass substrate having a thickness of 〇5 mm, the thickness of the supporting glass substrate and the thickness of the resin layer are designed by the designer in the case of the thickness of the thin glass substrate. The sum is set to 〇4. Moreover, the designer of the glass substrate having a thickness of 〇7 is most generally designed by the current display manufacturing line. For example, if the thickness of the thin glass substrate is 〇·3 mm, the thickness of the supporting glass substrate and the thickness of the resin layer are And set to 0.4 mm. In order to support the thin glass substrate and to enhance the strength of the thin glass substrate, the thickness of the supporting glass substrate is preferably thicker than that of the thin glass substrate. The shape of the supporting glass substrate is not particularly limited, and is preferably rectangular. However, the term "rectangular" as used herein is substantially rectangular and also includes a shape in which the corners of the peripheral portion are cut away (cut angle). The coefficient of linear expansion of the supporting glass substrate may be substantially the same as or different from that of the thin glass substrate. When it is substantially the same, when the laminated body of the present invention is subjected to heat treatment, warpage is less likely to occur on the thin glass substrate or the supporting glass substrate, which is preferable. The difference in linear expansion coefficient between the thin glass substrate and the supporting glass substrate is preferably 300 x 1 (T7/° C. or less is more preferably 1 〇〇 xl 〇 - Vc or less, further preferably 50 x 10 7 / ° C or less. The glass and the glass supporting the glass substrate may be glass of the same material. In this case, the difference between the linear expansion coefficients of the two glasses is 〇. The composition of the supporting glass substrate is, for example, the same as that of the glass and the glass. Since the heat shrinkage rate is small, no glass is preferred. Further, there is no method for manufacturing a thin glass substrate and a supporting glass substrate. The method of the prior art is not limited. For example, the previously known method can be used. After the known glass raw material is used as a molten glass, it is formed into a plate shape by a float method, a dissolution method, a lift-type crystal growth method, a flow hole down-draw method, a re-drawing method, or the like, and a thin-plate glass substrate and a supporting glass substrate can be obtained. Moreover, the surface of the thin glass substrate and the supporting glass substrate may be a polished surface that is polished or may be a non-etched surface that is not polished. The concept of productivity and cost The point is preferably a non-etched surface (raw surface). (Resin layer) The resin layer is fixed to the first main surface of the supporting glass substrate. On the other hand, the resin layer is in close contact with the first main surface of the thin glass substrate. However, the resin layer can be bonded to the first main surface of the thin glass substrate in such a manner that it can be easily peeled off without causing adverse effects on the thin glass substrate at the time of peeling. At the time of peeling, "the thin glass substrate is not damaged" and the resin remains on the first main surface of the thin glass substrate. The property of the surface of the resin layer which can be easily peeled off is called the peeling property. The surface of the resin layer is sometimes referred to as a releasable surface. It is understood that the first major surface of the ruthenium layer and the thin glass substrate is preferably bonded by an adhesive-like adhesive force by solid molecules. The force caused by the van der Waals force is the adhesive force to bond. The binding force of the first main surface of the supporting glass substrate of the resin layer is relatively higher than the bonding force of the ith main surface of the thin glass substrate. Higher. Yuben The combination of the first main surface of the thin glass substrate is referred to as adhesion, and the bonding of the first main surface of the supporting glass substrate is referred to as fixing. 151653.doc 201206698 The thickness of the resin layer is not particularly limited, and is preferably H00. More preferably, it is 30 μm, and further preferably 7 to 2 〇 (4). This is because if the thickness of the resin layer is in this range, the adhesion between the thin glass substrate and the resin layer becomes sufficient. This is because even bubbles or foreign matter are trapped. It is also possible to suppress the occurrence of deformation defects of the thin glass substrate. Further, if the thickness of the resin layer is too thick, a lot of formation time and materials are required, which is uneconomical. The thickness of the resin layer is determined by using a laser focus shift meter. The average value of the value of 9 points in the plane is the same as the thickness of the outer frame layer to be described later. Further, the resin layer may include two or more layers. In this case, the "thickness of the resin layer" is set as the total thickness of all the layers. Further, when the resin layer contains two or more layers, the types of the resins constituting each layer may be different. The same is true for the outer frame layer described later. The surface tension of the peeling surface of the resin layer is preferably 3 〇 mN/m or less, more preferably 25 mN/m or less, still more preferably 22 mN/m or less. This is because if the surface tension is such, the resin layer can be more easily adhered to the thin glass substrate and the thin glass substrate. Further, the material of the resin layer is preferably a material having a glass transition point lower than room temperature (25 <>>>c) or a material having no glass transition point. This is because the non-adhesive resin layer 'having higher peelability' can be more easily peeled off from the surface of the thin glass substrate, and the adhesion to the surface of the thin glass substrate is also sufficient. It is also preferred that the layer is heat resistant. This is because, for example, when a member for a display device is formed on the second main surface of the thin glass substrate, the laminated body of the present invention can be supplied to the heat treatment. Further, when the elastic modulus of the resin layer is too high, the adhesion to the surface of the thin glass substrate tends to be low, which is not preferable. Further, if the elastic modulus of the resin layer is too low, the peeling property is lowered. The resin constituting the resin layer is not particularly limited, and examples thereof include an acrylic resin, a polysulfonated resin, a polyurethane carboxylic acid resin, and a polyoxo resin. These resins may be used by mixing two or more kinds of resins. The resin constituting the resin layer is not particularly limited as described above, but is preferably a polyoxyxylene resin because it is excellent in heat resistance and excellent in peelability to a thin glass substrate. Further, the polyoxymethylene resin is preferably treated at a point of, for example, about 400 Torr for about 1 hour, and the peeling property is not substantially deteriorated. Further, when the polyoxyxylene resin is cured on the first major surface of the supporting glass substrate to form a polyoxyxylene resin layer, the resin is easily reacted by condensation reaction with the surface of the supporting glass substrate. The layer is fixed to the supporting glass substrate, and in this regard, it is preferably a polyoxyn resin. Further, among the polysulfide resins, polyphosphorus is used for the release paper. For the release paper, the polychlorinated oxygen system contains a linear dimethyl agglomerated oxysulfide as a main component in the molecule. The resin layer formed by curing the composition containing the main component and the crosslinking agent on the second main surface of the supporting glass substrate by using a catalyst, a photopolymerization initiator or the like is preferred because it has excellent releasability. Further, since the flexibility is less than that, even if foreign matter such as bubbles or dust is mixed between the thin glass substrate and the resin layer, only the resin layer is opened. Therefore, it is preferable to suppress the occurrence of deformation defects of the thin glass substrate. The release paper can be classified into a condensation reaction type I51653.doc 201206698 by a hardening mechanism, and a polysulfide oxygen-type polyoxo oxygen and an electron beam hardening type polyoxygen. Any of the release papers may be used with polyfluorene oxide, but among them, it is preferably an additional reaction type polysulfide. This is because the ease of the hardening reaction and the degree of peeling property when forming the resin layer are good, and the heat resistance is also high. Further, as the polyfluorene oxide for release paper, there are a solvent type, an emulsion type, and a lifeless dosage form. Any type of release paper can be used with polyfluorene. In addition, as a brand name or a model which is commercially available as polyfluorene for release paper, specifically, for example, kns_32〇a and KS_847 (both are exemplified)

SlllC〇neS & Manufacturing, TpR6700 (manufactured by GE Toshiba Silicone), vinyl polyoxylium "85〇〇" (manufactured by Arakawa Chemical Industries Co., Ltd.) and sulphide-based gasification concentrating stone "12031" ( A combination of Arakawa Chemical Industry Co., Ltd., vinyl polyoxylium "11364" (Arakawa Chemical Industry Month, f/j, manufactured by PUL Division) and methyl hydrogenated polychlorite "(3)3 i" (Arakawa, Xue Co., Ltd. (manufactured by Arakawa Chemical Industry Co., Ltd.), a combination of vinyl polyoxygen "U365" (manufactured by Arakawa Chemical Industries Co., Ltd.) and sulfhydryl hydrogenated polyoxane "12031" (manufactured by Arakawa Chemical Industry Co., Ltd.) . Further, 'KNS-320A, KS-847 and TPR6700 contain a main component and a crosslinking agent in advance. It is preferable that the compound having a polyfluorene resin is difficult to transfer to a thin glass substrate, that is, oligomeric oxygen transfer property. (Outer frame layer) The outer frame layer is in the form of a strip, which is present in the peripheral portion of the laminate of the present invention. The outer frame layer is formed in such a manner as to surround the resin layer, which must be formed substantially uninterrupted. I51653.doc 201206698 Case Ί The stratified body is heated for a long time at an ultra-high temperature (10 generations or more). The decomposition of the resin layer is considered. Therefore, in order to prevent the body (10) from supporting the glass-based glass substrate, the thorns may be partially provided with the outer frame layer without the formation of the outer frame layer. Preferably, the layer is in contact with the surface of the support glass substrate and the glass substrate. This is because the resin layer is difficult to contact the outer gas layer. ! The shape of the surface is not particularly limited, but since it is necessary to shield the resin layer from the contact with the outside air, it is required to have a specific sectional area S. The sectional area S of the outer frame layer as used herein means the laminated body of the present invention. When the cross section is observed in the in-plane direction, the cross-sectional area of the frame layer existing outside the end portion of the laminated body of the present invention. The area J of S is preferably 3 xi 〇 6 mm 2 or more. It is preferable to shield the outside air more preferably 3 x 1 (T4 mm 2 or more. When the right cross-sectional area 8 is too large, the glass substrate and the thin glass substrate are supported, and the peel strength becomes Therefore, the cross-sectional area s is preferably 5 mm 2 or less, and is preferably 1 mm 2 or less in order to facilitate the peeling. The outer frame layer contains the fired glass-based sealing material, that is, the outer frame layer is a glass system. The fire-retardant layer of the sealing material. The glass-based sealing material has a low ratio of the mass of the high-temperature heat treatment, and is excellent in the shielding property of the gas generated by the resin layer. The glass-based sealing material is used as the main component. The sealing glass of the component is blended with the laser 151653.doc •19- 201206698 The material of the material such as the material and the low-expansion filler is used. In addition, the glass-based sealing material may contain other additives as needed. For the sealing glass (glass powder), for example, a low-melting glass such as tin-phosphate glass, bismuth glass, vanadium glass, or lead glass can be used. In the case of ruthenium or the like, the sealing of the thin glass substrate and the supporting glass substrate is considered. It is preferable that tin (phosphorus-based glass, bismuth-based glass) tin-phosphate glass is used for the growth (adhesion) or its reliability (following reliability or airtightness), and further affecting the environment or the human body. (Glass powder) is preferably a composition having 20 to 68% by mass of Sn 〇, 0.5 to 5% by mass of 2Sn 〇 2, and 20 to 40% by mass of iP 2 〇 5 (substantially, the total amount is 100% by mass).

SnO is a component for lowering the melting point of glass. If the content of Sn is less than 20% by mass, the viscosity of the glass becomes high, the sealing temperature becomes too high, and if it exceeds 68% by mass, it does not vitrify.

Sn〇2 is a component for stabilizing glass. If the content of bismuth is less than 5% by mass, the Sn 〇 2 is separated and precipitated in the glass which is softened and melted during the sealing operation, and the fluidity is impaired, and the sealing workability is lowered. If the content of Sn 〇 2 exceeds 5 The mass ° / 〇 ' becomes easy to precipitate Sn 〇 2 from the melting of the low-melting glass. ? 2 〇 5 is used to form the composition of the glass skeleton. If the content of P2 〇 5 is less than 2 〇 mass%, it will not When the content is more than 40% by mass, the weathering property which is a disadvantage characteristic of the bismuth phosphate glass may be deteriorated. Here, the ratio (% by mass) of SnO and Sn〇2 in the glass frit may be as follows First, the glass powder acid is decomposed, and the total amount of Sn atoms contained in the glass frit is measured by lcp emission spectrometry. Secondly, 151653.doc • 20·201206698

The Sn2+(SnO) system is obtained by the iodine titration method for the acid decomposer, and thus the obtained §n2+ is subtracted from the total 1 of the Sn atoms to obtain sn4+(sn〇). The glass formed of the above three components has a low glass transition point, and is suitable for a sealing material for low temperature. However, it may contain an optional component such as a component such as SiO 2 or the like which forms a skeleton of glass; Zn〇, W 〇3, Mo〇3 'Nb2〇5, Ti〇2 'Zr〇2, Li2〇, Na2〇, Κ2〇,

A component that stabilizes glass such as Cs20, MgO, CaO, SrO, or Ba0. In the case where the content of the optional component is excessive, the glass becomes unstable and devitrified, or the glass transition point or the softening point rises. Therefore, the total content of the optional components is preferably set to 3% by mass. the following. In this case, the glass composition is adjusted in such a manner that the total amount of the basic component and the optional component is substantially 100% by mass. The bismuth-based glass (glass frit) is preferably 7 〇 to 9 〇 mass% of Β Ο Ο 1 to 20% by mass of 2 ZnO, and 2 to 12% by mass of 82 〇 3 (the basic sum is set to 100% by mass). The composition of).

Bi2〇3 forms a network of glass. When the content of Bi2〇3 is less than 70% by mass, the softening point of the low-melting glass becomes high, and sealing at a low temperature becomes difficult. When the content of Bi2〇3 exceeds 9% by mass, it is difficult to vitrify, and 'the thermal expansion coefficient tends to be too high.

The Zn lanthanum system is a component which lowers the coefficient of thermal expansion and the like. If the content of ZnO is less than i% by mass, vitrification becomes difficult. When the content of ZnO exceeds 20% by mass, the stability at the time of molding the low-melting glass is lowered to cause devitrification. The b2〇3 system forms the skeleton of the glass and expands the range of vitrification. 151653.doc •21 - 201206698 points. When the content of B2〇3 is less than 2% by mass, vitrification becomes difficult, and if it exceeds 12% by mass, the softening point becomes too high, and even if a load is applied during sealing, sealing at a low temperature becomes difficult. 》 The glass formed by the above three components has a low glass transition point and is suitable for sealing materials for low temperature, but may also contain Al2〇3, Ce02,

Any components such as Si〇2, Ag20, Mo03, Nb203, Ta205, Ga203, Sb203, Li20, Na20, K20, Cs20, CaO, SrO, BaO, W03, P205, and SnOx (x is 1 or 2). In addition, when the content of the optional component is too large, the glass becomes unstable and devitrifies, or the glass transition point or the softening point rises. Therefore, the total content of the optional components is preferably 30% by mass or less. . The glass composition of this case is adjusted so that the total amount of the basic component and the arbitrary component is substantially 100% by mass. The laser absorbing material is an essential component when the glass sealing material is heated and melted by laser light. As the laser absorbing material, at least one metal selected from the group consisting of Fe, Cr, Mn, Co, Ni, and Cu, or a compound containing an oxide of the above metal can be used. Further, it may be a pigment other than the above. The content of the laser absorbing material is preferably 2 to 10 Å/min relative to the glass-based sealing material. The scope. If the content of the laser absorbing material is less than 2% by volume, there is a possibility that the sealing material layer cannot be sufficiently melted at the time of laser irradiation. This point is the cause of the bad. On the other hand, if the content of the laser absorbing material exceeds the volume/〇, there will be partial heat release near the interface between the thin glass substrate and the supporting glass substrate during laser irradiation, on the thin glass substrate or the glass base of the branch 151653.doc •22 - 201206698 The board is cracked, and the fluidity at the time of melting of the X' glass-based sealing material deteriorates as the adhesion between the thin glass substrate and the supporting glass substrate decreases. As the low-expansion filler, at least one selected from the group consisting of alumina, alumina, cerium oxide, oxalic acid cordierite, phosphoric acid-missing compound, limpid glass, and silicate glass is preferably used. Examples of the sarcoaradotic compound include ((4) Λ〇7, NaZr2(P〇4)3, KZr2(p〇4)3, and CaG5Zr2(p〇4)3.

NbZr(P〇4)3, Zr2(W〇3)(P〇4)2, these composite compounds. The term "low expansion filler" means a lower thermal expansion coefficient than the sealing glass. In the formation of the outer frame layer, first, for example, a glass-based sealing material slurry is blended in a glass-based sealing material in which the total content of the low-expansion filler and the laser absorbing material is in the range of 2 to 44% by volume. material. As the vehicle, specifically, for example, methylcellulose, ethylcellulose, thiol cellulose, oxyethyl cellulose, sulfhydryl cellulose, propyl cellulose, stone sinusoidal fiber can be used. Soluble in the solvent such as pine oil, butyl carbitol acetate, ethyl carbitol acetate, etc.; methyl methacrylate, ethyl (meth) acrylate, (methyl) Acrylic acid butyl vinegar, (mercapto) acrylic acid · 2_ Acetate resin such as acetonitrile dissolved in methyl ethyl ketone, terpineol, butyl carbitol acetate, ethyl carbitol Solvents such as acid esters. The degree of the glass-based sealing material slurry can be adjusted by the ratio of the resin to the solvent as the binder component, the ratio of the glass-based sealing material to the vehicle, etc., as long as the viscosity corresponding to the coating device is matched. . In the glass-based sealing material, the material can also be added by the addition of a known additive & glazing sealing material to a glass granule such as an antifoaming agent or a dispersing agent, and can be applied to the package 15I653.doc •23- 201206698 A known method of a rotary mixer or a roller mill, a ball mill or the like including a stirring wing. The glass-based sealing material thus obtained preferably has a melting temperature of 4 Torr or more and 750 C or less, more preferably 500 〇c or more and 7 Å or less. Further, the coefficient of thermal expansion after firing of the frame layer other than the glass-based sealing material is preferably 2〇χ1 (Τ7~25〇xl (T7/〇c 〇&lt;panel for display device with support>&gt; The panel for a display device with a support according to the present invention is attached to the second main surface of the thin glass substrate in the laminate of the present invention, and has a member for a display device. The panel for a display device with a support can be used. The second main surface of the thin plate glass substrate in the laminate of the present invention is obtained by forming a member for a display device. The member for the fifth gastric display device refers to a glass substrate for a display device such as an LCD or a 〇led device. The circuit board includes a light-emitting layer, a protective layer TFT array, a color filter, a liquid crystal, a transparent electrode of IT, etc., various circuit patterns, etc. The panel for a display device with a label body of the present invention is preferably A TFT array (hereinafter simply referred to as an "array") is formed on the second main surface of the thin-plate glass substrate of the laminated body of the present invention. The panel for a display device with a support according to the present invention includes, for example: Thin glass substrate 2 The main surface is formed with an array of the display of the present invention, and the display is provided with a δ plate, and the other glass substrate (for example, a glass substrate having a thickness of 0.3 mm or more) on which the color ray film is formed is bonded. 151653.doc •24·201206698 In addition, the support in the present invention refers to a case where a supporting glass substrate having a resin layer fixed to the main surface is used. <Display panel for display device> Supported by the above A panel for a display device can be obtained by a panel for a display device, and can be obtained by peeling off a thin glass substrate from a resin layer fixed to a glass substrate of a display device by a panel for a display device with a support as described later. A panel for a display device and a panel for a display device of a thin glass substrate. <Display device> A display device can be obtained by the panel for a display device. A polarizing plate, a backlight device, and a panel for a display device can be mounted on a panel for a display device. A display device is obtained by a device or the like. That is, the display device of the present invention includes the above-described panel for a display device. As such a display device, Lcd, 〇lED can be cited. Examples of the LCD include TN (Twisted Nematic) type, STN (Super Twisted Nematic) type, FE (Field Effect field type) type, tFT type, and MIM (Metal_Insulat〇r_Metab metal-insulation film). - Metal type, VA (VertiCal Alignment) type, IPS (In-plane switching) type. <Method for producing glass laminate> The method for producing a glass laminate according to the present invention is not particularly In the above-described aspects 1 to 5, the following method for producing a glass laminate (hereinafter sometimes referred to simply as a production method) can be selected. As shown in FIG. 7, the 'first manufacturing method includes the steps of forming a resin layer on the first main surface of the supporting glass substrate and fixing the resin layer on the second main surface. 151653.doc • 25-201206698 S101): a step of applying a glass-based sealing material on the outer side of a peripheral portion of the resin layer fixed on the first main surface of the supporting glass substrate (step 5102), and fixing the main surface of the supporting glass substrate a step of adhering the peeling surface of the resin layer to the first main surface of the thin glass substrate (step 5103); and baking the glass-based sealing material applied to the outer side of the peripheral portion of the resin layer to form the outer frame layer ( Step s 104). Such a first manufacturing method is selected in the above-described aspect 丨~3 manufacturing. Further, the steps S103 and S104 can be changed in order. As shown in FIG. 8, the second manufacturing method includes a step of applying a glass-based sealing material to a peripheral portion of the i-th main surface of the supporting glass substrate (step s2〇i), and applying the coating to the third substrate of the supporting glass substrate. a step of firing a glass-based sealing material on a peripheral portion of the main surface to form an outer frame layer (step S2〇2); forming a resin layer on an inner region of the outer frame layer formed on the first main surface of the supporting glass, a step of fixing the resin layer on the first main surface (step S2〇3); and a peeling surface of the resin layer fixed to the first main surface of the supporting glass substrate is in close contact with the first main surface of the thin glass substrate Step (Step S2〇4). This second manufacturing method is also selected in the manufacture of the above-described aspect N3. As shown in Fig. 9, the third manufacturing method includes: the periphery of the i-th main surface of the supporting glass substrate a step of coating a glass-based sealing material (step s3〇1); forming a resin layer on an inner region of the glass-based sealing material coated on the second main surface of the supporting glass substrate, and fixing the resin layer to the resin layer a step on the main surface of the second surface (step S302); to be applied to the supporting glass substrate The step of forming the outer frame layer by firing the glass-based sealing material on the is surface (step S3〇3) to peel the surface of the resin layer fixed on the second main surface of the supporting glass substrate 151653.doc • 26 - 201206698 a step of adhering to the first main surface of the thin glass substrate (step S304) is also selected in the production of the above aspect (1). In the third manufacturing method, step S302 is followed by step S302. The 'those' may also include a step of pre-firing the outer frame layer. For example, it may be considered to perform pre-baking by means of addition, and furnace, and the firing is performed by laser irradiation in step S3〇3. The fourth manufacturing method according to 10, comprising: forming a resin layer on the i-th main surface of the wire glass substrate, fixing the resin layer on the first main surface (step S4〇1); peeling off the resin layer a step of adhering the surface to the first main surface of the thin glass substrate (step S402); applying a glass-based sealing material to the outer side of the peripheral portion of the resin layer (step S4〇3); applying the periphery of the resin layer The step of firing the glass-based sealing material on the outer side to form the outer frame layer (step Step S404). The fourth manufacturing method is selected in the manufacturing of the above-described aspects 丨 to 3. In addition, in the fourth manufacturing method, after the step 84〇2, the steps include the laminated body of the laminated layer. The step of cutting the end portion is selected in the manufacture of the above aspect 4. In the fourth manufacturing method, before the step S4G3 after the step of cutting, the sheet glass substrate and the supporting glass substrate are poured The step of the corner is selected in the production of the above-described aspect 5. The contents of each of the first to fourth manufacturing methods will be described. (Resin layer formation) Resin layer is attached In the fourth manufacturing method, the central portion is formed on the first main surface of the glass substrate of the branch, and in the second and third manufacturing methods, the first main member is formed on the support member 51653.doc •27·201206698 The inner side of the central outer frame layer on the surface. ,. 4, the method of forming the formed resin layer is not particularly limited, and the resin is applied to the main surface of the resin layer by the film* method in the material of the broken plate. A method of heating and hardening it, and the like. The earthboard is enumerated as follows: specifically, the surface is modified and the surface is replaced. The first modification of the glass substrate is a surface modification treatment. For example, a chemical coupling agent is used to increase the chemical adhesion force, and the surface treatment is added. A physical treatment method or the like which increases the resistance by increasing the roughness of the surface by physical methods, sand blasting, and the like. As a known method used for coating a resin composition, a spray coating method, a die coating method, a spin coating method, a dip coating method, a roll coating method, a bar coating method, and a screen printing method may be mentioned. The gravure coating method or the like can be appropriately selected in accordance with the kind of the resin composition. For example, in the case of using a solvent-free type of montmorillonite as a resin composition, a die coating method, a spin coating method, or a screen printing method is preferred. The amount of the resin composition is saved to Α Α Λ Λ 7 The number is preferably 1 to 100 g/m, more preferably 5 to 2 〇 g/m 2 . For example, a well-known method such as a die coating method contains a poly-oxygen (main agent) containing a linear dimethyl oxime in the molecule, a crosslinking agent, and a catalyst. 15I653.doc -28-201206698 The fat composition is applied to the second major surface of the supporting glass substrate, and then heat-hardened. The first major surface chemical bond of the glass substrate is supported by heating and hardening the resin layer. The heat hardening conditions differ depending on the amount of the catalyst to be formulated. For example, when 2 parts by mass of the platinum-based catalyst is blended with respect to 100 parts by mass of the total amount of the main agent and the crosslinking agent, it is preferably 50 in the atmosphere. 〇~3〇〇. Preferably, it is preferably reacted at 100 C to 250 ° C. Further, the reaction time is preferably set to 5 to 6 Torr minutes, more preferably 10 to 30 minutes. In order to set the resin layer to a polyfluorene resin having an oligomeric oxime oxygen transfer property, the hardening reaction is carried out as much as possible so that the unreacted polyfluorene oxide component does not remain in the polyoxynoxy resin. If the reaction temperature and the reaction time are as described above, it is preferable that the unreacted polyfluorene oxide component does not remain in the polyoxymethylene resin. When the reaction time is too long or the reaction temperature is too high, the oxidative decomposition of the polyoxymethylene resin occurs at the same time, and the low molecular weight polylactic acid component is formed, and the oxygen transfer property becomes high. The hardening reaction is carried out as much as possible so that the unreacted polyfluorene oxide component does not remain in the polyoxynoxy resin, and is preferable in that the peeling property after the heat treatment is good. Further, as described later, when the thin glass substrate is laminated on the polyoxyxene resin layer, the polyoxyxylene resin layer is more firmly fixed by the fixing effect and the surface of the supporting glass substrate. (Application of Glass-Based Sealing Material) In the first manufacturing method, the glass-based sealing material is applied to the outer side of the peripheral portion of the resin layer after formation or formation of the resin layer, and is manufactured in the second and third manufactures 151,653. Doc. 29-201206698 In the method, the peripheral portion (the position on the outer side of the peripheral portion of the resin layer) applied to the first surface of the supporting glass substrate before the formation of the resin layer is used in the fourth manufacturing method. After the resin layer is in close contact with the second main surface of the thin glass substrate, it is applied to the outer side of the peripheral portion of the resin layer. The method of applying the glass-based sealing material may be a method of moving the dispenser (liquid quantitative discharge device) in a form of being placed outside the peripheral portion of the resin layer, and the resin is added in the form of a dispenser to which the position is fixed. The method of moving the outer side of the peripheral portion of the layer, the screen printing by the screen corresponding to the shape of the outer side of the peripheral portion of the resin layer, is the first main method for supporting the glass substrate. In the fourth manufacturing method, 'the method of moving the dispenser to the outside of the peripheral portion of the resin layer or the outside of the peripheral portion of the resin layer in the form of a dispenser to which the position is fixed is In the case of the glass-based sealing material, the baking of the glass-based sealing material is specifically performed, for example, firing by a heating furnace, firing by laser irradiation, or the like. . At this time, since the melting temperature of the glass-based sealing material is high, the deterioration of the resin layer occurs when the entire layer is formed at a high temperature, and is a property of &lt; In the first method of forming a resin layer before firing of the glass-based sealing material, the firing by laser irradiation is selected. This is because if the laser-based sealing material is locally heated, the glass-based sealing material can be selected by laser irradiation, and the glass-based sealing material can be fired by the laser irradiation. In the stage of I5l653.doc 201206698 of the firing of the material, no resin layer is formed, so that it is possible to heat the entire heat of the broken layer by heating in a heating furnace. As the laser light source which can be used for laser irradiation, for example, a region in which the vibration wavelength region is in the range of 300 nm to 1500 nm can be cited. In this case, the laser wavelength may be the wavelength of the ultraviolet region K illuminating region and the infrared region # domain. Argon ions, strontium ions, strontium-strontium, strontium-gold, ruby, glass, YAC^YtUium Aluminum 1 w, sapphire, pigment, nitrogen, metal vapor, excimer (eg, h, a, KrF, ArF, etc.), Various lasers, such as free electrons and semiconductors, are used for the purpose of firing the glass-based sealing material of the present invention. It is preferable to use a semiconductor laser having an emission wavelength region in the vicinity of the near-infrared region. As long as the output of the laser can burn the glass of the invention, if the output of the laser is small, the laser can be used to directly use the self-vibrating i to emit the m. (4) The laser is used to gather the laser by the lens. Light increases the light intensity. For example, a range of 2 to 15 〇 W, and a better one... a round of lasers is preferably a range of 5 to 100 W. If the output of the laser is less than 2 W, the glass-based sealing material cannot be melted, and after 15 〇 W', the thin-plate glass substrate or the supporting surface substrate becomes cracked or cracked. (Intimate) The thin glass substrate is laminated with the glass substrate on which the resin layer is fixed on the first main surface. The peeling of the resin layer is performed. The J-exclusive surface is in close contact with the first main surface of the thin glass substrate. 151653.doc •31- 201206698 The surface is preferably the force caused by the ~ thin glass substrate! The peeling property of the main surface and the resin layer is combined by the close contact force of the solid particles between the relatively close solid molecules. The glass substrate method of the glass substrate in which the thin-plate glass substrate and the resin layer are fixed to the first main surface is not particularly limited. For example, a known method can be used to carry out the material. Specific examples include the peelability of the resin layer in a normal pressure environment. After the surface of the thin glass substrate is overlapped, the resin layer is pressed against the thin glass substrate by light or pressing. By peeling off the peeling surface of the resin layer and the second main surface of the thin glass substrate by pressure bonding using a roll or pressing, it is preferable to peel the surface of the resin layer by pressure bonding using a roll or press. The first with a thin glass substrate! It is preferable that the t-bubble is mixed between the main faces and is easily removed. If the pressure is adhered by a vacuum lamination method or a vacuum pressing method, the suppression of the mixing of the bubbles or the securing of the good adhesion is further ensured. By crimping under vacuum, even when there are few bubbles remaining, there is an advantage that the bubble does not grow by heating, and it is difficult to cause deformation defects of the thin glass substrate. When the thin glass substrate is laminated with the supporting glass substrate having the resin layer fixed to the second major surface, it is preferable to "cleanly wash the surface of the first main surface of the thin glass substrate" in an environment having a high degree of cleanliness. That is, it is easy to mix foreign matter between the peeling surface of the resin layer and the first main surface of the thin glass substrate, and the resin layer is deformed, so that the flatness of the second main surface of the thin glass substrate is not affected, but the cleanliness is higher. The higher the flatness, the better, so it is preferred. &lt;Manufacturing Method of Panel for Display Device with Support&gt; The method for manufacturing a panel for a display device with a support according to the present invention includes 151653.doc -32 - 201206698 A thin plate glass substrate in the laminate of the present invention Step of forming the display member in the second main surface. Specifically, for example, the member for the display device is formed on the second main surface of the thin glass substrate in the laminated body of the present invention produced as described above. The member for the display device is not particularly limited, and examples thereof include an array of lcd, a transparent filter of a color filter or a ruthenium LED, a hole>main entrance layer, a hole transport layer, a light-emitting layer, and an electron transport layer. Wait. The method of forming the member for the display device is not particularly limited, and may be the same as the previously known method. For example, in the case of manufacturing a TFT_LCD (Thin Film Dystrist® Uquid Crystal Display) as a display device, the steps may be the same as the steps of forming an array on a previously known glass substrate. In the step of color filter, the step of bonding the glass substrate on which the array is formed and the glass substrate on which the color filter is formed (array color filter bonding step) or the like is performed. More specifically, the treatment carried out by these steps is exemplified by pure water washing, drying, film formation, corrosion coating, exposure, development, etching, and resist removal. Further, as a step performed after the step of performing the array and the color filter bonding step, a step of sealing the injection port performed after the liquid crystal injection step and the execution of the process may be mentioned. . Further, for example, in the case of manufacturing an OLED as a display device, the step of forming an organic structure on the second main surface of the thin glass substrate includes a step of forming a transparent electrode, an evaporation hole injection layer, and electricity The steps of the hole transfer layer, the light-emitting layer, the electron transport layer, and the like, and the sealing steps are various steps 151653.doc -33·201206698. Specific examples of the treatment carried out in the above steps include a film forming treatment, a vapor deposition treatment, and a subsequent treatment of a sealing plate. <Manufacturing Method of Panel for Display Device> The method for manufacturing a panel for a display device according to the present invention includes peeling off a thin glass substrate and a supporting glass substrate in a panel for a display device with a support obtained by the above-described manufacturing method The stripping step. The method of peeling off the thin glass substrate and the supporting glass substrate is not particularly limited, and specifically, for example, a sharp tool is inserted into the interface between the thin glass substrate and the resin layer, and the outer frame layer is physically destroyed and then subjected to A method of peeling off a mixed fluid of water and compressed air at the interface between the thin glass substrate and the resin layer, and the like. Preferably, the display device panel with the support is placed on the platen so that the supporting glass substrate is on the upper side and the thin glass substrate is on the lower side, and the thin glass substrate is vacuum-adsorbed on the platen (in the two-layer layer) The case of supporting the glass substrate is sequentially performed). In this state, the tool is invaded into the interface between the thin glass substrate and the resin layer. Next, the support glass substrate is adsorbed by a plurality of true second adsorption pads, and the vacuum adsorption pad is sequentially raised from the vicinity of the insertion tool. In this way, an air layer is formed at the interface between the resin layer and the thin glass substrate, and the air layer spreads over the entire surface of the interface, and the supporting glass substrate to which the resin layer is fixed can be easily peeled off (for the display device panel with the support attached thereto) When the two area layers have a supporting glass substrate, the above-mentioned peeling step is repeated "on the surface." By using such a method, the support glass substrate to which the resin layer is fixed in the panel for a display device with a support of the present invention and the thin glass substrate are stripped 151653.doc-34-201206698, the display of the present invention can be obtained. In the case of the case, the processing is further performed, and the panel for the device is used. Example (Adjustment of Glass Sealing Material A). First, 'Preparation: has (5): 55.7 mass%, Sn〇2: Μ mass %, P2〇5: 32.5 mass%, Zno: 4.08 mass%, and Al2〇3. a 2% by mass composition of an average particle size of 15 _ tin tin-based glass powder (softening point: 36 (TC), as a low-expansion filler disc acid (^·〇) 2ρ2〇7) powder, with Fe2 〇3_Cr2〇3 grabs the c. The phosphoric acid wrong powder as the low-expansion filler has a particle size distribution of 3 3 _, D50 of 3.8 μηι, D9〇 of 4·6 μηι, and 〇 6.5 μηι, and a specific surface area of L8 m 2 /g. The laser absorbing material has D (7) of 〇4 pm, and 5 〇 of 0.9 μηι, 〇9. It is a particle size distribution of 1 _5 μηι, Dmax of 2.8 μηι, and a specific surface area of 5.0 m 2 /g. 67.2% by volume of the above tin-phosphate glass powder and 28.4% by volume of zirconium phosphate powder and 44% by volume of the laser absorbing material were mixed to prepare a glass-based sealing material (thermal expansion coefficient αι (50 to 25 〇t): 71χ1〇 ·7/χ:). The total content of the zirconium phosphate powder and the laser absorbing material was 32 8 by volume. The above-mentioned glass-based sealing material 83 mass / 〇 was mixed with the vehicle 17% by mass to prepare a sealing material slurry. In the vehicle, nitrocellulose (4% by mass) as a binder component was dissolved in a solvent (96% by mass) containing butyl carbitol acetate. (Adjustment of glass-based sealing material B) First, 'preparation: having Bi2〇3: 83 2 mass. /〇, B2〇3 : 5.6 mass ' ZnO : 10.7 mass %, ai 2 〇 3 : 〇 · 5 mass % of the composition 'average grain 151653.doc • 35 · 201206698 diameter of 1 · 0 μηι 铋 玻璃 glass powder (softening Point: 41 〇. 〇, a cordierite powder as a low-expansion filler material, a laser absorbing material having a composition of Fe2〇3_Cr2〇3_Mn〇_c〇2〇3. The cordierite powder as a low-expansion filler has a shape of 1.3 μm. 〇5〇 is 2.0 μηι, d9〇 is 3·0 μηι, Dmax is 4_6 μηι particle size distribution, and the specific surface area is 5.8 m2/g. Further, the laser absorbing material has Di〇 of 0.4 μηι and D5 ❶ of 0.9 μπι 〇9 is a particle size distribution of i 5 μηι, Dmax of 2 8 (4), and a specific surface area of 5.0 m 2 /g. 72.7% by volume of the above-mentioned silk-based glass powder and 22.0% by volume of cordierite powder and laser absorbing material 5.3 The glass-based sealing material was prepared by mixing 5% by volume (thermal expansion coefficient 〇^(5〇~250. 〇: 73&gt;&lt;1〇_7/. 总. The total content of cordierite powder and laser absorbing material was 27.3 vol. %. The above-mentioned glass-based sealing material 80 is mixed with the carrier 20% I% to prepare a sealing material. The vehicle was used as a binder component of ethylcellulose (25 mass of the solvent dissolved in terpineol (97.5 mass%). (Example 1) First, 'pair 720 mm, width 600 mm , plate thickness 0.4 mm, linear expansion coefficient 38X 1 (T7/°C supporting glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) is cleaned with pure water and uv cleaned to clean the surface. Secondly, 'screen printing' The glass-based sealing material A is printed on the peripheral portion of the first main surface of the supporting glass substrate to have a frame shape having a width of 〇6 mm. Next, the supporting glass substrate is heated in the atmosphere at 43 〇t for 1 minute. The glass-based sealing material A is pre-fired. The thickness of the outer frame layer is 2 〇μπι. The cross-sectional area S at this time is 1χ10_2 mm2 «=> Next, the solvent-free additional reaction type release paper is made of polyfluorene (shin_Etsu) 151653.doc •36· 201206698

KNS-320A (viscosity: 〇·4〇Pa.s) manufactured by Silicones Co., Ltd.) a mixture of 2 parts by mass of a platinum-based catalyst (CATpL 56 manufactured by Shin-Etsu Silicones Co., Ltd.) on a supporting glass substrate The i-th main surface was printed and pre-fired into the inner region of the outer frame layer, and applied by a screen printing machine so as to be in contact with the inner side of the outer frame layer (coating amount: 30 g/m2). Next, the glass substrate of the support was heated at 180 Torr for 3 sec. in the atmosphere to cure the solvent-free additional reactive release paper with a mixture of polyfluorene oxide and a platinum-based catalyst to obtain a polyoxyxylene resin layer having a thickness of 20 μm. Next, the first main surface of the 720 mm, the horizontal width of 600 mm, the thickness of the plate is 33 mm, and the linear expansion coefficient of 38xl (the T7/°C thin glass substrate (AN 1 00 by Asahi Glass Co., Ltd.) The surface of the side of the epoxy resin layer that is in contact with the peelable surface is cleaned by pure water cleaning and UV cleaning. If it is a thin glass substrate having a thickness of 3 mm, the same operation as before can be performed as a glass substrate. Therefore, it is preferable to use the existing production equipment. After cleaning the thin glass substrate, the supporting glass substrate is supported such that the peeling surface of the polyoxynated resin layer supporting the glass substrate overlaps with the first main surface of the thin glass substrate. The glass laminated body is obtained by bonding to a thin glass substrate at room temperature under vacuum pressing. Then, the glass-based sealing material A which is pre-fired on the first main surface of the supporting glass substrate is supported by the supporting glass substrate. 10 mm/sec scanning speed Irradiation light (semiconductor laser) with wavelength = 940 nm, output = 60 W, spot diameter = 1.6 mm, fired into a glass-based sealing material, and cooled and solidified, thereby taking the thin plate glass The outer frame layer is formed by sealing the substrate and the supporting glass substrate. The processing temperature during laser irradiation is measured by a radiation thermometer, and is 151653.doc -37·201206698 700-800 ° C. At this time, in the polyoxyn resin layer In this case, the "glass laminated body A" corresponding to the aspect of the laminated body of the present invention is produced. Next, the glass laminated body A is subjected to 450 ° C, 1 hour, and atmospheric conditions. The heat treatment is carried out. Further, for the separately prepared glass laminate A, the temperature is raised from room temperature to 45 〇t&gt;c under reduced pressure (l.〇xl〇-5 Pa), and no gas is generated from the glass laminate A. Then, the glass laminate A was subjected to the following peeling test to evaluate the peeling property. <Peel test> The glass laminate A was placed on the platen so that the supporting glass substrate was on the upper side and the thin glass substrate was on the lower side. The second main surface of the thin glass substrate is vacuum-adsorbed to the platen. Next, the second main surface of the thin glass substrate of the glass laminate is vacuum-adsorbed to the platen by the CCD (Charge_Cc)

Device, charge coupled device) The camera recognizes the position of the outer frame formed near the interface between the thin glass substrate of the octagonal portion of the glass laminate and the polyoxyxene resin layer. Insert a sharp stainless steel tool into the position of the identified outer frame and use this tool to break the outer frame. Thereafter, the cutter is inserted into the interface between the polyoxyxene resin layer and the thin glass substrate, and the gap between the glass substrate and the polyoxymethylene resin layer which can be inserted is the holding portion, and the glass substrate of the branch is pulled vertically upward. Stretch. When the peeling test is performed on the glass laminate A, an empty fluorine layer is formed by inserting a corner of the non-recorded steel cutter from the interface between the layer of the polysiloxane resin 151653.doc •38·201206698 and the thin glass substrate. The mysterious air layer is extended to the entire area of the interface, and the supporting glass substrate to which the polyoxyxylene resin layer is fixed on the first main surface can be easily peeled off from the thin glass substrate. At the time of peeling, the frame layer remaining outside the peripheral portion of the supporting glass substrate was peeled off in the same manner as the thin glass substrate and the supporting glass substrate, and was self-destructed. Further, the residue adhering to the outer layer of the first main surface of the thin glass substrate after peeling can be easily removed by washing with cerium oxide. Further, the polycrystalline oxide layer of the glass laminate A was sound, and its end portion was not oxidized. (Example 2) The same procedure as in Example 1 was carried out except that the size of the thin glass substrate (AN 100 manufactured by Asahi Glass Co., Ltd.) in Example 1 was increased to 722 mm in length and 602 mm in width. Glass laminate. Thus, the "glass laminated body B" of the aspect 3 of the laminated body of the present invention having a size larger than that of the supporting glass substrate is produced. This was heat-treated for the glass laminate B' at 450 ° C for 1 hour in the atmosphere. Further, the glass laminate B prepared separately was heated from room temperature to 45 Torr under reduced pressure (l.Oxl 0.5 Pa), and no gas was generated from the glass laminate B. In the above-described peeling test of the glass laminate B, an air layer is formed from the corner portion at the interface between the polyxylene resin layer and the thin glass substrate, and the air layer spreads over the entire area of the interface, and can be easily put into the first The supporting glass substrate on which the polyacrylic resin layer is fixed on the main surface is peeled off from the thin glass substrate. Further, after the peeling, it adhered to the outer layer of the first main surface of the thin glass substrate. 151653.doc •39·201206698 The residue can be easily removed by washing with cerium oxide. Further, the polysiloxane resin layer of the glass laminate B is sound, and its end portion is not oxidized. (Example 3) As a supporting glass substrate, pure water cleaning was performed on a glass substrate (AN100 manufactured by Asahi Glass Co., Ltd.) having a vertical expansion of 720 mm, a width of 600 mm, a thickness of 〇6 mm, and a linear expansion coefficient of 38×1 (T7/°C) UV cleaning to clean the surface. Secondly, as a resin for forming a resin layer, it is used in a linear polyorganismite having a vinyl group at both ends (trade name manufactured by Arakawa Chemical Industries Co., Ltd.) 85 00") and methyl hydrogenated polyoxyalkylene (product name "1203 1" manufactured by Arakawa Chemical Industries Co., Ltd.) having a hydrogenstone base in the molecule. Next, it is combined with | self-catalyst (product name "CAT12070" manufactured by Arakawa Chemical Industry Co., Ltd.) was mixed, and further diluted with pentylene to prepare a mixture of 50% of the solid content, and the length of the 丨6 瓜6 claws and the width of 596 mm were on the supporting glass substrate. The first main surface was coated with a die coating (coating amount: 40 g/m2), and heat-hardened at 250 ° C for 3 minutes in the atmosphere to form a polysulfide oxide layer having a thickness of 20 μm. The resin layer is spaced from the supporting glass substrate 1 2 mm is formed on the inner side of each side of the main surface. Here, the direct-bonded polyorgano-oxygen and methyl hydrogenated are adjusted in such a manner that the molar ratio of hydroquinone to vinyl is 丨/1. The blending ratio of the polyoxan oxime is 5 parts by mass relative to 100 parts by mass of the total of the linear polyorganosiloxane and the methyl phthalocyanine. Next, as a thin glass substrate , the main surface of the glass substrate (AN100 manufactured by Asahi Glass Co., Ltd. 151653.doc •40-201206698) will be used for the 718 mm, 598 mm, 0.1 mm, and linear expansion coefficient of 38χ1〇·7/Χ: Then, the surface on the side in contact with the polyoxyxide resin layer is cleaned by pure water cleaning and uv cleaning. Next, the surface of the thin glass substrate is each of the four sides of the peelable surface of the self-polymerized silicone resin layer. The peeling surface layer of the polyoxynoxy resin layer is extended to the outside by a thickness of 丨mm, and vacuum-pressed and bonded at room temperature to obtain a glass laminate. Then, the inner diameter of the nozzle tip is 5 〇μΓη2 An injecting device to block outside air with the polyoxyalkylene resin layer In this manner, the glass-based sealing material B is applied on the outer side of the peripheral portion of the polyoxynoxy resin layer at a coating speed of 1 〇mm/sec. Next, the glass laminate is heated and dried at 120 ° C for 1 minute. Thereafter, a laser beam (semiconductor laser) having a wavelength of 940 nm, an output of 6 to 1 〇w, and a spot diameter of 16 mm was irradiated toward the glass-based sealing material at a scanning speed of 1 mm/sec via a supporting glass substrate. The glass-based sealing material is fired and rapidly cooled and solidified, whereby the outer frame layer is formed by sealing the thin glass substrate and the supporting glass substrate. The processing temperature at the time of laser irradiation is measured by a radiation thermometer, and is 600 to 800. °C. Further, the sectional area 8 at this time is 6 &gt; 1 〇 4 claws 2. Thus, the "glass laminated body C" corresponding to the aspect 2 of the laminated body of the present invention is produced. a Next, the glass laminate C is heat-treated under conditions of 450 t, hour, and atmosphere. In addition, the glass laminate C prepared separately is heated from room temperature to 45 (rc under reduced pressure (45 x rc), and gas is not generated from the glass laminate c. After the peeling test, the corner portion of the stainless steel tool is inserted from the interface between the polyoxynated resin layer and the thin glass substrate. 151653.doc •41 - 201206698 An air layer is formed. The air layer is expanded and can easily be placed in the first main The supporting glass substrate on which the polysecond oxygen resin layer is fixed on the surface is peeled off from the thin glass substrate. The 'residue of the frame layer attached to the first main surface of the thin glass substrate after peeling' can be easily washed by washing with cerium oxide. In addition, the polysiloxane resin layer of the glass laminate c is sound, and its end portion is not oxidized. (Example 4) The size and thickness of the supporting glass substrate and the thin glass substrate to be used are changed as follows. 'The glass laminate before the formation of the outer frame layer was produced in the same manner as in Example 3. The support glass substrate used was 74 mm in length, 620 mm in width, 5 mm in plate thickness, and 38 % in linear expansion coefficient (Γ7/^ (Asahi Glass) share制造100 manufactured by the company) The slab glass substrate is 740 mm in length, 620 mm in width, 板.2 mm in plate thickness, and linear expansion coefficient is 38χ1〇-7Γ (: (AN100 manufactured by Asahi Glass Co., Ltd.) 〇 Next, it will be obtained. Each side of the glass laminate is cut by a width of 1 mm from the outer edge. The method of cutting is performed by using a wheel to cut a tangent to the same portion of the second main surface of the supporting glass substrate of the thin glass substrate, and to laminate the glass. The outer surface of the body is subjected to a tensile force and cut off. Then, the cut surface of the glass laminate is chamfered into an R shape (arc shape) using a grindstone, and the surface of the glass laminate is cleaned using a lotion. Thereafter, the exposed portion of the resin layer on the peripheral portion of the end face of the glass laminate was sealed by a glass-based sealing material in the same manner as in Example 3. At this time, the width of the outer frame was set to 〇05. The "glass laminated body D" corresponding to the aspect 5 of the laminated body of the invention of 151653.doc 42-201206698 is produced. Next, the glass laminated body D' is heat-treated at 45 (rc, i hour, atmospheric conditions). Again, for Further, the prepared glass laminate D is heated from room temperature to 45 〇t under reduced pressure (1.0×10 −5 Pa), and does not generate gas from the glass laminate D. For the glass laminate D, when the above peeling test is performed, An air layer is formed in the corner portion of the stainless steel cutter inserted from the interface between the polyoxyxene resin layer and the thin glass substrate, and the air layer is extended to the entire area of the interface, and the polyoxyn resin can be easily fixed to the first main surface. The support glass substrate of the layer is peeled off from the thin glass substrate, and the residue adhered to the outer layer of the first main surface of the thin glass substrate after peeling can be easily removed by washing with cerium oxide. Further, the polysiloxane resin layer of the glass laminate D is sound, and its end portion is not oxidized. (Example 5) In this example, the glass laminate c obtained in Example 3 was used to manufacture an LCD. Two glass laminates C (C1 &amp; C2) were prepared, and the glass laminate 〇 1 was supplied to the array forming step to form an array on the second main surface of the thin glass substrate. The remaining glass laminate C2 is supplied to the color filter forming step to form a color filter on the second main surface of the thin glass substrate. The array forming surface of the glass laminate is opposed to the color filter forming surface of the glass laminate C2, and the glass laminate C1 and the glass laminate C2 are bonded to each other to obtain a blank unit. Then, the second main surface of the supporting glass substrate of the glass laminate C1 is vacuum-adsorbed to the platen, and is inserted into the corner of the frame layer outside the glass laminate C2. 151653.doc -43-201206698 (M mm stainless steel) After the knives are physically broken, the knives outside the corner portion are inserted into the interface between the thin glass substrate and the resin layer, and the groove is peeled off from the peeling surface of the first main surface of the thin glass substrate and the resin layer. Next, the second main surface of the supporting glass substrate of the glass laminate C2 is adsorbed by 24 vacuum adsorption pads, and is sequentially raised from the adsorption pad which is closer to the corner portion of the glass laminate. As a result, only the glass laminate is left on the platen (the blank unit with the lcd supporting the glass substrate is attached to the platen, and the support glass substrate to which the glass laminate C2 is fixed to the main surface with the resin layer can be peeled off) Next, the second main surface of the thin glass substrate on which the color filter is formed on the main surface of the second surface is vacuum-adsorbed to the platen, and the thickness is inserted toward the corner portion of the outer layer of the glass laminate. Stainless steel cutter In the same manner as before, first, the frame layer outside the corner portion is physically broken, and then the notch of the peeling surface of the first main surface of the thin glass substrate and the resin layer is applied. Next, 24 vacuums are used. The adsorption pad adsorbs the second main surface of the supporting glass substrate of the glass laminate C1, and sequentially rises from the adsorption pad of the glass laminate C1 which is closer to the corner portion. As a result, on the platen Only the blank unit of the LCD remains, and the supporting glass substrate to which the resin layer is fixed on the main surface can be peeled off. Thus, a blank unit of the LCD composed of a thin glass substrate having a substrate thickness of 〇丨mm is obtained. Then the thin glass is cut. After the substrate is divided into 168 blank cells of the vertical 51 claws and the horizontal direction, the liquid crystal injection step and the sealing step of the injection port are performed on the blank cell to form a liquid crystal cell. The step of attaching the polarizing plate to the formed liquid crystal cell is performed. 'The module forming step is then carried out to obtain Lcd. 151653.doc • 44 - 201206698 There is no problem in the LCD characteristics thus obtained. (Embodiment 6) In this example, the use of Example 1 is obtained. The glass laminate A is obtained to manufacture an LCD. Two glass laminates A1 and A2 are prepared, and the glass laminate A1 is supplied to the array forming step to form an array on the second main surface of the thin glass substrate. The remaining glass laminate A2 is supplied to In the color filter forming step, a color filter is formed on the second main surface of the thin glass substrate. The array forming surface of the glass laminate A1 faces the color filter forming surface of the glass laminate A2, and the glass laminate is formed. After bonding A1 to the glass laminate A2, the supporting glass substrate of each of the glass laminates A1 and A2 was peeled off in the same manner as in Example 5 to obtain a blank unit of the LCD. The first major surface of the thin glass substrate after peeling was obtained. No scars were found that would cause a drop in strength. Then, the thickness of the thin glass substrate of the blank unit of each LCD was thinned by a chemical etching process from 0.3 mm to 〇1.5 mm. The first main surface of the thin glass substrate after the chemical axial processing was not found to be an optical problem. Thereafter, the thin glass substrate is cut and divided into vertical 丨〇1〇1&gt;&lt;68 blank cells of the horizontal 38 claws, and then the liquid crystal injection step and the sealing step of the injection port are performed on the blank unit to form a liquid crystal. unit. A step of attaching a polarizing plate to the formed liquid crystal cell is carried out, and then a module forming step is performed to obtain an LCD. There is no problem with the LCD characteristics thus obtained. (Example 7) In Example 7, an OLED was produced using the glass laminate d obtained in Example 4 to make 151653.doc -45·201206698. Providing a step of forming a transparent electrode, a step of forming an auxiliary electrode, a vapor deposition hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and the like, and providing the sealing step to the glass laminate D The second main surface of the thin glass substrate forms an organic EL structure. Next, the supporting glass substrate of the glass laminate D was peeled off from the thin glass substrate by the same method as in the fifth embodiment. No damage was observed on the first main surface of the thin glass substrate after peeling, which caused a decrease in strength. Then, the thin glass substrate was cut by a laser cutting or cutting-breaking method and divided into 28 8 units of 41 mm in length and 30 mm in width, and then a module forming step was carried out to fabricate an OLED. There was no problem in the OLED characteristics thus obtained. (Comparative Example 1) A glass laminate having the same structure except that the outer frame layer was not formed was prepared, and the same test as in the first example was carried out. In the glass laminate X of Comparative Example i, no bubbles were generated, and the peelable surface of the polyoxyxene resin layer was in close contact with the first main surface of the thin glass substrate, and there was no convex defect. The smoothness was also good. The layered body X was heat-treated at 45 ° C for 1 hour in the atmosphere. As a result, the poly(tetra) resin layer was oxidized and whitened by about 5 mm from the end surface thereof. If it turns white as such, the Shixia soil powder will scatter from the glass laminate body, which is the line of the pollution display device manufacturing line. In addition, when the glass laminate is heated under reduced pressure (1 〇χ 1 〇 · 5 pa) from room temperature to 45 ° C, a decomposition product of the polysiloxane resin layer is observed from more than 43 〇t. .doc -46 - 201206698. The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various changes or modifications may be added without departing from the spirit and scope of the invention. The present application is based on Japanese Patent Application No. 2009-24 13 84 filed on Oct. 20, 2009, the content of which is incorporated herein by reference. Industrial Applicability According to the present invention, it is possible to provide a glass laminate which is hard to be oxidized even in a high-temperature heat treatment. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic front view showing an embodiment (Configuration Example 1) of a glass laminate according to the present invention; and Fig. 2 is a partial cross-sectional view showing a configuration example taken along line A-A' of Fig. 1. 3 is a partial cross-sectional view showing a sealing portion of a modified example; FIG. 4 is a partial cross-sectional view showing a sealing portion of a second modification; FIG. 5 is a partial cross-sectional view showing a sealing portion of a third modification; Figure 7 is a partial cross-sectional view of a sealing portion of the present invention; Figure 7 is a flow chart of a first manufacturing method of the present invention; a flow chart of the drawing method; a flow chart of the method; and 8 is a second manufacturing method of the present invention Flow chart of the third manufacturing method, laminated thin-plate glass substrate, Fig. 10 is the fourth manufacturer of the present invention [Description of main components] 10, 20, 30, 40, 5〇12, 22, 32, 42 and 52 151653.doc •47· 201206698

14 , 24 , 34 , 44 , 54 16 , 26 , 36 , 46 , 56 18 , 28 , 38 , 48 , 58 S S101 to S104 , S201 to S204 , S301-S304 &gt; S401-S404 W Resin layer outer frame layer The cross-sectional area of the outer frame layer supporting the glass substrate is the width of the outer side of the peripheral portion of the resin layer 151653.doc •48

Claims (1)

201206698 VII. Patent application scope: 1. A glass laminate comprising: a thin glass substrate having a first main surface and a second main surface; and a supporting glass substrate having a first surface and a second main surface The first main surface and the first thin glass substrate are the first! The main surface is disposed opposite to each other; the resin layer is formed between the thin glass substrate and the selected glass substrate and is fixed to the second main surface of the supporting glass substrate, and has a surface opposite to the thin glass substrate The peeling property is in close contact with the first main surface; and the outer frame layer contains a glass-based sealing material, and is formed by baking the outer side of the peripheral edge portion of the resin layer. 2. The glass laminate according to claim 1, wherein the outer frame layer is formed by laser irradiation or firing. 3. The glass laminate according to claim 2, wherein the glass-based sealing material has a melting temperature of 4 ° C or more and 75 ° C or less. 4. The glass laminate according to any one of claims 1 to 3, wherein the outer frame layer has a sectional area S of 3 χΗΓ 6 mm 2 S SS 5 mm 2 . 5. The glass laminate according to any one of claims 1 to 4, wherein the resin layer comprises a polymer selected from the group consisting of acrylic resins, polyolefin resins, polyurethane resins, and polyoxyphthalic resins. At least one resin in the group. 6. The glass laminate according to any one of claims 1 to 5, wherein the thickness of the thin glass substrate is 0.3 mm or less, and the thickness of the glass substrate of the support glass 151653.doc 201206698 is 0.4 mm or more. A panel for a display device with a support body, comprising: the glass laminate according to any one of claims 1 to 6; and a member for a display device, which is formed on the glass laminate The second main surface of the thin glass substrate. A panel for a display device which is obtained by a panel for a display device having a support attached to claim 7. A display device comprising a panel for a display device as claimed in claim 8. A method for producing a glass laminate, which is the method for producing a glass laminate according to any one of claims 6 to 6, and comprising the steps of: forming the above-mentioned first main surface of the supporting glass substrate a resin layer, wherein the resin layer is fixed to the first main surface; and the glass-based sealing material is applied to the outer side of the peripheral portion of the resin layer fixed to the first main surface of the supporting glass substrate; The peelable surface of the resin layer on the first main surface of the supporting glass substrate is in close contact with the i-th main surface of the thin glass substrate, and the glass-based sealing material applied to the outer side of the peripheral portion of the resin layer The outer frame layer is formed by firing. A method for producing a glass laminate, which is the method for producing a glass laminate according to any one of the above items, and comprising the steps of: the periphery of the first main surface of the glass substrate of the above-mentioned branch Coating the glass-based sealing material; and coating the glass-based sealing material on the peripheral edge portion of the first main surface of the arranging glass substrate; 151653.doc 201206698, forming the outer frame layer; Forming the resin layer in an inner region of the outer frame layer formed on the first main surface of the supporting glass, fixing the resin layer on the first main surface; and - fixing the first to the supporting glass substrate The peeling surface of the above resin layer on the main surface is in close contact with the second main surface of the thin glass substrate. A method for producing a glass laminate, which is the method for producing a glass laminate according to any one of the preceding claims, comprising the steps of: the peripheral portion of the first main surface of the supporting glass substrate Coating the glass-based sealing material; forming the resin layer on an inner region of the glass-based sealing material applied to the first main surface of the supporting glass substrate, and fixing the resin layer to the first main surface And baking the glass-based sealing material coated on the first main surface of the supporting glass substrate to form the outer frame layer; and fixing the resin layer on the first main surface of the supporting glass substrate The peelable surface is in close contact with the first major surface of the thin glass substrate. The method for producing a glass laminate according to any one of claims 6 to 6, further comprising the steps of: forming the above-mentioned first main surface of the supporting glass substrate a resin layer, wherein the resin layer is fixed to the first main surface; a peelable surface of the resin layer is in close contact with the first main surface of the thin glass substrate; and the glass system is coated on the outer side of the peripheral portion of the resin layer a sealing material 151653.doc 201206698; and the above-mentioned outer frame layer is formed by firing the above-mentioned breakage sealing material applied to the outer side of the peripheral portion of the resin layer. The method for producing a glass laminate according to claim 13, wherein the outer frame layer is irradiated with the glass-based sealing material by laser irradiation. And a manufacturing method of a panel for a display device with a support, which comprises: a method for producing a glass laminate according to any one of claims 10 to 14, and a laminate for a glass laminate The second main surface of the thin glass substrate further includes a step of forming a member for a display device. 16. A method of manufacturing a panel for a display device, comprising: a method of manufacturing a panel for a display device with a support attached to claim 15; and the above-described thin-plate glass substrate for a panel for a display device with a support and the above A peeling step of supporting the peeling of the glass substrate. The method for manufacturing a panel for a display device according to the item 1, wherein the peeling step is a step of peeling off the thin glass substrate and the supporting glass substrate after at least a part of the outer frame layer is physically broken. . I51653.doc